| Patent | Date |
|---|
Power semiconductor module device
Grant 11,152,286 - Tatsumi October 19, 2 | 2021-10-19 |
Semiconductor Element Bonding Structure, Method For Producing Semiconductor Element Bonding Structure, And Electrically Conductive Bonding Agent
App 20210225794 - Tatsumi; Kohei ; et al. | 2021-07-22 |
Electrode connection structure, lead frame, and method for forming electrode connection structure
Grant 10,903,146 - Tatsumi , et al. January 26, 2 | 2021-01-26 |
Semiconductor Device
App 20190229103 - TATSUMI; Kohei ; et al. | 2019-07-25 |
Power Semiconductor Module Device And Power Semiconductor Module Manufacturing Method
App 20190198428 - Tatsumi; Kohei | 2019-06-27 |
Electrode Connection Structure, Lead Frame, And Method For Forming Electrode Connection Structure
App 20190103341 - Tatsumi; Kohei ; et al. | 2019-04-04 |
Metal joining structure using metal nanoparticles and metal joining method and metal joining material
Grant 9,960,140 - Tatsumi , et al. May 1, 2 | 2018-05-01 |
Electrode connection structure and electrode connection method
Grant 9,601,448 - Tatsumi March 21, 2 | 2017-03-21 |
Metal Joining Structure Using Metal Nanoparticles And Metal Joining Method And Metal Joining Material
App 20160240505 - TATSUMI; Kohei ; et al. | 2016-08-18 |
Electrode Connection Structure And Electrode Connection Method
App 20160225730 - Tatsumi; Kohei | 2016-08-04 |
Power semiconductor device, method of manufacturing the device and bonding wire
Grant 9,059,003 - Tatsumi , et al. June 16, 2 | 2015-06-16 |
Power Semiconductor Device, Method Of Manufacturing The Device And Bonding Wire
App 20140327018 - Tatsumi; Kohei ; et al. | 2014-11-06 |
Solder ball mounting method and apparatus
Grant 8,104,663 - Ishikawa , et al. January 31, 2 | 2012-01-31 |
Semiconductor mounting bonding wire
Grant 8,097,960 - Terashima , et al. January 17, 2 | 2012-01-17 |
Saw Wire And Method Of Manufacturing Saw Wire
App 20110308371 - Morita; Mitsuru ; et al. | 2011-12-22 |
SiC single-crystal substrate and method of producing SiC single-crystal substrate
Grant 8,044,408 - Fujimoto , et al. October 25, 2 | 2011-10-25 |
Bonding wire for semiconductor device and method for producing the same
Grant 7,969,021 - Uno , et al. June 28, 2 | 2011-06-28 |
Micro-ball Removal Method And Removal Device, And Micro-ball Collective Mounting Method And Collective Mounting Apparatus
App 20110107580 - Ishikawa; Shinji ; et al. | 2011-05-12 |
Sic Single-crystal Substrate And Method Of Producing Sic Single-crystal Substrate
App 20100295059 - FUJIMOTO; Tatsuo ; et al. | 2010-11-25 |
Solder Ball Mounting Method And Apparatus
App 20100127049 - Ishikawa; Shinji ; et al. | 2010-05-27 |
Semiconductor Mounting Bonding Wire
App 20090072399 - Terashima; Shinichi ; et al. | 2009-03-19 |
Gold bonding wires for semiconductor devices and method of producing the wires
Grant 7,390,370 - Uno , et al. June 24, 2 | 2008-06-24 |
Ball transferring method and apparatus
App 20080032495 - Shimokawa; Kenji ; et al. | 2008-02-07 |
Ball transferring method and apparatus
Grant 7,285,486 - Shimokawa , et al. October 23, 2 | 2007-10-23 |
Method for fabricating a semiconductor devices provided with low melting point metal bumps
Grant 7,045,389 - Tatsumi , et al. May 16, 2 | 2006-05-16 |
Semiconductor device provided with low melting point metal bumps
Grant 7,045,388 - Tatsumi , et al. May 16, 2 | 2006-05-16 |
Ball transferring method and apparatus
App 20050176176 - Shimokawa, Kenji ; et al. | 2005-08-11 |
Wafer-level package and method for production thereof
App 20050173809 - Yamamoto, Yukihiro ; et al. | 2005-08-11 |
Ball transferring method and apparatus
Grant 6,916,731 - Shimokawa , et al. July 12, 2 | 2005-07-12 |
Spherical semiconductor device and method for fabricating the same
Grant 6,909,182 - Tatsumi , et al. June 21, 2 | 2005-06-21 |
Method of partially plating substrate for electronic devices
Grant 6,884,708 - Tatsumi , et al. April 26, 2 | 2005-04-26 |
Gold alloy bonding wire for semiconductor device and process for producing the same
App 20050079347 - Uno, Tomohiro ; et al. | 2005-04-14 |
Spherical Semiconductor Device And Method For Fabricating The Same
App 20040061224 - Tatsumi, Kohei ; et al. | 2004-04-01 |
Bonding wire for semiconductor and method of manufacturing the bonding wire
App 20040014266 - Uno, Tomohiro ; et al. | 2004-01-22 |
Spherical semiconductor device and method for fabricating the same
App 20030020164 - Tatsumi, Kohei ; et al. | 2003-01-30 |
Ball transferring method and apparatus
App 20020137324 - Shimokawa, Kenji ; et al. | 2002-09-26 |
Spherical semiconductor device and method for fabricating the same
App 20020132462 - Tatsumi, Kohei ; et al. | 2002-09-19 |
Semiconductor device and method to produce the same
App 20020113322 - Terashima, Shinichi ; et al. | 2002-08-22 |
Semiconductor Device Provided With Low Melting Point Metal Bumps
App 20020036344 - TATSUMI, KOHEI ; et al. | 2002-03-28 |
Spherical Semiconductor Device And Method For Fabricating The Same
App 20020011665 - TATSUMI, KOHEI ; et al. | 2002-01-31 |
Method Of Partially Plating Substrate For Electronic Devices
App 20010012683 - TATSUMI, KOHEI ; et al. | 2001-08-09 |
Gold alloy thin wire for semiconductor devices
Grant 6,210,637 - Uno , et al. April 3, 2 | 2001-04-03 |
Process and apparatus for forming ball bumps
Grant 5,857,610 - Hoshiba , et al. January 12, 1 | 1999-01-12 |
Process and apparatus for forming ball bumps
Grant 5,687,901 - Hoshiba , et al. November 18, 1 | 1997-11-18 |
Insulating resin-coated bonding wire
Grant 5,639,558 - Tatsumi , et al. June 17, 1 | 1997-06-17 |
Bonding wire with heat and abrasion resistant coating layers
Grant 5,554,443 - Kondo , et al. September 10, 1 | 1996-09-10 |
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