Tateoka; Ayumu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tateoka; Ayumu.The latest application filed is for "production method for copper-clad laminate plate".

Company Profile

2.11.13

Tateoka; Ayumu - Ageo JP
Tateoka; Ayumu - Saitama JP
TATEOKA; Ayumu - Ageo-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Metal foil with releasing resin layer, and printed wiring board Grant 10,863,621 - Matsushima , et al. December 8, 2	2020-12-08
Copper clad laminate provided with protective layer and multilayered printed wiring board Grant 10,244,640 - Kuwako , et al.	2019-03-26
Production method for copper-clad laminate plate Grant 10,244,635 - Tateoka , et al.	2019-03-26
Production Method For Copper-clad Laminate Plate App 20180139848 - TATEOKA; Ayumu ; et al.	2018-05-17
Metal Foil With Releasing Resin Layer, And Printed Wiring Board App 20170071059 - MATSUSHIMA; Toshifumi ; et al.	2017-03-09
Manufacturing method of multilayer printed wiring board Grant 9,585,261 - Tateoka , et al. February 28, 2	2017-02-28
Copper Clad Laminate Provided With Protective Layer And Multilayered Printed Wiring Board App 20160360624 - KUWAKO; Fujio ; et al.	2016-12-08
Surface-treated copper foil Grant 9,138,964 - Obata , et al. September 22, 2	2015-09-22
Manufacturing method of multilayer printed wiring board Grant 9,066,459 - Tateoka , et al. June 23, 2	2015-06-23
Manufacturing Method Of Multilayer Printed Wiring Board And Multilayer Printed Wiring Board Obtained By The Manufacturing Method App 20140096381 - Tateoka; Ayumu ; et al.	2014-04-10
Manufacturing Method Of Multilayer Printed Wiring Board And Multilayer Printed Wiring Board Obtained By The Manufacturing Method App 20140054259 - Tateoka; Ayumu ; et al.	2014-02-27
Surface-treated Copper Foil App 20130302635 - Obata; Shinichi ; et al.	2013-11-14
Surface-treated Copper Foil App 20130295407 - Obata; Shinichi ; et al.	2013-11-07
Method of preparing electrolytic copper solution acidified with sulfuric acid, sulfuric-acid-acidified electrolytic copper solution prepared by the preparation method, and electrodeposited copper film Grant 8,419,920 - Tomonaga , et al. April 16, 2	2013-04-16
Method Of Preparing Electrolytic Copper Solution Acidified With Sulfuric Acid, Sulfuric-acid-acidified Electrolytic Copper Solution Prepared By The Preparation Method, And Electrodeposited Copper Film App 20100089758 - Tomonaga; Sakiko ; et al.	2010-04-15
Production Method Of Electro-deposited Copper Foil, Electro-deposited Copper Foil Obtained By The Production Method, Surface-treated Copper Foil Obtained By Using The Electro-deposited Copper Foil And Copper-clad Laminate Obtained By Using The Electro-deposited Copper Foil Or The Surface-treated Cop App 20090166213 - Dobashi; Makoto ; et al.	2009-07-02

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