Tatemichi; Mayuko
Patent Applications and Registrations
Patent applications and USPTO patent grants for Tatemichi; Mayuko.The latest application filed is for "fluororesin film".
- Tatemichi; Mayuko - Osaka JP
- TATEMICHI; Mayuko - Osaka-shi Osaka
- TATEMICHI; Mayuko - Settsu-shi Osaka
- Tatemichi; Mayuko - Settsu JP
| Patent | Date |
|---|---|
| Fluororesin Film App 20220267540 - Yokotani; Kouji ; et al. | 2022-08-25 |
| Fluororesin film Grant 11,352,469 - Yokotani , et al. June 7, 2 | 2022-06-07 |
| Radio Wave Absorbing Material And Radio Wave Absorbing Sheet App 20210023818 - HAZAMA; Takeshi ; et al. | 2021-01-28 |
| Film App 20200362127 - TATEMICHI; Mayuko ; et al. | 2020-11-19 |
| Film Grant 10,745,531 - Kanemura , et al. A | 2020-08-18 |
| Film App 20200032014 - HAZAMA; Takeshi ; et al. | 2020-01-30 |
| Fluororesin Film App 20190382544 - YOKOTANI; Kouji ; et al. | 2019-12-19 |
| Film App 20180223059 - KANEMURA; Takashi ; et al. | 2018-08-09 |
| High Dielectric Film App 20150368413 - TATEMICHI; Mayuko ; et al. | 2015-12-24 |
| Multilayer Film App 20150332855 - KOH; Meiten ; et al. | 2015-11-19 |
| Film for use in film capacitors, and film capacitors Grant 9,156,930 - Koh , et al. October 13, 2 | 2015-10-13 |
| Composition for forming high dielectric film for film capacitor Grant 8,934,216 - Yokotani , et al. January 13, 2 | 2015-01-13 |
| Film for film capacitor and film capacitor Grant 8,675,345 - Tatemichi , et al. March 18, 2 | 2014-03-18 |
| Coating composition for forming highly dielectric film and highly dielectric film Grant 8,576,540 - Koh , et al. November 5, 2 | 2013-11-05 |
| Film For Use In Film Capacitors, And Film Capacitors App 20130188293 - Koh; Meiten ; et al. | 2013-07-25 |
| High Dielectric Film App 20120293909 - Tatemichi; Mayuko ; et al. | 2012-11-22 |
| Film For Film Capacitor And Film Capacitor App 20110255210 - Tatemichi; Mayuko ; et al. | 2011-10-20 |
| Composition For Forming High Dielectric Film For Film Capacitor App 20110249374 - Yokotani; Kouji ; et al. | 2011-10-13 |
| Coating Composition For Forming Highly Dielectric Film And Highly Dielectric Film App 20110013343 - Koh; Meiten ; et al. | 2011-01-20 |
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