Tateda; Shinya

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tateda; Shinya.The latest application filed is for "input component, sensor sheet, and decorative component".

Company Profile

0.11.13

Tateda; Shinya - Saitama JP
Tateda; Shinya - Saitama-city Saitama
Tateda; Shinya - Fukushima-prefecture JP
Tateda; Shinya - Tokyo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Input component, sensor sheet, and decorative component Grant 10,738,965 - Tateda A	2020-08-11
Touch sensor and touch panel device Grant 9,910,536 - Tateda March 6, 2	2018-03-06
Input Component, Sensor Sheet, and Decorative Component App 20170184273 - Tateda; Shinya	2017-06-29
Touch Sensor and Touch Panel Device App 20170003799 - Tateda; Shinya	2017-01-05
Key sheet Grant 7,598,466 - Tateda , et al. October 6, 2	2009-10-06
Key sheet App 20080017495 - Tateda; Shinya ; et al.	2008-01-24
Thermally conductive formed article and method of manufacturing the same Grant 7,291,381 - Tobita , et al. November 6, 2	2007-11-06
Thermally conductive molded article and method of making the same Grant 7,264,869 - Tobita , et al. September 4, 2	2007-09-04
Adhesion method and electronic component Grant 6,918,983 - Tobita , et al. July 19, 2	2005-07-19
Graphitized carbon fiber powder and thermally conductive composition Grant 6,794,035 - Tobita , et al. September 21, 2	2004-09-21
Heat conductive mold and manufacturing method thereof Grant 6,761,842 - Tobita , et al. July 13, 2	2004-07-13
Thermally conductive polymer composition and thermally conductive molded article Grant 6,730,731 - Tobita , et al. May 4, 2	2004-05-04
Adhesion method and electronic component App 20040041257 - Tobita, MasayukiTobita ; et al.	2004-03-04
Heat conductive adhesive film and manufacturing method thereof and electronic component Grant 6,663,969 - Masayuki , et al. December 16, 2	2003-12-16
Adhesion method and electronic component Grant 6,649,012 - Masayuki , et al. November 18, 2	2003-11-18
Thermally conductive formed article and method of manufacturing the same App 20030194544 - Tobita, Masayuki ; et al.	2003-10-16
Heat conductive mold and manufacturing method thereof App 20030153665 - Tobita, Masayuki ; et al.	2003-08-14
Graphitized carbon fiber powder and thermally conductive composition App 20030064216 - Tobita, Masayuki ; et al.	2003-04-03
Carbon fiber powder, a method of making the same, and thermally conductive composition App 20030064017 - Tobita, Masayuki ; et al.	2003-04-03
Thermally conductive molded article and method of making the same App 20020197923 - Tobita, Masayuki ; et al.	2002-12-26
Thermally conductive polymer composition and thermally conductive molded article App 20020058743 - Tobita, Masayuki ; et al.	2002-05-16
Heat conductive adhesive film and manufacturing method thereof and electronic component App 20020050585 - Masayuki, Tobita ; et al.	2002-05-02
Heat conductive mold and manufacturing method thereof App 20010004546 - Tobita, Masayuki ; et al.	2001-06-21
Adhesion method and electronic component App 20010004131 - Masayuki, Tobita ; et al.	2001-06-21

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