Tapias; Nicholas R.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tapias; Nicholas R..The latest application filed is for "apparatuses including elongate pillars of access devices".

Company Profile

6.4.8

Tapias; Nicholas R. - Boise ID

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Apparatuses Including Elongate Pillars Of Access Devices App 20220102351 - Guo; Song ; et al.	2022-03-31
Methods of forming an apparatus including device structures including pillar structures, and related memory devices, and electronic systems Grant 11,201,154 - Guo , et al. December 14, 2	2021-12-14
Integrated Assemblies Having Shield Lines Between Digit Lines, and Methods of Forming Integrated Assemblies App 20210327883 - Tang; Sanh D. ; et al.	2021-10-21
Integrated assemblies having shield lines between digit lines, and methods of forming integrated assemblies Grant 11,069,687 - Tang , et al. July 20, 2	2021-07-20
Methods Of Forming An Apparatus Including Device Structures Including Pillar Structures, And Related Memory Devices, And Electronic Systems App 20210202487 - Guo; Song ; et al.	2021-07-01
Semiconductor Structure Formation App 20210143011 - Tapias; Nicholas R. ; et al.	2021-05-13
Epitaxial growth on semiconductor structures Grant 10,978,295 - Yang , et al. April 13, 2	2021-04-13
Semiconductor structure formation Grant 10,930,499 - Tapias , et al. February 23, 2	2021-02-23
Integrated Assemblies Having Rugged Material Fill, and Methods of Forming Integrated Assemblies App 20210050364 - Tapias; Nicholas R. ; et al.	2021-02-18
Epitaxial Growth On Semiconductor Structures App 20200402798 - Yang; Guangjun ; et al.	2020-12-24
Semiconductor Structure Formation App 20200328080 - Tapias; Nicholas R. ; et al.	2020-10-15
Integrated Assemblies Having Shield Lines Between Digit Lines, and Methods of Forming Integrated Assemblies App 20200286895 - Tang; Sanh D. ; et al.	2020-09-10

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