TAO; Yujuan
Patent Applications and Registrations
Patent applications and USPTO patent grants for TAO; Yujuan.The latest application filed is for "packaging structure and fabrication method thereof".
- TAO; Yujuan - Nantong CN
- Tao; Yujuan - Jiangsu CN
| Patent | Date |
|---|---|
| Packaging Structure And Fabrication Method Thereof App 20220285287 - TAO; Yujuan | 2022-09-08 |
| Packaging Structure And Formation Method Thereof App 20220278075 - SHI; Lei ; et al. | 2022-09-01 |
| Packaging Structure And Formation Method Thereof App 20220246540 - SHI; Lei ; et al. | 2022-08-04 |
| System-level packaging structures Grant 10,741,499 - Tao , et al. A | 2020-08-11 |
| 3D system-level packaging methods and structures Grant 10,515,883 - Tao , et al. Dec | 2019-12-24 |
| 3d System-level Packaging Methods And Structures App 20170133305 - TAO; Yujuan ; et al. | 2017-05-11 |
| System-level Packaging Structures App 20170077035 - TAO; Yujuan ; et al. | 2017-03-16 |
| 3D system-level packaging methods and structures Grant 9,595,490 - Tao , et al. March 14, 2 | 2017-03-14 |
| Metal contact for semiconductor device Grant 9,548,282 - Lin , et al. January 17, 2 | 2017-01-17 |
| System-level packaging methods and structures Grant 9,543,269 - Tao , et al. January 10, 2 | 2017-01-10 |
| Packaging structure Grant 9,497,862 - Shi , et al. November 15, 2 | 2016-11-15 |
| Package structure Grant 9,485,868 - Tao November 1, 2 | 2016-11-01 |
| Method for forming package structure Grant 9,397,070 - Tao July 19, 2 | 2016-07-19 |
| Method for chip package Grant 9,362,173 - Shi , et al. June 7, 2 | 2016-06-07 |
| Packaging method Grant 9,324,583 - Shi , et al. April 26, 2 | 2016-04-26 |
| Fan-out high-density packaging methods and structures Grant 9,287,205 - Shi , et al. March 15, 2 | 2016-03-15 |
| Method For Forming Package Structure App 20160035696 - Tao; Yujuan | 2016-02-04 |
| Package Structure App 20150382467 - Tao; Yujuan | 2015-12-31 |
| Semiconductor Device And Manufacturing Method Thereof App 20150287688 - Lin; Chang-Ming ; et al. | 2015-10-08 |
| Fan-out High-density Packaging Methods And Structures App 20150228568 - SHI; LEI ; et al. | 2015-08-13 |
| Three-dimensional system-level packaging methods and structures Grant 9,099,448 - Tao , et al. August 4, 2 | 2015-08-04 |
| Fan-out high-density packaging methods and structures Grant 9,040,347 - Tao , et al. May 26, 2 | 2015-05-26 |
| Method for chip packaging Grant 8,883,627 - Shi , et al. November 11, 2 | 2014-11-11 |
| Three-dimensional System-level Packaging Methods And Structures App 20130320535 - Tao; Yujuan ; et al. | 2013-12-05 |
| 3d System-level Packaging Methods And Structures App 20130320533 - Tao; Yujuan ; et al. | 2013-12-05 |
| System-level Packaging Methods And Structures App 20130320534 - Tao; Yujuan ; et al. | 2013-12-05 |
| Fan-out High-density Packaging Methods And Structures App 20130313699 - Tao; Yujuan ; et al. | 2013-11-28 |
| Packaging Structure App 20130301228 - Tao; Yujuan ; et al. | 2013-11-14 |
| Packaging Method App 20130302947 - Tao; Yujuan ; et al. | 2013-11-14 |
| Method For Chip Packaging App 20130280904 - Shi; Lei ; et al. | 2013-10-24 |
| Method For Chip Package App 20130224910 - Shi; Lei ; et al. | 2013-08-29 |
| Package Structure with Flat Bumps for Integrate Circuit or Discrete Device and Method of Manufacture the Same App 20080315412 - Liang; Jerry ; et al. | 2008-12-25 |
| Packaging Substrate with Flat Bumps for Electronic Devices and Method of Manufacturing the Same App 20080285251 - Liang; Jerry ; et al. | 2008-11-20 |
| Package Structure With Flat Bumps For Electronic Device and Method of Manufacture the Same App 20080258273 - Liang; Jerry ; et al. | 2008-10-23 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.
| 