TAO; Rong

Patent Applications and Registrations

Patent applications and USPTO patent grants for TAO; Rong.The latest application filed is for "methods and apparatus for processing a substrate".

Company Profile

2.20.26

TAO; Rong - San Jose CA
Tao; Rong - Hangzhou City CN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Methods And Apparatus For Processing A Substrate App 20220310364 - CHONG; Halbert ; et al.	2022-09-29
Methods And Apparatus For Processing A Substrate App 20220310363 - CHONG; Halbert ; et al.	2022-09-29
Ruthenium Reflow For Via Fill App 20220223472 - Luo; Yi ; et al.	2022-07-14
Methods And Apparatus For Processing A Substrate App 20210319989 - CHONG; Halbert ; et al.	2021-10-14
Methods And Apparatus For Forming Dual Metal Interconnects App 20210320064 - PARIKH; SUKETU A. ; et al.	2021-10-14
Methods and apparatus for forming dual metal interconnects Grant 11,075,165 - Parikh , et al. July 27, 2	2021-07-27
Methods And Apparatus For Forming Dual Metal Interconnects App 20210020569 - PARIKH; SUKETU A. ; et al.	2021-01-21
Methods and apparatus for filling substrate features with cobalt Grant 10,304,732 - Hou , et al.	2019-05-28
Methods And Apparatus For Filling Substrate Features With Cobalt App 20190088540 - Hou; Wenting ; et al.	2019-03-21
Self-ionized And Inductively-coupled Plasma For Sputtering And Resputtering App 20180327893 - DING; Peijun ; et al.	2018-11-15
Self-ionized and inductively-coupled plasma for sputtering and resputtering Grant 10,047,430 - Ding , et al. August 14, 2	2018-08-14
Methods for forming cobalt-copper selective fill for an interconnect Grant 10,014,179 - Tao , et al. July 3, 2	2018-07-03
Methods For Forming Cobalt-copper Selective Fill For An Interconnect App 20160240432 - TAO; RONG ; et al.	2016-08-18
Method And Apparatus For Film Deposition App 20150136732 - TANG; Xianmin ; et al.	2015-05-21
Methods for forming layers on a substrate Grant 8,993,434 - Yu , et al. March 31, 2	2015-03-31
Ultra-thin Copper Seed Layer For Electroplating Into Small Features App 20140374907 - YU; Jick M. ; et al.	2014-12-25
Self-ionized And Inductively-coupled Plasma For Sputtering And Resputtering App 20140305802 - DING; Peijun ; et al.	2014-10-16
Self-ionized and inductively-coupled plasma for sputtering and resputtering Grant 8,696,875 - Ding , et al. April 15, 2	2014-04-15
Self-ionized and inductively-coupled plasma for sputtering and resputtering Grant 8,668,816 - Ding , et al. March 11, 2	2014-03-11
Ultra-thin Copper Seed Layer For Electroplating Into Small Features App 20130341794 - YU; Jick M. ; et al.	2013-12-26
Sputtering of thermally resistive materials including metal chalcogenides Grant 8,500,963 - Ye , et al. August 6, 2	2013-08-06
Bottom up plating by organic surface passivation and differential plating retardation Grant 8,293,647 - Wang , et al. October 23, 2	2012-10-23
Methods For Forming Layers On A Substrate App 20120070982 - YU; JICK M. ; et al.	2012-03-22
Bottom Up Plating By Organic Surface Passivation And Differential Plating Retardation App 20100130007 - WANG; JENN-YUE ; et al.	2010-05-27
Self-ionized And Inductively-coupled Plasma For Sputtering And Resputtering App 20090233438 - DING; Peijun ; et al.	2009-09-17
Chalcogenide Target And Method App 20090107834 - Ye; Mengqi ; et al.	2009-04-30
Self-ionized And Inductively-coupled Plasma For Sputtering And Resputtering App 20080110747 - DING; Peijun ; et al.	2008-05-15
Sputtering Of Thermally Resistive Materials Including Metal Chalcogenides App 20080099326 - YE; MENGQI ; et al.	2008-05-01
Mobile communications terminal and method therefore App 20060271867 - Wang; Kong Qiao ; et al.	2006-11-30
Self-ionized and inductively-coupled plasma for sputtering and resputtering App 20050255691 - Ding, Peijun ; et al.	2005-11-17
Auxiliary magnet array in conjunction with magnetron sputtering Grant 6,875,321 - Ding , et al. April 5, 2	2005-04-05
Self-ionized and inductively-coupled plasma for sputtering and resputtering App 20050006222 - Ding, Peijun ; et al.	2005-01-13
Auxiliary magnet array in conjunction with magnetron sputtering App 20040035692 - Ding, Peijun ; et al.	2004-02-26
Continuous, non-agglomerated adhesion of a seed layer to a barrier layer Grant 6,627,542 - Gandikota , et al. September 30, 2	2003-09-30
Magnet array in conjunction with rotating magnetron for plasma sputtering Grant 6,610,184 - Ding , et al. August 26, 2	2003-08-26
Magnet array in conjunction with rotating magnetron for plasma sputtering App 20030089601 - Ding, Peijun ; et al.	2003-05-15
Burn-in process for high density plasma PVD chamber App 20020144889 - Tao, Rong ; et al.	2002-10-10
Dual damascene metallization Grant 6,207,222 - Chen , et al. March 27, 2	2001-03-27
IMP technology with heavy gas sputtering Grant 6,200,433 - Ding , et al. March 13, 2	2001-03-13
Low temperature integrated via and trench fill process and apparatus Grant 6,139,697 - Chen , et al. October 31, 2	2000-10-31
Dual damascene metallization Grant 5,989,623 - Chen , et al. November 23, 1	1999-11-23

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