| Patent | Date |
|---|
Wearable alarm system for a prosthetic hearing implant
Grant 10,870,003 - Gordon , et al. December 22, 2 | 2020-12-22 |
Wearable Alarm System For A Prosthetic Hearing Implant
App 20170291027 - Gordon; Brian ; et al. | 2017-10-12 |
Wearable alarm system for a prosthetic hearing implant
Grant 9,630,006 - Gordon , et al. April 25, 2 | 2017-04-25 |
Wire bond encapsulant control method
Grant 8,293,589 - Chung-Long-Shan , et al. October 23, 2 | 2012-10-23 |
Apparatus For Forming Asymmetrical Encapsulant Beads On Wire Bonds
App 20120048185 - Williams; Susan ; et al. | 2012-03-01 |
Electronic Component Assembly Having Profiled Encapsulated Bonds
App 20120018905 - Silverbrook; Kia ; et al. | 2012-01-26 |
Electronic component with wire bonds in low modulus fill encapsulant
Grant 8,063,318 - Williams , et al. November 22, 2 | 2011-11-22 |
Assembly of electronic components
Grant 8,039,974 - Silverbrook , et al. October 18, 2 | 2011-10-18 |
Method of wire bond encapsulation profiling
Grant 8,025,204 - Chung-Long-Shan , et al. September 27, 2 | 2011-09-27 |
Method of forming assymetrical encapsulant bead
Grant 8,017,450 - Chew , et al. September 13, 2 | 2011-09-13 |
Method of reducing wire bond profile height in integrated circuits mounted to circuit boards
Grant 7,988,033 - Chung-Long-Shan , et al. August 2, 2 | 2011-08-02 |
Wirebonder forming low profile wire bonds between integrated circuits dies and printed circuit boards
Grant 7,946,465 - Silverbrook , et al. May 24, 2 | 2011-05-24 |
Method of controlling satellite drops from an encapsulant jetter
Grant 7,915,091 - Chew , et al. March 29, 2 | 2011-03-29 |
Method of adhering wire bond loops to reduce loop height
Grant 7,875,504 - Silverbrook , et al. January 25, 2 | 2011-01-25 |
Integrated circuit support for low profile wire bond
Grant 7,824,013 - Chung-Long-Shan , et al. November 2, 2 | 2010-11-02 |
Assembly Of Electronic Components
App 20100244282 - Silverbrook; Kia ; et al. | 2010-09-30 |
Method of encapsulating wire bonds
Grant 7,803,659 - Chung-Long-Shan , et al. September 28, 2 | 2010-09-28 |
Method of wire bonding an integrated circuit die and a printed circuit board
Grant 7,802,715 - Silverbrook , et al. September 28, 2 | 2010-09-28 |
Electronic device with wire bonds adhered between integrated circuits dies and printed circuit boards
Grant 7,741,720 - Silverbrook , et al. June 22, 2 | 2010-06-22 |
Method Of Wire Bonding An Integrated Circuit Die And A Printed Circuit Board
App 20100133323 - Silverbrook; Kia ; et al. | 2010-06-03 |
Wire Bond Encapsulant Control Method
App 20100124803 - Chung-Long-Shan; Laval ; et al. | 2010-05-20 |
Method Of Forming Assymetrical Encapsulant Bead
App 20100075466 - Chew; Nadine Lee-Yen ; et al. | 2010-03-25 |
Method Of Forming Assymetrical Encapsulant Bead
App 20100075446 - Chew; Nadine Lee-Yen ; et al. | 2010-03-25 |
Method Of Reducing Voids In Encapsulant
App 20100075464 - Chew; Nadine Lee-Yen ; et al. | 2010-03-25 |
Method Of Controlling Satellite Drops From An Encapsulant Jetter
App 20100075025 - Chew; Nadine Lee-Yen ; et al. | 2010-03-25 |
Method Of Reducing Voids In Encapsulant
App 20100075465 - Chew; Nadine Lee-Yen ; et al. | 2010-03-25 |
Method Of Encapsulating Wire Bonds
App 20100055849 - Chung-Long-Shan; Laval ; et al. | 2010-03-04 |
Method of forming low profile wire bonds between integrated circuits dies and printed circuit boards
Grant 7,669,751 - Silverbrook , et al. March 2, 2 | 2010-03-02 |
Wire bond encapsulant application control
Grant 7,659,141 - Chung-Long-Shan , et al. February 9, 2 | 2010-02-09 |
Wearable Alarm System For A Prosthetic Hearing Implant
App 20090292338 - Gordon; Brian ; et al. | 2009-11-26 |
Method of applying encapsulant to wire bonds
Grant 7,618,842 - Chung-Long-Shan , et al. November 17, 2 | 2009-11-17 |
Wearable alarm system for a prosthetic hearing implant
Grant 7,571,006 - Gordon , et al. August 4, 2 | 2009-08-04 |
Electronic Component With Wire Bonds In Low Modulus Fill Encapsulant
App 20090135569 - Williams; Susan ; et al. | 2009-05-28 |
Electronic Component With Wire Bonds In Low Modulus Fill Encapsulant
App 20090079097 - Williams; Susan ; et al. | 2009-03-26 |
Integrated Circuit Support For Low Profile Wire Bond
App 20090079793 - Chung-Long-Shan; Laval ; et al. | 2009-03-26 |
Wirebonder Forming Low Profile Wire Bonds Between Integrated Circuits Dies And Printed Circuit Boards
App 20090078740 - Silverbrook; Kia ; et al. | 2009-03-26 |
Electronic Device With Wire Bonds Adhered Between Integrated Circuits Dies And Printed Circuit Boards
App 20090079081 - Silverbrook; Kia ; et al. | 2009-03-26 |
Method Of Forming Low Profile Wire Bonds Between Integrated Circuits Dies And Printed Circuit Boards
App 20090078744 - Silverbrook; Kia ; et al. | 2009-03-26 |
Wire Bond Encapsulant Application Control
App 20090081833 - Chung-Long-Shan; Laval ; et al. | 2009-03-26 |
Method Of Reducing Wire Bond Profile Height In Integrated Circuits Mounted To Circuit Boards
App 20090081832 - Chung-Long-Shan; Laval ; et al. | 2009-03-26 |
Method Of Applying Encapsulant To Wire Bonds
App 20090081834 - Chung-Long-Shan; Laval ; et al. | 2009-03-26 |
Method Of Adhering Wire Bond Loops To Reduce Loop Height
App 20090081829 - Silverbrook; Kia ; et al. | 2009-03-26 |
Method Of Wire Bond Encapsulation Profiling
App 20090081818 - Chung-Long-Shan; Laval ; et al. | 2009-03-26 |
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