Tanikella; Ravindra V.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tanikella; Ravindra V..The latest application filed is for "apparatus with a substrate provided with plasma treatment".

Company Profile

1.9.11

Tanikella; Ravindra V. - Chandler AZ
Tanikella; Ravindra V. - Chanler AZ
Tanikella; Ravindra V. - Phoenix AZ US

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Apparatus with a substrate provided with plasma treatment Grant 11,291,122 - Grujicic , et al. March 29, 2	2022-03-29
Apparatus With A Substrate Provided With Plasma Treatment App 20200245472 - Kind Code	2020-07-30
Semiconductor device having polyimide layer Grant 10,211,143 - Tanikella Feb	2019-02-19
Materials, Structures And Methods For Microelectronic Packaging App 20170148723 - Tanikella; Ravindra V.	2017-05-25
Materials, structures and methods for microelectronic packaging Grant 9,484,277 - Tanikella November 1, 2	2016-11-01
Polymer grafting for enhanced dielectric and interconnect material adhesion Grant 9,147,603 - Subramani , et al. September 29, 2	2015-09-29
Polymer Grafting For Enhanced Dielectric And Interconnect Material Adhesion App 20150206793 - Subramani; Chandramouleeswaran ; et al.	2015-07-23
Materials, Structures And Methods For Microelectronic Packaging App 20140312101 - TANIKELLA; RAVINDRA V.	2014-10-23
Materials, structures and methods for microelectronic packaging Grant 8,796,825 - Tanikella August 5, 2	2014-08-05
Materials, Structures And Methods For Microelectronic Packaging App 20120181687 - TANIKELLA; RAVINDRA V.	2012-07-19
Materials, structures and methods for microelectronic packaging Grant 8,129,823 - Tanikella March 6, 2	2012-03-06
Die-attach films for chip-scale packaging, packages made therewith, and methods of assembling same Grant 7,816,487 - Manepalli , et al. October 19, 2	2010-10-19
Materials, structures and methods for microelectronic packaging App 20080087986 - Tanikella; Ravindra V.	2008-04-17
Materials, structures and methods for microelectronic packaging Grant 7,335,608 - Tanikella February 26, 2	2008-02-26
Substrate core polymer nanocomposite with nanoparticles and randomly oriented nanotubes and method App 20070096083 - Raravikar; Nachiket ; et al.	2007-05-03
Die-attach films for chip-scale packaging, packages made therewith, and methods of assembling same App 20060073624 - Manepalli; Rahul N. ; et al.	2006-04-06
Materials, structures and methods for microelectronic packaging App 20060060956 - Tanikella; Ravindra V.	2006-03-23

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