Tanikawa; Mitsuru

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tanikawa; Mitsuru.The latest application filed is for "method for manufacturing cured film, method for manufacturing electronic component, and electronic component".

Company Profile

5.9.22

Tanikawa; Mitsuru - Osaka JP
Tanikawa; Mitsuru - Mishima-gun Osaka

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method For Manufacturing Cured Film, Method For Manufacturing Electronic Component, And Electronic Component App 20220098419 - Tanikawa; Mitsuru ; et al.	2022-03-31
Method for manufacturing cured film, method for manufacturing electronic component, and electronic component Grant 11,220,604 - Tanikawa , et al. January 11, 2	2022-01-11
Inkjet adhesive, manufacturing method for semiconductor device, and electronic component Grant 10,961,411 - Tanikawa , et al. March 30, 2	2021-03-30
Curable composition for inkjet, and method for manufacturing electronic component Grant 10,259,773 - Tanikawa , et al.	2019-04-16
Inkjet Adhesive, Manufacturing Method For Semiconductor Device, And Electronic Component App 20190092963 - Tanikawa; Mitsuru ; et al.	2019-03-28
Inkjet adhesive, manufacturing method for semiconductor device, and electronic component Grant 10,202,519 - Tanikawa , et al. Feb	2019-02-12
Inkjet adhesive, manufacturing method for semiconductor device, and electronic component Grant 10,066,118 - Tanikawa , et al. September 4, 2	2018-09-04
Curable Composition For Inkjet, And Method For Manufacturing Electronic Component App 20170298005 - Tanikawa; Mitsuru ; et al.	2017-10-19
Inkjet Adhesive, Manufacturing Method For Semiconductor Device, And Electronic Component App 20170233615 - Tanikawa; Mitsuru ; et al.	2017-08-17
Inkjet Adhesive, Manufacturing Method For Semiconductor Device, And Electronic Component App 20170233599 - Tanikawa; Mitsuru ; et al.	2017-08-17
Inkjet Photo- And Heat-curable Adhesive, Semiconductor Device Manufacturing Method, And Electronic Part App 20170158922 - Tanikawa; Mitsuru ; et al.	2017-06-08
Method for manufacturing electronic component, and electronic component Grant 9,337,019 - Tanikawa , et al. May 10, 2	2016-05-10
Method For Manufacturing Cured Film, Method For Manufacturing Electronic Component, And Electronic Component App 20160046813 - Tanikawa; Mitsuru ; et al.	2016-02-18
Method For Manufacturing Electronic Component, And Electronic Component App 20160049297 - Tanikawa; Mitsuru ; et al.	2016-02-18
Sealing Agent For Optical Semiconductor Devices, And Optical Semiconductor Device App 20140175505 - Yamazaki; Ryosuke ; et al.	2014-06-26
Encapsulating Agent For Optical Semiconductor Devices, And Optical Semiconductor Device Using Same App 20130221400 - Tanikawa; Mitsuru ; et al.	2013-08-29
Encapsulant for optical semiconductor device and optical semiconductor device using same Grant 8,519,429 - Tanikawa , et al. August 27, 2	2013-08-27
Surface-treated Fluorescent Bodies And Process For Production Of Surface-treated Fluorescent Bodies App 20130094186 - Sun; Ren-de ; et al.	2013-04-18
Encapsulant For Optical Semiconductor Device And Optical Semiconductor Device Using Same App 20120146088 - Tanikawa; Mitsuru ; et al.	2012-06-14
Sealant For Optical Semiconductors And Optical Semiconductor Device App 20120126282 - Tanikawa; Mitsuru ; et al.	2012-05-24
Sealing agent for optical semiconductor element, and optical semiconductor element Grant 8,084,530 - Tanikawa , et al. December 27, 2	2011-12-27
Sealing Agent For Optical Semiconductor Element, And Optical Semiconductor Element App 20100171414 - Tanikawa; Mitsuru ; et al.	2010-07-08
Curing Resin Composition, Sealing Material For Liquid Crystal Display Device And Liquid Crystal Display Device App 20090134358 - Tanikawa; Mitsuru ; et al.	2009-05-28
Curing Resin Composition, Sealing Material For Liquid Crystal Display Device And Liquid Crystal Display Device App 20090093562 - TANIKAWA; Mitsuru ; et al.	2009-04-09
Themosetting Composition for Optical Semiconductor, Die Bond Material for Optical Semiconductor Device, Underfill Material for Optical Semiconductor Device, Sealing Agent for Optical Semiconductor Device, and Optical Semiconductor Device App 20090091045 - Tanikawa; Mitsuru ; et al.	2009-04-09
Sealant for one drop fill process, vertically conducting material and liquid crystal display device App 20090061117 - Oyama; Yuichi ; et al.	2009-03-05
Curing resin composition, sealing material for liquid crystal display device and liquid crystal display device App 20060240198 - Tanikawa; Mitsuru ; et al.	2006-10-26

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