TANIGUCHI; Yoshitaka

Patent Applications and Registrations

Patent applications and USPTO patent grants for TANIGUCHI; Yoshitaka.The latest application filed is for "surface-treated aggregated boron nitride powder, aggregated boron nitride powder, and thermally conductive resin composition".

Company Profile

7.8.15

TANIGUCHI; Yoshitaka - Omuta-city JP
Taniguchi; Yoshitaka - Omuta JP
TANIGUCHI; Yoshitaka - Omuta-shi JP
Taniguchi; Yoshitaka - Tokyo JP
TANIGUCHI; Yoshitaka - Ibaraki JP
Taniguchi; Yoshitaka - Mitaka JA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Surface-treated Aggregated Boron Nitride Powder, Aggregated Boron Nitride Powder, And Thermally Conductive Resin Composition App 20220154060 - TAKEDA; Go ; et al.	2022-05-19
Boron nitride aggregated grain Grant 11,268,004 - Takeda , et al. March 8, 2	2022-03-08
Method for producing ceramic circuit board Grant 11,160,172 - Sakai , et al. October 26, 2	2021-10-26
Aggregate Boron Nitride Particles, Boron Nitride Powder, Production Method For Boron Nitride Powder, Resin Composition, And Heat Dissipation Member App 20210261413 - TAKEDA; Go ; et al.	2021-08-26
Ceramic circuit board Grant 11,096,278 - Sakai , et al. August 17, 2	2021-08-17
Power module Grant 11,094,648 - Hirotsuru , et al. August 17, 2	2021-08-17
Hexagonal Boron Nitride Powder And Method For Producing Hexagonal Boron Nitride Powder App 20210163288 - TAKEDA; Go ; et al.	2021-06-03
Ceramic Circuit Board App 20200375029 - SAKAI; Atsushi ; et al.	2020-11-26
Power Module App 20200373251 - HIROTSURU; Hideki ; et al.	2020-11-26
Spherical boron nitride fine powder, method for manufacturing same and thermally conductive resin composition using same Grant 10,752,503 - Takeda , et al. A	2020-08-25
Boron Nitride Powder, Method For Producing Same, And Heat-dissipating Member Produced Using Same App 20200247672 - Kind Code	2020-08-06
Method For Producing Ceramic Circuit Board App 20200128677 - SAKAI; Atsushi ; et al.	2020-04-23
Method For Manufacturing Aluminum Circuit Board App 20200120809 - KURODA; Seiji ; et al.	2020-04-16
Spherical Boron Nitride Fine Powder, Method For Manufacturing Same And Thermally Conductive Resin Composition Using Same App 20200048091 - TAKEDA; Go ; et al.	2020-02-13
Boron Nitride Aggregated Grain, Method For Producing Same, And Thermally Conductive Resin Composition Using Same App 20200040245 - TAKEDA; Go ; et al.	2020-02-06
Method For Manufacturing Ceramic Circuit Board App 20190364667 - SAKAKI; Kazuhiko ; et al.	2019-11-28
Aluminium-silicon carbide composite, and power-module base plate Grant 10,233,125 - Goto , et al.	2019-03-19
Aluminium-silicon Carbide Composite, And Power-module Base Plate App 20170107158 - GOTO; Daisuke ; et al.	2017-04-20
Apparatus for assembling components on a target object utilizing a slider for movement of a pallet Grant 7,946,030 - Tanaka , et al. May 24, 2	2011-05-24
Assembling Object/Component Mounting Pallet and Assembling Equipment App 20090300904 - Tanaka; Toshiharu ; et al.	2009-12-10
Method Of Leaching Copper Sulfide Ores Containing Chalcopyrite App 20090241734 - IMAGAWA; Harue ; et al.	2009-10-01
Circuit substrate App 20020037435 - Hirashima, Yutaka ; et al.	2002-03-28
Process for preparation of coated medicines Grant 3,919,436 - Takebe , et al. November 11, 1	1975-11-11

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