loadpatents
name:-0.01889705657959
name:-0.012565851211548
name:-0.0024120807647705
Taniguchi; Takayasu Patent Filings

Taniguchi; Takayasu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Taniguchi; Takayasu.The latest application filed is for "water-absorbent resin particle, method for production thereof, and absorbent material using the same".

Company Profile
0.8.8
  • Taniguchi; Takayasu - Himeji N/A JP
  • Taniguchi; Takayasu - Himeji-shi JP
  • Taniguchi; Takayasu - Hyogo JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Water-absorbing resin compound
Grant 8,981,176 - Taniguchi , et al. March 17, 2
2015-03-17
Water-absorbing resin composition
Grant 8,524,797 - Taniguchi , et al. September 3, 2
2013-09-03
Water-absorbing resin composition
Grant 8,383,696 - Taniguchi , et al. February 26, 2
2013-02-26
Water-absorbent Resin Particle, Method For Production Thereof, And Absorbent Material Using The Same
App 20120298913 - Kondo; Kimihiko ;   et al.
2012-11-29
Water-absorbing Resin Composition
App 20120070484 - TANIGUCHI; Takayasu ;   et al.
2012-03-22
Water-absorbing Resin Compound
App 20110068300 - Taniguchi; Takayasu ;   et al.
2011-03-24
Water-absorbing resin composition
Grant 7,868,075 - Taniguchi , et al. January 11, 2
2011-01-11
Process for producing water-absorbing resin
Grant 7,737,231 - Handa , et al. June 15, 2
2010-06-15
Water-absorbent Resin Particle, Method For Production Thereof, And Absorbent Material Using The Same
App 20090186542 - Kondo; Kimihiko ;   et al.
2009-07-23
Water-Absorbing Resin Composition
App 20080071004 - Taniguchi; Takayasu ;   et al.
2008-03-20
Water-absorbing resin composition
App 20070111004 - Handa; Masayoshi ;   et al.
2007-05-17
Water-absorbing resin composition
App 20060189953 - Taniguchi; Takayasu ;   et al.
2006-08-24
Process for producing water-absorbing resin
App 20050085604 - Handa, Masayoshi ;   et al.
2005-04-21

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