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Semiconductor device Grant 9,627,289 - Ikemoto , et al. April 18, 2 | 2017-04-18 |
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Fingerprint sensor apparatus and manufacturing method thereof Grant 7,192,798 - Okada , et al. March 20, 2 | 2007-03-20 |
Ceramic laminated device, communication equipment and method of manufacturing ceramic laminated device Grant 7,193,862 - Maekawa , et al. March 20, 2 | 2007-03-20 |
Semiconductor device, method for manufacturing the semiconductor device and semiconductor substrate App 20060226529 - Kato; Yoshiharu ;   et al. | 2006-10-12 |
Multi chip package structure having a plurality of semiconductor chips mounted in the same package Grant 6,972,487 - Kato , et al. December 6, 2 | 2005-12-06 |
Semiconductor device, method for manufacturing the semiconductor device and semiconductor substrate App 20050161794 - Kato, Yoshiharu ;   et al. | 2005-07-28 |
Semiconductor device having an interconnecting post formed on an interposer within a sealing resin Grant 6,812,066 - Taniguchi , et al. November 2, 2 | 2004-11-02 |
Ceramic laminated device, communication equipment and method of manufacturing ceramic laminated device App 20040055693 - Maekawa, Tomoya ;   et al. | 2004-03-25 |
Semiconductor device having a built-in contact-type sensor and manufacturing method thereof Grant 6,670,221 - Sakoda , et al. December 30, 2 | 2003-12-30 |
Acceleration sensor, an acceleration detection apparatus, and a positioning device Grant 6,629,462 - Otsuchi , et al. October 7, 2 | 2003-10-07 |
Semiconductor device having a built-in contact-type sensor and manufacturing method thereof App 20030178714 - Sakoda, Hideharu ;   et al. | 2003-09-25 |
Fingerprint sensor apparatus and manufacturing method thereof App 20030156743 - Okada, Akira ;   et al. | 2003-08-21 |
Semiconductor device having an interconnecting post formed on an interposer within a sealing resin App 20030042564 - Taniguchi, Fumihiko ;   et al. | 2003-03-06 |
Semiconductor device having an interconnecting post formed on an interposer within a sealing resin Grant 6,489,676 - Taniguchi , et al. December 3, 2 | 2002-12-03 |
Semiconductor device having bonding wires serving as external connection terminals Grant 6,472,746 - Taniguchi , et al. October 29, 2 | 2002-10-29 |
Semiconductor device, method for manufacturing the semiconductor device and semiconductor substrate App 20020140107 - Kato, Yoshiharu ;   et al. | 2002-10-03 |
Semiconductor device having an interconnecting post formed on an interposer within a sealing resin App 20020066952 - Taniguchi, Fumihiko ;   et al. | 2002-06-06 |
Semiconductor device having protruding electrodes higher than a sealed portion Grant 6,388,333 - Taniguchi , et al. May 14, 2 | 2002-05-14 |
Semiconductor device having bonding wires serving as external connection terminals App 20020017719 - Taniguchi, Fumihiko ;   et al. | 2002-02-14 |
Method of manufacturing solder bumps and solder joints using formic acid Grant 6,344,407 - Matsuki , et al. February 5, 2 | 2002-02-05 |
Acceleration sensor, an acceleration detection apparatus, and a positioning device App 20020011111 - Otsuchi, Tetsuro ;   et al. | 2002-01-31 |
Method of fabricating semiconductor having through hole App 20010028101 - Taniguchi, Fumihiko ;   et al. | 2001-10-11 |
Resin molded semiconductor device and method of manufacturing semiconductor package Grant 6,166,433 - Takashima , et al. December 26, 2 | 2000-12-26 |
Semiconductor device having an insulating substrate Grant 6,160,313 - Takashima , et al. December 12, 2 | 2000-12-12 |