loadpatents
name:-0.019391059875488
name:-0.017644882202148
name:-0.00067901611328125
Taniguchi; Fumihiko Patent Filings

Taniguchi; Fumihiko

Patent Applications and Registrations

Patent applications and USPTO patent grants for Taniguchi; Fumihiko.The latest application filed is for "semiconductor device".

Company Profile
0.13.12
  • Taniguchi; Fumihiko - Yokohama JP
  • TANIGUCHI; Fumihiko - Yokohama-shi JP
  • Taniguchi; Fumihiko - Kawasaki JP
  • Taniguchi; Fumihiko - Kyoto JP
  • Taniguchi; Fumihiko - Kyotanabe JP
  • Taniguchi, Fumihiko - Kyotanabe-shi JP
  • Taniguchi, Fumihiko - Kawasaki-shi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Semiconductor device
Grant 9,627,289 - Ikemoto , et al. April 18, 2
2017-04-18
Semiconductor Device
App 20160181194 - IKEMOTO; Yoshihiko ;   et al.
2016-06-23
Fingerprint sensor apparatus and manufacturing method thereof
Grant 7,192,798 - Okada , et al. March 20, 2
2007-03-20
Ceramic laminated device, communication equipment and method of manufacturing ceramic laminated device
Grant 7,193,862 - Maekawa , et al. March 20, 2
2007-03-20
Semiconductor device, method for manufacturing the semiconductor device and semiconductor substrate
App 20060226529 - Kato; Yoshiharu ;   et al.
2006-10-12
Multi chip package structure having a plurality of semiconductor chips mounted in the same package
Grant 6,972,487 - Kato , et al. December 6, 2
2005-12-06
Semiconductor device, method for manufacturing the semiconductor device and semiconductor substrate
App 20050161794 - Kato, Yoshiharu ;   et al.
2005-07-28
Semiconductor device having an interconnecting post formed on an interposer within a sealing resin
Grant 6,812,066 - Taniguchi , et al. November 2, 2
2004-11-02
Ceramic laminated device, communication equipment and method of manufacturing ceramic laminated device
App 20040055693 - Maekawa, Tomoya ;   et al.
2004-03-25
Semiconductor device having a built-in contact-type sensor and manufacturing method thereof
Grant 6,670,221 - Sakoda , et al. December 30, 2
2003-12-30
Acceleration sensor, an acceleration detection apparatus, and a positioning device
Grant 6,629,462 - Otsuchi , et al. October 7, 2
2003-10-07
Semiconductor device having a built-in contact-type sensor and manufacturing method thereof
App 20030178714 - Sakoda, Hideharu ;   et al.
2003-09-25
Fingerprint sensor apparatus and manufacturing method thereof
App 20030156743 - Okada, Akira ;   et al.
2003-08-21
Semiconductor device having an interconnecting post formed on an interposer within a sealing resin
App 20030042564 - Taniguchi, Fumihiko ;   et al.
2003-03-06
Semiconductor device having an interconnecting post formed on an interposer within a sealing resin
Grant 6,489,676 - Taniguchi , et al. December 3, 2
2002-12-03
Semiconductor device having bonding wires serving as external connection terminals
Grant 6,472,746 - Taniguchi , et al. October 29, 2
2002-10-29
Semiconductor device, method for manufacturing the semiconductor device and semiconductor substrate
App 20020140107 - Kato, Yoshiharu ;   et al.
2002-10-03
Semiconductor device having an interconnecting post formed on an interposer within a sealing resin
App 20020066952 - Taniguchi, Fumihiko ;   et al.
2002-06-06
Semiconductor device having protruding electrodes higher than a sealed portion
Grant 6,388,333 - Taniguchi , et al. May 14, 2
2002-05-14
Semiconductor device having bonding wires serving as external connection terminals
App 20020017719 - Taniguchi, Fumihiko ;   et al.
2002-02-14
Method of manufacturing solder bumps and solder joints using formic acid
Grant 6,344,407 - Matsuki , et al. February 5, 2
2002-02-05
Acceleration sensor, an acceleration detection apparatus, and a positioning device
App 20020011111 - Otsuchi, Tetsuro ;   et al.
2002-01-31
Method of fabricating semiconductor having through hole
App 20010028101 - Taniguchi, Fumihiko ;   et al.
2001-10-11
Resin molded semiconductor device and method of manufacturing semiconductor package
Grant 6,166,433 - Takashima , et al. December 26, 2
2000-12-26
Semiconductor device having an insulating substrate
Grant 6,160,313 - Takashima , et al. December 12, 2
2000-12-12

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