Tanigawa; Takao

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tanigawa; Takao.The latest application filed is for "fluororesin substrate laminate".

Company Profile

9.10.11

Tanigawa; Takao - Tokyo JP
TANIGAWA; Takao - Chiyoda-ku Tokyo

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Resin composition, laminate sheet, and multilayer printed wiring board Grant 11,377,546 - Tanigawa , et al. July 5, 2	2022-07-05
Thermosetting resin composition, prepreg, laminate and multilayer printed wiring board Grant 11,359,055 - Tanigawa , et al. June 14, 2	2022-06-14
Resin composition, resin film, laminate, multilayer printed wiring board and method for producing multilayer printed wiring board Grant 11,339,251 - Nagai , et al. May 24, 2	2022-05-24
Resin composition, support with resin layer, prepreg, laminate, multilayered printed wiring board, and printed wiring board for millimeter-wave radar Grant 11,286,346 - Tanigawa , et al. March 29, 2	2022-03-29
Fluororesin Substrate Laminate App 20210187923 - MURAI; Kosuke ; et al.	2021-06-24
Resin composition, prepreg, laminate and multilayer printed wiring board Grant 11,041,045 - Nagai , et al. June 22, 2	2021-06-22
Multilayer transmission line plate Grant 10,957,964 - Tanigawa , et al. March 23, 2	2021-03-23
Resin composition, resin layer-provided support, prepreg, laminate sheet, multilayer printed wiring board, and printed wiring board for millimeter-wave radar Grant 10,907,029 - Tanigawa , et al. February 2, 2	2021-02-02
Thermosetting Resin Composition, Prepreg, Laminate And Multilayer Printed Wiring Board App 20200071464 - TANIGAWA; Takao ; et al.	2020-03-05
Thermosetting resin composition, prepreg, laminate and multilayer printed wiring board Grant 10,519,279 - Tanigawa , et al. Dec	2019-12-31
Multilayer transmission line plate Grant 10,506,705 - Kondou , et al. Dec	2019-12-10
Resin Composition, Resin Film, Laminate, Multilayer Printed Wiring Board And Method For Producing Multilayer Printed Wiring Boar App 20190309130 - NAGAI; Yuki ; et al.	2019-10-10
Resin Composition, Laminate Sheet, And Multilayer Printed Wiring Board App 20190241729 - TANIGAWA; Takao ; et al.	2019-08-08
Resin Composition, Resin Layer-provided Support, Prepreg, Laminate Sheet, Multilayer Printed Wiring Board, And Printed Wiring Bo App 20190241717 - TANIGAWA; Takao ; et al.	2019-08-08
Multilayer Transmission Line Plate App 20190023899 - TANIGAWA; Takao ; et al.	2019-01-24
Resin Composition, Prepreg, Laminate And Multilayer Printed Wiring Board App 20180134842 - NAGAI; Yuki ; et al.	2018-05-17
Multilayer Transmission Line Plate App 20180139837 - KONDOU; Yuusuke ; et al.	2018-05-17
Thermosetting Resin Composition, Prepreg, Laminate And Multilayer Printed Wiring Board App 20180127547 - TANIGAWA; Takao ; et al.	2018-05-10
Resin Composition, Support With Resin Layer, Prepreg, Laminate, Multilayered Printed Wiring Board, And Printed Wiring Board For Millimeter-wave Radar App 20180002485 - TANIGAWA; Takao ; et al.	2018-01-04
Polyphenylene ether derivative having N-substituted maleimide group, and heat curable resin composition, resin varnish, prepreg, metal-clad laminate, and multilayer printed wiring board using same Grant 9,828,466 - Mizuno , et al. November 28, 2	2017-11-28
Polyphenylene Ether Derivative Having N-substituted Maleimide Group, And Heat Curable Resin Composition, Resin Varnish, Prepreg, Metal-clad Laminate, And Multilayer Printed Wiring Board Using Same App 20170051109 - MIZUNO; Yasuyuki ; et al.	2017-02-23

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