TANIE; Hisashi
Patent Applications and Registrations
Patent applications and USPTO patent grants for TANIE; Hisashi.The latest application filed is for "failure probability evaluation device and failure probability evaluation method".
Company Profile
6.27.43
- TANIE; Hisashi - Tokyo JP
- TANIE; Hisashi - Ibaraki JP
- Tanie; Hisashi - Mito JP
- Tanie; Hisashi - Hitachi JP
- Tanie; Hisashi - Hitachi-shi JP
- Tanie; Hisashi - Mito-shi JP
- Tanie; Hisashi - Chiyoda-ku JP
- Tanie; Hisashi - Tsuchiura JP
- TANIE; Hisashi - Hitachinaka-shi JP
- Tanie, Hisashi - Tsuchiura-shi JP
Patent Activity
| Patent | Date |
|---|---|
| Failure Probability Evaluation Device And Failure Probability Evaluation Method App 20220283889 - SHINTANI; Hiroshi ; et al. | 2022-09-08 |
| Test jig and test method Grant 11,125,665 - Tanie , et al. September 21, 2 | 2021-09-21 |
| Disk Brake App 20210262538 - MATSUSHITA; Kohei ; et al. | 2021-08-26 |
| Semiconductor device and production method therefor Grant 11,088,042 - Tanie , et al. August 10, 2 | 2021-08-10 |
| Semiconductor Device App 20210143081 - TAKEDA; Naoki ; et al. | 2021-05-13 |
| Electromechanical integral motor Grant 10,804,765 - Tanie , et al. October 13, 2 | 2020-10-13 |
| Ceramic Substrate App 20200296828 - TANIE; Hisashi ; et al. | 2020-09-17 |
| Semiconductor Device And Production Method Therefor App 20200203241 - TANIE; Hisashi ; et al. | 2020-06-25 |
| Axial gap rotary electric machine Grant 10,566,876 - Enomoto , et al. Feb | 2020-02-18 |
| Test Jig and Test Method App 20190293534 - TANIE; Hisashi ; et al. | 2019-09-26 |
| Axial Gap Rotary Electric Machine App 20190058374 - ENOMOTO; Yuji ; et al. | 2019-02-21 |
| Electromechanical Integral Motor App 20180358863 - TANIE; Hisashi ; et al. | 2018-12-13 |
| Power module and method for manufacturing the same Grant 10,080,313 - Shintani , et al. September 18, 2 | 2018-09-18 |
| Power-module device, power conversion device, and method for manufacturing power-module device Grant 10,064,310 - Tanie , et al. August 28, 2 | 2018-08-28 |
| Power module Grant 9,912,248 - Shimazu , et al. March 6, 2 | 2018-03-06 |
| Power conversion apparatus including wedge inserts Grant 9,870,974 - Ide , et al. January 16, 2 | 2018-01-16 |
| Power-Module Device, Power Conversion Device, and Method for Manufacturing Power-Module Device App 20170325360 - TANIE; Hisashi ; et al. | 2017-11-09 |
| Power Module App 20170187300 - SHIMAZU; Hiromi ; et al. | 2017-06-29 |
| Power Conversion Apparatus App 20170069562 - IDE; Eiichi ; et al. | 2017-03-09 |
| Power Module And Method For Manufacturing The Same App 20160322281 - SHINTANI; Hiroshi ; et al. | 2016-11-03 |
| Method And Apparatus For Producing Nanostructures, And Substrate Structure Including Nanostructures App 20160108514 - TANIE; Hisashi ; et al. | 2016-04-21 |
| Semiconductor Device And Method For Manufacturing The Same App 20150333024 - TANIE; Hisashi ; et al. | 2015-11-19 |
| Power semiconductor device Grant 9,013,877 - Harubeppu , et al. April 21, 2 | 2015-04-21 |
| Semiconductor Device and Manufacturing Method Thereof App 20140252576 - Tanie; Hisashi ; et al. | 2014-09-11 |
| Semiconductor device having penetration electrode penetrating through semiconductor substrate Grant 8,816,478 - Kanegae , et al. August 26, 2 | 2014-08-26 |
| Semiconductor device and stacked semiconductor device Grant 8,513,803 - Sasaki , et al. August 20, 2 | 2013-08-20 |
| Semiconductor Device Having Penetration Electrode Penetrating Through Semiconductor Substrate App 20130181345 - Kanegae; Yoshiharu ; et al. | 2013-07-18 |
| Power Semiconductor Device App 20130135824 - Harubeppu; Yu ; et al. | 2013-05-30 |
| Semiconductor Device And Stacked Semiconductor Device App 20130093083 - SASAKI; Dai ; et al. | 2013-04-18 |
| Life Prediction Method Of Electronic Device And Design Method Of Electronic Device Using The Method App 20130067424 - YAMAMOTO; Kenichi ; et al. | 2013-03-14 |
| Semiconductor device including semiconductor chips with different thickness Grant 8,372,693 - Katagiri , et al. February 12, 2 | 2013-02-12 |
| Semiconductor device including arrangement to control connection height and alignment between a plurity of stacked semiconductor chips Grant 8,368,195 - Tanie , et al. February 5, 2 | 2013-02-05 |
| Semiconductor Device Including Semiconductor Chips With Different Thickness App 20120302007 - KATAGIRI; Mitsuaki ; et al. | 2012-11-29 |
| Semiconductor device including semiconductor chips with different thickness Grant 8,237,251 - Katagiri , et al. August 7, 2 | 2012-08-07 |
| BGA semiconductor device having a dummy bump Grant 8,222,737 - Watanabe , et al. July 17, 2 | 2012-07-17 |
| BGA semiconductor device having a dummy bump Grant 8,164,186 - Watanabe , et al. April 24, 2 | 2012-04-24 |
| Semiconductor device Grant 8,053,908 - Tanie , et al. November 8, 2 | 2011-11-08 |
| Semiconductor device having improved solder joint and internal lead lifetimes Grant 7,960,846 - Katagiri , et al. June 14, 2 | 2011-06-14 |
| Bga Semiconductor Device Having A Dummy Bump App 20100295179 - Watanabe; Yuji ; et al. | 2010-11-25 |
| Semiconductor device App 20100295162 - Katagiri; Mitsuaki ; et al. | 2010-11-25 |
| Semiconductor Device And Stacked Semiconductor Device In Which Circuit Board And Semiconductor Chip Are Connected By Leads App 20100224984 - SASAKI; Dai ; et al. | 2010-09-09 |
| Semiconductor Device App 20100193936 - TANIE; Hisashi ; et al. | 2010-08-05 |
| Semiconductor Device And Method For Manufacturing The Same App 20100171209 - Tanie; Hisashi ; et al. | 2010-07-08 |
| Semiconductor device, method for manufacturing the same, and flexible substrate for mounting semiconductor Grant 7,714,425 - Yamaguchi , et al. May 11, 2 | 2010-05-11 |
| Stack Type Semiconductor Device With Reinforcing Resin App 20100052133 - TANIE; Hisashi ; et al. | 2010-03-04 |
| Semiconductor Device And Method Of Manufacturing The Same App 20100038767 - MORIYA; Hiroshi ; et al. | 2010-02-18 |
| Semiconductor device having improved wiring Grant 7,659,623 - Watanabe , et al. February 9, 2 | 2010-02-09 |
| Semiconductor module in which a semiconductor package is bonded on a mount substrate Grant 7,573,128 - Tanie , et al. August 11, 2 | 2009-08-11 |
| Semiconductor Device Including Semiconductor Chips With Different Thickness App 20090184409 - KATAGIRI; Mitsuaki ; et al. | 2009-07-23 |
| Semiconductor Device Having Improved Solder Joint And Internal Lead Lifetimes App 20090140412 - Katagiri; Mitsuaki ; et al. | 2009-06-04 |
| Semiconductor Device, Method For Manufacturing The Same, And Flexible Substrate For Mounting Semiconductor App 20090134506 - YAMAGUCHI; Masahiro ; et al. | 2009-05-28 |
| Semiconductor Apparatus App 20090134498 - IKEDA; Hiroaki ; et al. | 2009-05-28 |
| Mechanical quantity measuring apparatus Grant 7,518,202 - Tanie , et al. April 14, 2 | 2009-04-14 |
| Semiconductor device having improved solder joint and internal lead lifetimes Grant 7,504,734 - Katagiri , et al. March 17, 2 | 2009-03-17 |
| Semiconductor Device App 20080150115 - Watanabe; Yuji ; et al. | 2008-06-26 |
| Semiconductor device Grant 7,239,010 - Tanie July 3, 2 | 2007-07-03 |
| Semiconductor device and manufacturing method thereof App 20070126095 - Tanie; Hisashi | 2007-06-07 |
| Stacked type semiconductor device App 20060249829 - Katagiri; Mitsuaki ; et al. | 2006-11-09 |
| Semiconductor device Grant 7,119,428 - Tanie , et al. October 10, 2 | 2006-10-10 |
| Mechanical quantity measuring apparatus App 20060216848 - Tanie; Hisashi ; et al. | 2006-09-28 |
| Semiconductor device having improved solder joint and internal lead lifetimes App 20050236697 - Katagiri, Mitsuaki ; et al. | 2005-10-27 |
| Semiconductor device App 20050230829 - Watanabe, Yuji ; et al. | 2005-10-20 |
| BGA semiconductor device having a dummy bump App 20050230824 - Watanabe, Yuji ; et al. | 2005-10-20 |
| Semiconductor device App 20050212104 - Tanie, Hisashi | 2005-09-29 |
| Semiconductor device App 20050189639 - Tanie, Hisashi ; et al. | 2005-09-01 |
| Semiconductor module App 20050001302 - Tanie, Hisashi ; et al. | 2005-01-06 |
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