loadpatents
Patent applications and USPTO patent grants for TANIE; Hisashi.The latest application filed is for "failure probability evaluation device and failure probability evaluation method".
Patent | Date |
---|---|
Failure Probability Evaluation Device And Failure Probability Evaluation Method App 20220283889 - SHINTANI; Hiroshi ;   et al. | 2022-09-08 |
Test jig and test method Grant 11,125,665 - Tanie , et al. September 21, 2 | 2021-09-21 |
Disk Brake App 20210262538 - MATSUSHITA; Kohei ;   et al. | 2021-08-26 |
Semiconductor device and production method therefor Grant 11,088,042 - Tanie , et al. August 10, 2 | 2021-08-10 |
Semiconductor Device App 20210143081 - TAKEDA; Naoki ;   et al. | 2021-05-13 |
Electromechanical integral motor Grant 10,804,765 - Tanie , et al. October 13, 2 | 2020-10-13 |
Ceramic Substrate App 20200296828 - TANIE; Hisashi ;   et al. | 2020-09-17 |
Semiconductor Device And Production Method Therefor App 20200203241 - TANIE; Hisashi ;   et al. | 2020-06-25 |
Axial gap rotary electric machine Grant 10,566,876 - Enomoto , et al. Feb | 2020-02-18 |
Test Jig and Test Method App 20190293534 - TANIE; Hisashi ;   et al. | 2019-09-26 |
Axial Gap Rotary Electric Machine App 20190058374 - ENOMOTO; Yuji ;   et al. | 2019-02-21 |
Electromechanical Integral Motor App 20180358863 - TANIE; Hisashi ;   et al. | 2018-12-13 |
Power module and method for manufacturing the same Grant 10,080,313 - Shintani , et al. September 18, 2 | 2018-09-18 |
Power-module device, power conversion device, and method for manufacturing power-module device Grant 10,064,310 - Tanie , et al. August 28, 2 | 2018-08-28 |
Power module Grant 9,912,248 - Shimazu , et al. March 6, 2 | 2018-03-06 |
Power conversion apparatus including wedge inserts Grant 9,870,974 - Ide , et al. January 16, 2 | 2018-01-16 |
Power-Module Device, Power Conversion Device, and Method for Manufacturing Power-Module Device App 20170325360 - TANIE; Hisashi ;   et al. | 2017-11-09 |
Power Module App 20170187300 - SHIMAZU; Hiromi ;   et al. | 2017-06-29 |
Power Conversion Apparatus App 20170069562 - IDE; Eiichi ;   et al. | 2017-03-09 |
Power Module And Method For Manufacturing The Same App 20160322281 - SHINTANI; Hiroshi ;   et al. | 2016-11-03 |
Method And Apparatus For Producing Nanostructures, And Substrate Structure Including Nanostructures App 20160108514 - TANIE; Hisashi ;   et al. | 2016-04-21 |
Semiconductor Device And Method For Manufacturing The Same App 20150333024 - TANIE; Hisashi ;   et al. | 2015-11-19 |
Power semiconductor device Grant 9,013,877 - Harubeppu , et al. April 21, 2 | 2015-04-21 |
Semiconductor Device and Manufacturing Method Thereof App 20140252576 - Tanie; Hisashi ;   et al. | 2014-09-11 |
Semiconductor device having penetration electrode penetrating through semiconductor substrate Grant 8,816,478 - Kanegae , et al. August 26, 2 | 2014-08-26 |
Semiconductor device and stacked semiconductor device Grant 8,513,803 - Sasaki , et al. August 20, 2 | 2013-08-20 |
Semiconductor Device Having Penetration Electrode Penetrating Through Semiconductor Substrate App 20130181345 - Kanegae; Yoshiharu ;   et al. | 2013-07-18 |
Power Semiconductor Device App 20130135824 - Harubeppu; Yu ;   et al. | 2013-05-30 |
Semiconductor Device And Stacked Semiconductor Device App 20130093083 - SASAKI; Dai ;   et al. | 2013-04-18 |
Life Prediction Method Of Electronic Device And Design Method Of Electronic Device Using The Method App 20130067424 - YAMAMOTO; Kenichi ;   et al. | 2013-03-14 |
Semiconductor device including semiconductor chips with different thickness Grant 8,372,693 - Katagiri , et al. February 12, 2 | 2013-02-12 |
Semiconductor device including arrangement to control connection height and alignment between a plurity of stacked semiconductor chips Grant 8,368,195 - Tanie , et al. February 5, 2 | 2013-02-05 |
Semiconductor Device Including Semiconductor Chips With Different Thickness App 20120302007 - KATAGIRI; Mitsuaki ;   et al. | 2012-11-29 |
Semiconductor device including semiconductor chips with different thickness Grant 8,237,251 - Katagiri , et al. August 7, 2 | 2012-08-07 |
BGA semiconductor device having a dummy bump Grant 8,222,737 - Watanabe , et al. July 17, 2 | 2012-07-17 |
BGA semiconductor device having a dummy bump Grant 8,164,186 - Watanabe , et al. April 24, 2 | 2012-04-24 |
Semiconductor device Grant 8,053,908 - Tanie , et al. November 8, 2 | 2011-11-08 |
Semiconductor device having improved solder joint and internal lead lifetimes Grant 7,960,846 - Katagiri , et al. June 14, 2 | 2011-06-14 |
Bga Semiconductor Device Having A Dummy Bump App 20100295179 - Watanabe; Yuji ;   et al. | 2010-11-25 |
Semiconductor device App 20100295162 - Katagiri; Mitsuaki ;   et al. | 2010-11-25 |
Semiconductor Device And Stacked Semiconductor Device In Which Circuit Board And Semiconductor Chip Are Connected By Leads App 20100224984 - SASAKI; Dai ;   et al. | 2010-09-09 |
Semiconductor Device App 20100193936 - TANIE; Hisashi ;   et al. | 2010-08-05 |
Semiconductor Device And Method For Manufacturing The Same App 20100171209 - Tanie; Hisashi ;   et al. | 2010-07-08 |
Semiconductor device, method for manufacturing the same, and flexible substrate for mounting semiconductor Grant 7,714,425 - Yamaguchi , et al. May 11, 2 | 2010-05-11 |
Stack Type Semiconductor Device With Reinforcing Resin App 20100052133 - TANIE; Hisashi ;   et al. | 2010-03-04 |
Semiconductor Device And Method Of Manufacturing The Same App 20100038767 - MORIYA; Hiroshi ;   et al. | 2010-02-18 |
Semiconductor device having improved wiring Grant 7,659,623 - Watanabe , et al. February 9, 2 | 2010-02-09 |
Semiconductor module in which a semiconductor package is bonded on a mount substrate Grant 7,573,128 - Tanie , et al. August 11, 2 | 2009-08-11 |
Semiconductor Device Including Semiconductor Chips With Different Thickness App 20090184409 - KATAGIRI; Mitsuaki ;   et al. | 2009-07-23 |
Semiconductor Device Having Improved Solder Joint And Internal Lead Lifetimes App 20090140412 - Katagiri; Mitsuaki ;   et al. | 2009-06-04 |
Semiconductor Apparatus App 20090134498 - IKEDA; Hiroaki ;   et al. | 2009-05-28 |
Semiconductor Device, Method For Manufacturing The Same, And Flexible Substrate For Mounting Semiconductor App 20090134506 - YAMAGUCHI; Masahiro ;   et al. | 2009-05-28 |
Mechanical quantity measuring apparatus Grant 7,518,202 - Tanie , et al. April 14, 2 | 2009-04-14 |
Semiconductor device having improved solder joint and internal lead lifetimes Grant 7,504,734 - Katagiri , et al. March 17, 2 | 2009-03-17 |
Semiconductor Device App 20080150115 - Watanabe; Yuji ;   et al. | 2008-06-26 |
Semiconductor device Grant 7,239,010 - Tanie July 3, 2 | 2007-07-03 |
Semiconductor device and manufacturing method thereof App 20070126095 - Tanie; Hisashi | 2007-06-07 |
Stacked type semiconductor device App 20060249829 - Katagiri; Mitsuaki ;   et al. | 2006-11-09 |
Semiconductor device Grant 7,119,428 - Tanie , et al. October 10, 2 | 2006-10-10 |
Mechanical quantity measuring apparatus App 20060216848 - Tanie; Hisashi ;   et al. | 2006-09-28 |
Semiconductor device having improved solder joint and internal lead lifetimes App 20050236697 - Katagiri, Mitsuaki ;   et al. | 2005-10-27 |
Semiconductor device App 20050230829 - Watanabe, Yuji ;   et al. | 2005-10-20 |
BGA semiconductor device having a dummy bump App 20050230824 - Watanabe, Yuji ;   et al. | 2005-10-20 |
Semiconductor device App 20050212104 - Tanie, Hisashi | 2005-09-29 |
Semiconductor device App 20050189639 - Tanie, Hisashi ;   et al. | 2005-09-01 |
Semiconductor module App 20050001302 - Tanie, Hisashi ;   et al. | 2005-01-06 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.