Tang; Yoke Kuin
Patent Applications and Registrations
Patent applications and USPTO patent grants for Tang; Yoke Kuin.The latest application filed is for "boc bga package for die with i-shaped bond pad layout".
- Tang; Yoke Kuin - Singapore SG
| Patent | Date |
|---|---|
| BOC BGA package for die with I-shaped bond pad layout Grant 7,112,048 - Lim , et al. September 26, 2 | 2006-09-26 |
| BOC BGA package for die with I-shaped bond pad layout Grant 6,720,666 - Lim , et al. April 13, 2 | 2004-04-13 |
| BOC BGA package for die with I-shaped bond pad layout Grant 6,692,987 - Lim , et al. February 17, 2 | 2004-02-17 |
| BOC BGA package for die with I-shaped bond pad layout App 20030211660 - Lim, Thiam Chye ; et al. | 2003-11-13 |
| BOC BGA package for die with I-shaped bond pad layout App 20030211659 - Lim, Thiam Chye ; et al. | 2003-11-13 |
| BOC BGA package for die with I-shaped bond pad layout App 20030148557 - Lim, Thiam Chye ; et al. | 2003-08-07 |
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