Tang; Yen Hsi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tang; Yen Hsi.The latest application filed is for "direct transfer apparatus for electronic components".

Company Profile

0.6.7

Tang; Yen Hsi - Hong Kong HK
TANG; Yen Hsi - Kwai Chung HK

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Direct transfer apparatus for electronic components Grant 11,136,202 - Lam , et al. October 5, 2	2021-10-05
Direct Transfer Apparatus For Electronic Components App 20210206585 - LAM; Kui Kam ; et al.	2021-07-08
Bonding Apparatus Having A Plurality Of Rotary Transfer Arms For Transferring Electronic Devices For Bonding App 20140341691 - LAM; Kui Kam ; et al.	2014-11-20
Apparatus and method for locating a plurality of placement positions on a carrier object Grant 8,804,136 - Lam , et al. August 12, 2	2014-08-12
Apparatus And Method For Locating A Plurality Of Placement Positions On A Carrier Object App 20140160492 - LAM; Kui Kam ; et al.	2014-06-12
Apparatus for delivering semiconductor components to a substrate Grant 8,590,143 - Lam , et al. November 26, 2	2013-11-26
Apparatus For Delivering Semiconductor Components To A Substrate During Semiconductor Package Manufacturing App 20120301251 - LAM; Kui Kam ; et al.	2012-11-29
Method Of Die Bonding Onto Dispensed Adhesives App 20120094440 - CHUNG; Kwok Kee ; et al.	2012-04-19
Die bonder incorporating dual-head dispenser Grant 7,977,231 - Lam , et al. July 12, 2	2011-07-12

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