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Integrated heat spreader with multiple channels for multichip packages
Grant 11,444,003 - Wan , et al. September 13, 2 | 2022-09-13 |
Sloped metal features for cooling hotspots in stacked-die packages
Grant 11,398,414 - Wan , et al. July 26, 2 | 2022-07-26 |
Self-diagnosis system for wireless transceivers with multiple antennas
Grant 11,374,605 - Tang June 28, 2 | 2022-06-28 |
Thermal Spreading Management Of 3d Stacked Integrated Circuits
App 20210398966 - Sankman; Robert L. ; et al. | 2021-12-23 |
Thermally Enhanced Silicon Back End Layers For Improved Thermal Performance
App 20210391244 - JHA; Chandra Mohan ; et al. | 2021-12-16 |
Thermal spreading management of 3D stacked integrated circuits
Grant 11,127,727 - Sankman , et al. September 21, 2 | 2021-09-21 |
Hybrid Backside Thermal Structures For Enhanced Ic Packages
App 20210249375 - Eid; Feras ; et al. | 2021-08-12 |
Thermal Spreading Management Of 3d Stacked Integrated Circuits
App 20200388603 - Sankman; Robert L. ; et al. | 2020-12-10 |
Thermoelectric Coolers Combined With Phase-change Material In Integrated Circuit Packages
App 20200294884 - Shaikh; Javed ; et al. | 2020-09-17 |
Coupled Cooling Fins In Ultra-small Systems
App 20200273772 - Uppal; Aastha ; et al. | 2020-08-27 |
Phase Change Materials For Electromagnetic Interference Shielding And Heat Dissipation In Integrated Circuit Assemblies
App 20200219790 - Uppal; Aastha ; et al. | 2020-07-09 |
Thermal Management Solutions For Integrated Circuit Assemblies Using Phase Change Materials
App 20200219789 - Uppal; Aastha ; et al. | 2020-07-09 |
Dual Side Die Packaging For Enhanced Heat Dissipation
App 20200111720 - Wan; Zhimin ; et al. | 2020-04-09 |
Integrated Heat Spreader With Multiple Channels For Multichip Packages
App 20200105643 - WAN; ZHIMIN ; et al. | 2020-04-02 |
Package Architecture Including Thermoelectric Cooler Structures
App 20200105639 - Valavala; Krishna Vasanth ; et al. | 2020-04-02 |
Sloped Metal Features For Cooling Hotspots In Stacked-die Packages
App 20200098666 - WAN; ZHIMIN ; et al. | 2020-03-26 |
System and method for performing channel estimation on an OFDM signal
Grant 9,608,844 - Tang , et al. March 28, 2 | 2017-03-28 |
Fluid Flow In A Temperature Control Actuator For Semiconductor Device Test
App 20160377658 - DIGLIO; Paul J. ; et al. | 2016-12-29 |
System And Method For Performing Channel Estimation On An Ofdm Signal
App 20150349981 - Tang; Weihua ; et al. | 2015-12-03 |
Reduced latency channel-estimation
Grant 9,071,492 - Tang , et al. June 30, 2 | 2015-06-30 |
Non-uniform Heater For Reduced Temperature Gradient During Thermal Compression Bonding
App 20150060527 - Tang; Weihua ; et al. | 2015-03-05 |
Die Connections Using Different Underfill Types For Different Regions
App 20150001736 - Shi; Hualiang ; et al. | 2015-01-01 |
Hybrid solder and filled paste in microelectronic packaging
Grant 8,920,934 - Jiang , et al. December 30, 2 | 2014-12-30 |
Multi-standard viterbi processor
Grant 8,904,266 - Tang , et al. December 2, 2 | 2014-12-02 |
Hybrid Solder And Filled Paste In Microelectronic Packaging
App 20140291843 - Jiang; Hongjin ; et al. | 2014-10-02 |
Reduced Latency Channel-estimation
App 20130279558 - TANG; Weihua ; et al. | 2013-10-24 |
Power-reduced preliminary decoded bits in viterbi decoders
Grant 8,566,683 - Hekstra , et al. October 22, 2 | 2013-10-22 |
Multi-standard Viterbi Processor
App 20120042229 - Tang; Weihua ; et al. | 2012-02-16 |
Power-reduced Preliminary Decoded Bits In Viterbi Decoders
App 20110161787 - Hekstra; Andries Pieter ; et al. | 2011-06-30 |
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