Tang; Wallace T. Y.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tang; Wallace T. Y..The latest application filed is for "apparatus for detection of thin films during chemical/mechanical polishing planarization".

Company Profile

0.7.4

Tang; Wallace T. Y. - Warren NJ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Apparatus for detection of thin films during chemical/mechanical polishing planarization Grant 7,582,183 - Tang September 1, 2	2009-09-01
In-situ real-time monitoring technique and apparatus for detection of thin films during chemical/mechanical polishing planarization Grant 7,569,119 - Tang August 4, 2	2009-08-04
Apparatus For Detection Of Thin Films During Chemical/mechanical Polishing Planarization App 20080060758 - Tang; Wallace T. Y.	2008-03-13
In-situ real-time monitoring technique and apparatus for detection of thin films during chemical/mechanical polishing planarization App 20060151111 - Tang; Wallace T. Y.	2006-07-13
In-situ real-time monitoring technique and apparatus for detection of thin films during chemical/mechanical polishing planarization Grant 7,037,403 - Tang May 2, 2	2006-05-02
In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization Grant 7,024,063 - Tang April 4, 2	2006-04-04
In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization App 20050146728 - Tang, Wallace T. Y.	2005-07-07
In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization Grant 6,849,152 - Tang February 1, 2	2005-02-01
In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization Grant 6,614,529 - Tang September 2, 2	2003-09-02
In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization App 20020013058 - Tang, Wallace T. Y.	2002-01-31
In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization Grant 5,949,927 - Tang September 7, 1	1999-09-07

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