loadpatents
Patent applications and USPTO patent grants for Tang; Tzu-Chun.The latest application filed is for "package structure and manufacturing method thereof".
Patent | Date |
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Package structure including a solenoid inductor laterally aside a die and method of fabricating the same Grant 11,450,628 - Tang , et al. September 20, 2 | 2022-09-20 |
Package Structure And Manufacturing Method Thereof App 20220285331 - Wang; Chuei-Tang ;   et al. | 2022-09-08 |
Integrated Fan-out Package App 20220270990 - Wang; Chuei-Tang ;   et al. | 2022-08-25 |
Integrated fan-out package Grant 11,348,886 - Wang , et al. May 31, 2 | 2022-05-31 |
Package structure and method of fabricating the same Grant 11,335,767 - Yu , et al. May 17, 2 | 2022-05-17 |
Integrated fan-out package and manufacturing method thereof Grant 11,282,810 - Wan , et al. March 22, 2 | 2022-03-22 |
Electronic Apparatus App 20220059450 - Tang; Tzu-Chun ;   et al. | 2022-02-24 |
Semiconductor device Grant 11,211,339 - Wang , et al. December 28, 2 | 2021-12-28 |
Packaged semiconductor devices and packaging methods Grant 11,211,358 - Tang , et al. December 28, 2 | 2021-12-28 |
Electronic apparatus including antennas and directors Grant 11,171,088 - Tang , et al. November 9, 2 | 2021-11-09 |
Package Structure And Method Of Fabricating The Same App 20210183794 - Tang; Tzu-Chun ;   et al. | 2021-06-17 |
Package structure Grant 10,867,938 - Tang , et al. December 15, 2 | 2020-12-15 |
Electronic device and manufacturing method thereof Grant 10,868,353 - Lu , et al. December 15, 2 | 2020-12-15 |
Stacked coil for wireless charging structure on InFO package Grant 10,825,602 - Yu , et al. November 3, 2 | 2020-11-03 |
Integrated Fan-out Package And Manufacturing Method Thereof App 20200335477 - Wan; Albert ;   et al. | 2020-10-22 |
Integrated Fan-out Package App 20200294943 - Wang; Chuei-Tang ;   et al. | 2020-09-17 |
Package structure and method of manufacturing the same Grant 10,777,518 - Wang , et al. Sept | 2020-09-15 |
Method of manufacturing integrated fan-out package Grant 10,756,052 - Wan , et al. A | 2020-08-25 |
Integrated fan-out package Grant 10,672,728 - Wang , et al. | 2020-06-02 |
Packaged Semiconductor Devices and Packaging Methods App 20200118971 - Tang; Tzu-Chun ;   et al. | 2020-04-16 |
Semiconductor Device App 20200111753 - WANG; CHUEI-TANG ;   et al. | 2020-04-09 |
Electronic Device And Manufacturing Method Thereof App 20200106156 - Lu; Chun-Lin ;   et al. | 2020-04-02 |
Integrated Fan-out Package App 20200105687 - Wang; Chuei-Tang ;   et al. | 2020-04-02 |
Stacked Coil for Wireless Charging Structure on InFO Package App 20200090855 - Yu; Chen-Hua ;   et al. | 2020-03-19 |
Semiconductor device Grant 10,510,681 - Wang , et al. Dec | 2019-12-17 |
Packaged semiconductor devices and packaging methods Grant 10,510,714 - Tang , et al. Dec | 2019-12-17 |
Stacked coil for wireless charging structure on InFO package Grant 10,510,478 - Yu , et al. Dec | 2019-12-17 |
Method Of Manufacturing Integrated Fan-out Package App 20190355694 - Wan; Albert ;   et al. | 2019-11-21 |
Stacked Coil for Wireless Charging Structure on InFO Package App 20190279810 - Yu; Chen-Hua ;   et al. | 2019-09-12 |
Method of manufacturing integrated fan-out package Grant 10,366,966 - Wan , et al. July 30, 2 | 2019-07-30 |
Stacked coil for wireless charging structure on InFO package Grant 10,304,614 - Yu , et al. | 2019-05-28 |
Electronic Apparatus App 20190122978 - Tang; Tzu-Chun ;   et al. | 2019-04-25 |
Stacked coil for wireless charging structure on InFO package Grant 10,269,481 - Yu , et al. | 2019-04-23 |
Package Structure App 20190096829 - Tang; Tzu-Chun ;   et al. | 2019-03-28 |
Stacked Coil for Wireless Charging Structure on InFO Package App 20190096565 - Yu; Chen-Hua ;   et al. | 2019-03-28 |
Package Structure And Method Of Fabricating The Same App 20190035877 - Yu; Chen-Hua ;   et al. | 2019-01-31 |
Electronic apparatus Grant 10,157,834 - Tang , et al. Dec | 2018-12-18 |
Packaged Semiconductor Devices and Packaging Methods App 20180350771 - Tang; Tzu-Chun ;   et al. | 2018-12-06 |
Semiconductor Device App 20180350752 - WANG; CHUEI-TANG ;   et al. | 2018-12-06 |
Fan-out package structure, antenna system and associated method Grant 10,128,203 - Chen , et al. November 13, 2 | 2018-11-13 |
Packaged semiconductor devices and packaging methods Grant 10,050,013 - Tang , et al. August 14, 2 | 2018-08-14 |
Semiconductor device and manufacturing method thereof Grant 10,043,761 - Wang , et al. August 7, 2 | 2018-08-07 |
Stacked Coil for Wireless Charging Structure on InFO Package App 20170345548 - Yu; Chen-Hua ;   et al. | 2017-11-30 |
Fan-out Package Structure, Antenna System And Associated Method App 20170221838 - CHEN; WEI-TING ;   et al. | 2017-08-03 |
Packaged Semiconductor Devices and Packaging Methods App 20170186726 - Tang; Tzu-Chun ;   et al. | 2017-06-29 |
Semiconductor Device And Manufacturing Method Thereof App 20170110412 - WANG; CHUEI-TANG ;   et al. | 2017-04-20 |
Semiconductor structure and manufacturing method thereof Grant 9,601,439 - Tang , et al. March 21, 2 | 2017-03-21 |
Semiconductor Structure And Manufacturing Method Thereof App 20170062353 - TANG; TZU-CHUN ;   et al. | 2017-03-02 |
Multiple-input multiple-output antenna device Grant 9,312,608 - Tang , et al. April 12, 2 | 2016-04-12 |
MIMO antenna device, antenna and antenna package Grant 9,059,519 - Lin , et al. June 16, 2 | 2015-06-16 |
Mimo Antenna Device, Antenna And Antenna Package App 20130321234 - LIN; Ken-Huang ;   et al. | 2013-12-05 |
Multiple-input Multiple-output Antenna Device App 20130271345 - Tang; Tzu-Chun ;   et al. | 2013-10-17 |
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