TANG; Sum-Yee Betty

Patent Applications and Registrations

Patent applications and USPTO patent grants for TANG; Sum-Yee Betty.The latest application filed is for "low refractive index coating deposited by remote plasma cvd".

Company Profile

0.5.10

TANG; Sum-Yee Betty - Cupertino CA
Tang; Sum-Yee Betty - San Jose CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Low Refractive Index Coating Deposited By Remote Plasma Cvd App 20140091417 - TANG; Sum-Yee Betty ; et al.	2014-04-03
Fluorocarbon Coating Having Low Refractive Index App 20140091379 - TANG; Sum-Yee Betty ; et al.	2014-04-03
Graded ARC for high NA and immersion lithography Grant 8,125,034 - Yeh , et al. February 28, 2	2012-02-28
Pecvd Multi-step Processing With Continuous Plasma App 20110151142 - Seamons; Martin Jay ; et al.	2011-06-23
Graded Arc For High Na And Immersion Lithography App 20100239979 - Yeh; Wendy H. ; et al.	2010-09-23
Graded ARC for high NA and immersion lithography Grant 7,776,516 - Yeh , et al. August 17, 2	2010-08-17
Liquid precursors for the CVD deposition of amorphous carbon films Grant 7,407,893 - Seamons , et al. August 5, 2	2008-08-05
Graded ARC for high na and immersion lithography App 20080020319 - Yeh; Wendy H. ; et al.	2008-01-24
Enhancement of remote plasma source clean for dielectric films App 20070207275 - Nowak; Thomas ; et al.	2007-09-06
Liquid precursors for the CVD deposition of amorphous carbon films App 20050287771 - Seamons, Martin Jay ; et al.	2005-12-29
Stress-tuned, single-layer silicon nitride film App 20050170104 - Jung, KeeBum ; et al.	2005-08-04
Etch process for dielectric materials comprising oxidized organo silane materials Grant 6,762,127 - Boiteux , et al. July 13, 2	2004-07-13
Etch process for dielectric materials comprising oxidized organo silane materials App 20030073321 - Boiteux, Yves Pierre ; et al.	2003-04-17
In-situ integrated oxide etch process particularly useful for copper dual damascene Grant 6,380,096 - Hung , et al. April 30, 2	2002-04-30
In-situ Integrated Oxide Etch Process Particularly Useful For Copper Dual Damascene App 20010008226 - HUNG, HOIMAN ; et al.	2001-07-19

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