Tang; Shao-Tzu
Patent Applications and Registrations
Patent applications and USPTO patent grants for Tang; Shao-Tzu.The latest application filed is for "method for fabricating package structure".
- Tang; Shao-Tzu - Taichung TW
- - Taichung TW
- Tang; Shao-Tzu - Taiwan TW
- Tang; Shao-Tzu - Taichung City TW
- Tang, Shao-Tzu - Taipei TW
| Patent | Date |
|---|---|
| Method for fabricating package structure having encapsulate sensing chip Grant 11,404,361 - Tang , et al. August 2, 2 | 2022-08-02 |
| Method For Fabricating Package Structure App 20210066173 - Tang; Shao-Tzu ; et al. | 2021-03-04 |
| Package structure and method for fabricating the same Grant 10872847 - | 2020-12-22 |
| Method of fabricating electronic package Grant 10,224,243 - Tang , et al. | 2019-03-05 |
| Fabrication method of circuit structure Grant 10,201,090 - Tang , et al. Fe | 2019-02-05 |
| Package Structure And Method For Fabricating The Same App 20180342446 - Tang; Shao-Tzu ; et al. | 2018-11-29 |
| Fabrication method of semiconductor package Grant 9,991,197 - Chen , et al. June 5, 2 | 2018-06-05 |
| Package structure and method for fabricating the same Grant 9,978,673 - Tang , et al. May 22, 2 | 2018-05-22 |
| Method Of Fabricating Electronic Package App 20180068896 - Tang; Shao-Tzu ; et al. | 2018-03-08 |
| Package Structure And Method For Fabricating The Same App 20180061747 - Tang; Shao-Tzu ; et al. | 2018-03-01 |
| Electronic package and fabrication method thereof Grant 9,805,979 - Tang , et al. October 31, 2 | 2017-10-31 |
| Fabrication Method Of Semiconductor Package App 20170294372 - Chen; Chia-Cheng ; et al. | 2017-10-12 |
| Fabrication Method Of Circuit Structure App 20170273185 - Tang; Shao-Tzu ; et al. | 2017-09-21 |
| Circuit structure and fabrication method thereof Grant 9,699,910 - Tang , et al. July 4, 2 | 2017-07-04 |
| Package on package structure and fabrication method thereof Grant 9,362,217 - Lin , et al. June 7, 2 | 2016-06-07 |
| Electronic Package And Fabrication Method Thereof App 20160133593 - Tang; Shao-Tzu ; et al. | 2016-05-12 |
| Packaging substrate and fabrication method thereof Grant 9,265,154 - Tang , et al. February 16, 2 | 2016-02-16 |
| Circuit Structure And Fabrication Method Thereof App 20150366060 - Tang; Shao-tzu ; et al. | 2015-12-17 |
| Packaging Substrate And Fabrication Method Thereof App 20150305162 - Tang; Shao-tzu ; et al. | 2015-10-22 |
| Fabrication method of semiconductor package Grant 9,112,063 - Hsiao , et al. August 18, 2 | 2015-08-18 |
| Package On Package Structure And Fabrication Method Thereof App 20150091150 - Lin; Pang-Chun ; et al. | 2015-04-02 |
| Fabrication Method Of Semiconductor Package App 20140308780 - Hsiao; Wei Chung ; et al. | 2014-10-16 |
| Semiconductor package and fabrication method thereof Grant 8,796,867 - Hsiao , et al. August 5, 2 | 2014-08-05 |
| Semiconductor Package And Fabrication Method Thereof App 20140091462 - Chen; Chia-Cheng ; et al. | 2014-04-03 |
| Semiconductor Package And Fabrication Method Thereof App 20130307152 - Hsiao; Wei Chung ; et al. | 2013-11-21 |
| Semiconductor Package And Fabrication Method Thereof App 20130292832 - Tang; Shao-Tzu ; et al. | 2013-11-07 |
| Method For Making 8-hydroxyjulolidine Compound App 20020120142 - Chen, Chao-Tsen ; et al. | 2002-08-29 |
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