| Patent | Date |
|---|
Systems And Methods For Dynamic Power And Thermal Management For Programmable Logic Devices
App 20220294455 - Kumashikar; Mahesh K. ; et al. | 2022-09-15 |
Security On Die-to-die Interconnect
App 20220229941 - Tang; Lai Guan ; et al. | 2022-07-21 |
Clocking Architecture For A Multi-die Package
App 20220224342 - Maheshwari; Atul ; et al. | 2022-07-14 |
Modular Periphery Tile For Integrated Circuit Device
App 20220198115 - Teh; Chee Hak ; et al. | 2022-06-23 |
Scalable micro bumps indexing and redundancy scheme for homogeneous configurable integrated circuit dies
Grant 11,336,286 - Tang , et al. May 17, 2 | 2022-05-17 |
Systems And Methods For Configurable Interface Circuits
App 20220109446 - Rotker; Paul ; et al. | 2022-04-07 |
Selective Use Of Different Advanced Interface Bus With Electronic Chips
App 20220102281 - Subbareddy; Dheeraj ; et al. | 2022-03-31 |
Translation Circuitry For An Interconnection In A Semiconductor Package
App 20220092009 - Tang; Lai Guan ; et al. | 2022-03-24 |
Translation circuitry for an interconnection in an active interposer of a semiconductor package
Grant 11,216,397 - Tang , et al. January 4, 2 | 2022-01-04 |
High-speed Core Interconnect For Multi-die Programmable Logic Devices
App 20210384911 - Tang; Lai Guan ; et al. | 2021-12-09 |
Network-on-chip For Inter-die And Intra-die Communication In Modularized Integrated Circuit Devices
App 20210303491 - Ooi; George Chong Hean ; et al. | 2021-09-30 |
High-speed core interconnect for multi-die programmable logic devices
Grant 11,128,301 - Tang , et al. September 21, 2 | 2021-09-21 |
Modular periphery tile for integrated circuit device
Grant 11,080,449 - Teh , et al. August 3, 2 | 2021-08-03 |
Die to die interconnect structure for modularized integrated circuit devices
Grant 11,062,070 - Tang , et al. July 13, 2 | 2021-07-13 |
Network-on-chip for inter-die and intra-die communication in modularized integrated circuit devices
Grant 11,036,660 - Ooi , et al. June 15, 2 | 2021-06-15 |
Fabric Die to Fabric Die Interconnect for Modularized Integrated Circuit Devices
App 20210111116 - Teh; Chee Hak ; et al. | 2021-04-15 |
Fabric die to fabric die interconnect for modularized integrated circuit devices
Grant 10,886,218 - Teh , et al. January 5, 2 | 2021-01-05 |
High-speed Core Interconnect For Multi-die Programmable Logic Devices
App 20200321964 - Tang; Lai Guan ; et al. | 2020-10-08 |
Modular Periphery Tile For Integrated Circuit Device
App 20200226313 - Teh; Chee Hak ; et al. | 2020-07-16 |
High-speed core interconnect for multi-die programmable logic devices
Grant 10,666,261 - Tang , et al. | 2020-05-26 |
Modular periphery tile for integrated circuit device
Grant 10,642,946 - Teh , et al. | 2020-05-05 |
Translation Circuitry For An Interconnection In A Semiconductor Package
App 20200133902 - Tang; Lai Guan ; et al. | 2020-04-30 |
Fabric Die to Fabric Die Interconnect for Modularized Integrated Circuit Devices
App 20190326210 - Teh; Chee Hak ; et al. | 2019-10-24 |
Pulse-width modulation voltage identification interface
Grant 10,382,013 - Tang , et al. A | 2019-08-13 |
Techniques For Clock Signal Transmission In Integrated Circuits And Interposers
App 20190227590 - Chromczak; Jeffrey ; et al. | 2019-07-25 |
Network-on-chip For Inter-die And Intra-die Communication In Modularized Integrated Circuit Devices
App 20190227963 - Ooi; George Chong Hean ; et al. | 2019-07-25 |
Die To Die Interconnect Structure For Modularized Integrated Circuit Devices
App 20190220566 - Tang; Lai Guan ; et al. | 2019-07-18 |
Scalable Micro Bumps Indexing and Redundancy Scheme for Homogeneous Configurable Integrated Circuit Dies
App 20190158096 - Tang; Lai Guan ; et al. | 2019-05-23 |
High-speed Core Interconnect For Multi-die Programmable Logic Devices
App 20190140649 - Tang; Lai Guan ; et al. | 2019-05-09 |
Modular Periphery Tile for Integrated Circuit Device
App 20190138680 - Teh; Chee Hak ; et al. | 2019-05-09 |
Techniques for power control of circuit blocks
Grant 10,211,833 - Tang Feb | 2019-02-19 |
Apparatus to Synchronize Clocks of Configurable Integrated Circuit Dies Through an Interconnect Bridge
App 20190044520 - Tang; Lai Guan ; et al. | 2019-02-07 |
Techniques for generating pulse-width modulation data
Grant 10,177,753 - Tang , et al. J | 2019-01-08 |
Techniques For Power Control Of Circuit Blocks
App 20180083626 - Tang; Lai Guan | 2018-03-22 |
Techniques For Generating Pulse-Width Modulation Data
App 20180041201 - Tang; Lai Guan ; et al. | 2018-02-08 |
Pulse-Width Modulation Voltage Identification Interface
App 20170288648 - Tang; Lai Guan ; et al. | 2017-10-05 |
Graphics render clock throttling and gating mechanism for power saving
Grant 8,780,121 - Chong , et al. July 15, 2 | 2014-07-15 |
Graphics Render Clock Throttling And Gating Mechanism For Power Saving
App 20110148887 - Chong; Lai Kuan ; et al. | 2011-06-23 |
| 