Tang; Jinbang

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tang; Jinbang.The latest application filed is for "semiconductor device assembly and method therefor".

Company Profile

6.39.41

Tang; Jinbang - Chandler AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Packaged pressure sensor device Grant 11,427,464 - Yap , et al. August 30, 2	2022-08-30
Semiconductor Device Assembly And Method Therefor App 20220149000 - Tang; Jinbang	2022-05-12
Semiconductor Device Assembly And Method Therefor App 20220108973 - Tang; Jinbang	2022-04-07
Semiconductor package with compact antenna formed using three-dimensional additive manufacturing process Grant 11,121,467 - Tang , et al. September 14, 2	2021-09-14
Integrated radio package having a built-in multi directional antenna array Grant 11,101,542 - Tang August 24, 2	2021-08-24
Integrated Radio Package Having A Built-in Multi-directional Antenna Array App 20210159584 - Tang; Jinbang	2021-05-27
Packaged Pressure Sensor Device App 20210009405 - Yap; Weng Foong ; et al.	2021-01-14
Semiconductor Package with Compact Antenna Formed Using Three-Dimensional Additive Manufacturing Process App 20200403314 - Tang; Jinbang ; et al.	2020-12-24
Packaged pressure sensor device Grant 10,822,224 - Yap , et al. November 3, 2	2020-11-03
Antenna assembly for wafer level packaging Grant 10,319,689 - Yap , et al.	2019-06-11
Packaged Pressure Sensor Device App 20190112180 - YAP; Weng Foong ; et al.	2019-04-18
Semiconductor device having corrugated leads and method for forming Grant 10,134,660 - Tang , et al. November 20, 2	2018-11-20
Semiconductor Device Having Corrugated Leads And Method For Forming App 20180277464 - TANG; JINBANG ; et al.	2018-09-27
Electrically conductive barriers for integrated circuits Grant 9,714,879 - Dawson , et al. July 25, 2	2017-07-25
Antenna Assembly For Wafer Level Packaging App 20170154859 - Yap; Weng Foong ; et al.	2017-06-01
Interface between a semiconductor die and a waveguide, where the interface is covered by a molding compound Grant 9,666,930 - Tang , et al. May 30, 2	2017-05-30
Electrically Conductive Barriers For Integrated Circuits App 20170052082 - Dawson; Chad S. ; et al.	2017-02-23
Packaged Integrated Circuit Waveguide Interface And Methods Thereof App 20160118705 - TANG; Jinbang ; et al.	2016-04-28
Electronic device module with integrated antenna structure, and related manufacturing method Grant 9,172,143 - Tang October 27, 2	2015-10-27
Methods And Apparatus For Dissipating Heat From A Die Assembly App 20150187675 - TANG; Jinbang ; et al.	2015-07-02
Method of forming a high thermal conducting semiconductor device package Grant 9,029,202 - Yap , et al. May 12, 2	2015-05-12
Method Of Forming A High Thermal Conducting Semiconductor Device Package App 20140353816 - YAP; Weng Foong ; et al.	2014-12-04
Test Vehicles For Encapsulated Semiconductor Device Packages App 20130330846 - Tang; Jinbang ; et al.	2013-12-12
Process of forming an electronic device including a conductive stud over a bonding pad region Grant 8,530,346 - Ramanathan , et al. September 10, 2	2013-09-10
Methods for forming a micro electro-mechanical device Grant 8,461,657 - Tang , et al. June 11, 2	2013-06-11
Electronic Device Module With Integrated Antenna Structure, And Related Manufacturing Method App 20130135152 - Tang; Jinbang	2013-05-30
Method of manufacting an electronic device module with integrated antenna structure Grant 8,407,890 - Tang April 2, 2	2013-04-02
Shielding structures for signal paths in electronic devices Grant 8,385,084 - Tang , et al. February 26, 2	2013-02-26
Shielding for a micro electro-mechanical device and method therefor Grant 8,330,239 - Tang , et al. December 11, 2	2012-12-11
Methods For Forming A Micro Electro-mechanical Device App 20120282719 - TANG; JINBANG ; et al.	2012-11-08
Method of providing an electronic device including dies, a dielectric layer, and an encapsulating layer Grant 8,293,588 - Tang October 23, 2	2012-10-23
Calibration standards and methods of their fabrication and use Grant 8,290,736 - Tang October 16, 2	2012-10-16
Microelectronic assembly with an embedded waveguide adapter and method for forming the same Grant 8,283,764 - Tang October 9, 2	2012-10-09
Microelecronic Assembly With An Embedded Waveguide Adapter And Method For Forming The Same App 20120223325 - Tang; Jinbang	2012-09-06
Microelectronic assembly with an embedded waveguide adapter and method for forming the same Grant 8,168,464 - Tang May 1, 2	2012-05-01
Method of making an integrated circuit package with shielding via ring structure Grant 8,097,494 - Tang , et al. January 17, 2	2012-01-17
Packaging millimeter wave modules Grant 8,093,700 - Tang January 10, 2	2012-01-10
Method Of Providing An Electronic Device Including Dies, A Dielectric Layer, And An Encapsulating Layer App 20110230014 - Tang; Jinbang	2011-09-22
Calibration Standards And Methods Of Their Fabrication And Use App 20110208467 - Tang; Jinbang	2011-08-25
Shielded multi-layer package structures Grant 8,004,068 - Tang , et al. August 23, 2	2011-08-23
Electronic Device Module With Integrated Antenna Structure, And Related Manufacturing Method App 20110181488 - Tang; Jinbang	2011-07-28
Microelectronic Assembly With An Embedded Waveguide Adapter And Method For Forming The Same App 20110180917 - Tang; Jinbang	2011-07-28
Integrated conformal shielding method and process using redistributed chip packaging Grant 7,981,730 - Tang , et al. July 19, 2	2011-07-19
Electronic device including dies, a dielectric layer, and a encapsulating layer Grant 7,977,785 - Tang July 12, 2	2011-07-12
Method and apparatus for mini module EMI shielding evaluation Grant 7,969,164 - Tang , et al. June 28, 2	2011-06-28
Shielding Structures For Signal Paths In Electronic Devices App 20110075394 - Tang; Jinbang ; et al.	2011-03-31
Process Of Forming An Electronic Device Including A Conductive Stud Over A Bonding Pad Region App 20110027984 - Ramanathan; Lakshmi N. ; et al.	2011-02-03
Shielding structures for signal paths in electronic devices Grant 7,869,225 - Tang , et al. January 11, 2	2011-01-11
Integrated circuit module and method of packaging same Grant 7,842,546 - Tang November 30, 2	2010-11-30
Method for forming a packaged semiconductor device Grant 7,838,420 - Tang , et al. November 23, 2	2010-11-23
Shielding For A Micro Electro-mechanical Device And Method Therefor App 20100276766 - Tang; Jinbang ; et al.	2010-11-04
Integrated Circuit Module And Method Of Packaging Same App 20100267207 - Tang; Jinbang	2010-10-21
Electronic device including a conductive stud over a bonding pad region Grant 7,812,448 - Ramanathan , et al. October 12, 2	2010-10-12
Electronic Device And Method Of Packaging An Electronic Device App 20100224969 - Tang; Jinbang	2010-09-09
Integrated circuit module and method of packaging same Grant 7,772,694 - Tang August 10, 2	2010-08-10
Integrated circuit module with integrated passive device Grant 7,763,976 - Tang , et al. July 27, 2	2010-07-27
Packaging Millimeter Wave Modules App 20100148333 - TANG; JINBANG	2010-06-17
Integrated Circuit Module And Method Of Packaging Same App 20100127396 - Tang; Jinbang	2010-05-27
Integrated Circuit Module With Integrated Passive Device App 20100078760 - Tang; Jinbang ; et al.	2010-04-01
Shielded Multi-layer Package Structures App 20100044840 - Tang; Jinbang ; et al.	2010-02-25
Electromagnetic shield formation for integrated circuit die package Grant 7,651,889 - Tang , et al. January 26, 2	2010-01-26
Methods and apparatus for EMI shielding in multi-chip modules Grant 7,648,858 - Tang , et al. January 19, 2	2010-01-19
Integrated Conformal Shielding Method and Process Using Redistributed Chip Packaging App 20100006988 - Tang; Jinbang ; et al.	2010-01-14
Method And Apparatus For Mini Module Emi Shielding Evaluation App 20090243629 - Tang; Jinbang ; et al.	2009-10-01
Electromagnetic Shield Formation For Integrated Circuit Die Package App 20090075428 - Tang; Jinbang ; et al.	2009-03-19
Integrated shielding process for precision high density module packaging App 20090072357 - Tang; Jinbang ; et al.	2009-03-19
Interconnect In A Multi-element Package App 20090057849 - Tang; Jinbang ; et al.	2009-03-05
Methods And Apparatus For Emi Shielding In Multi-chip Modules App 20080315371 - Tang; Jinbang ; et al.	2008-12-25
Conformal EMI shielding with enhanced reliability App 20080315376 - Tang; Jinbang ; et al.	2008-12-25
Shielding Structures For Signal Paths In Electronic Devices App 20080266829 - Tang; Jinbang ; et al.	2008-10-30
Electronic device including a conductive stud over a bonding pad region and a process for forming the electronic device App 20080029887 - Ramanathan; Lakshmi N. ; et al.	2008-02-07
Radiation shielded module and method of shielding microelectronic device Grant 7,145,084 - Sarihan , et al. December 5, 2	2006-12-05

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