Tang; Jiamiao

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tang; Jiamiao.The latest application filed is for "apparatus, system, and method for wireless connection in integrated circuit packages".

Company Profile

1.12.15

Tang; Jiamiao - Waigaoqiao CN
Tang; Jiamiao - Shanghai CN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Apparatus, system, and method for wireless connection in integrated circuit packages Grant 9,837,340 - Tang , et al. December 5, 2	2017-12-05
Flexible system-in-package solutions for wearable devices Grant 9,778,688 - Tang , et al. October 3, 2	2017-10-03
Apparatus, System, And Method For Wireless Connection In Integrated Circuit Packages App 20160379920 - Tang; Jiamiao ; et al.	2016-12-29
Wearable Personal Computer and Healthcare Devices App 20160324487 - GUO; Mao ; et al.	2016-11-10
Flexible System-in-package Solutions For Wearable Devices App 20160327977 - Tang; Jiamiao ; et al.	2016-11-10
Apparatus, system, and method for wireless connection in integrated circuit packages Grant 9,385,094 - Tang , et al. July 5, 2	2016-07-05
Apparatus, System, And Method For Wireless Connection In Integrated Circuit Packages App 20150187713 - Tang; Jiamiao ; et al.	2015-07-02
Apparatus, system, and method for wireless connection in integrated circuit packages Grant 8,981,573 - Tang , et al. March 17, 2	2015-03-17
Apparatus, system, and method for wireless connection in integrated circuit packages Grant 8,963,333 - Tang , et al. February 24, 2	2015-02-24
Apparatus, System, And Method For Wireless Connection In Integrated Circuit Packages App 20140042639 - Tang; Jiamiao ; et al.	2014-02-13
Apparatus, System, And Method For Wireless Connection In Integrated Circuit Packages App 20130334707 - Tang; Jiamiao ; et al.	2013-12-19
Apparatus, system, and method for wireless connection in integrated circuit packages Grant 8,513,108 - Tang , et al. August 20, 2	2013-08-20
Apparatus, System, And Method For Wireless Connection In Integrated Circuit Packages App 20120108053 - Tang; Jiamiao ; et al.	2012-05-03
Apparatus, system, and method for wireless connection in integrated circuit packages Grant 8,084,867 - Tang , et al. December 27, 2	2011-12-27
Apparatus, System, And Method For Wireless Connection In Integrated Circuit Packages App 20100244268 - Tang; Jiamiao ; et al.	2010-09-30
Dual heat spreader panel assembly method for bumpless die-attach packages, packages containing same, and systems containing same Grant 7,723,164 - Lu , et al. May 25, 2	2010-05-25
Dual-chip integrated heat spreader assembly, packages containing same, and systems containing same Grant 7,659,143 - Tang , et al. February 9, 2	2010-02-09
Reducing input capacitance of high speed integrated circuits Grant 7,535,689 - Zeng , et al. May 19, 2	2009-05-19
Methods Of Forming A Thin Tim Coreless High Density Bump-less Package And Structures Formed Thereby App 20090079064 - Tang; Jiamiao ; et al.	2009-03-26
Reducing input capacitance for high speed integrated circuits App 20080316662 - Zeng; Xiang Yin ; et al.	2008-12-25
Chip-to-chip optical interconnect Grant 7,373,033 - Lu , et al. May 13, 2	2008-05-13
Dual-chip Integrated Heat Spreader Assembly, Packages Containing Same, And Systems Containing Same App 20080079144 - Tang; Jiamiao ; et al.	2008-04-03
Dual Heat Spreader Panel Assembly Method For Bumpless Die-attach Packages, Packages Containing Same, And Systems Containing Same App 20080054448 - Lu; Daoqiang ; et al.	2008-03-06
Chip-to-chip Optical Interconnect App 20070297713 - Lu; Daoqiang ; et al.	2007-12-27

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