Tang; Fu-Di

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tang; Fu-Di.The latest application filed is for "method for fabricating carrier-free semiconductor package".

Company Profile

2.18.21

Tang; Fu-Di - Taichung TW
Tang; Fu-Di - Taichung Hsien TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for fabricating carrier-free semiconductor package Grant 11,289,409 - Tsai , et al. March 29, 2	2022-03-29
Method For Fabricating Carrier-free Semiconductor Package App 20200144167 - Tsai; Yueh-Ying ; et al.	2020-05-07
Carrier-free semiconductor package and fabrication method Grant 10,566,271 - Tsai , et al. Feb	2020-02-18
Carrier-free Semiconductor Package And Fabrication Method App 20170200671 - Tsai; Yueh-Ying ; et al.	2017-07-13
Fabrication method of semiconductor package having electrical connecting structures Grant 9,177,837 - Lin , et al. November 3, 2	2015-11-03
Semiconductor package without chip carrier and fabrication method thereof Grant 8,975,734 - Tsai , et al. March 10, 2	2015-03-10
Fabrication Method Of Semiconductor Package Without Chip Carrier App 20140315351 - Tsai; Yueh-Ying ; et al.	2014-10-23
Method for fabricating quad flat non-leaded semiconductor package Grant 8,835,225 - Tang , et al. September 16, 2	2014-09-16
Fabrication Method Of Semiconductor Package Having Electrical Connecting Structures App 20140206146 - Lin; Pang-Chun ; et al.	2014-07-24
Method For Fabricating Quad Flat Non-leaded Semiconductor Package App 20140162409 - Tang; Fu-Di ; et al.	2014-06-12
Semiconductor package having electrical connecting structures and fabrication method thereof Grant 8,716,861 - Lin , et al. May 6, 2	2014-05-06
Quad flat non-leaded semiconductor package Grant 8,624,368 - Tang , et al. January 7, 2	2014-01-07
Semiconductor Package Having Electrical Connecting Structures And Fabrication Method Thereof App 20130161802 - Lin; Pang-Chun ; et al.	2013-06-27
Semiconductor package having electrical connecting structures and fabrication method thereof Grant 8,390,118 - Lin , et al. March 5, 2	2013-03-05
Semiconductor package with a support structure and fabrication method thereof Grant 8,241,967 - Huang , et al. August 14, 2	2012-08-14
Semiconductor Package Without Chip Carrier And Fabrication Method Thereof App 20120007234 - Tsai; Yueh-Ying ; et al.	2012-01-12
Carrier-free Semiconductor Package And Fabrication Method App 20110298126 - Tsai; Yueh-Ying ; et al.	2011-12-08
Quad Flat Non-leaded Semiconductor Package And Method For Fabricating The Same App 20110221049 - Tang; Fu-Di ; et al.	2011-09-15
Quad Flat Non-leaded Semiconductor Package And Method Of Fabricating The Same App 20110221059 - Tang; Fu-Di ; et al.	2011-09-15
Semiconductor Package Having Electrical Connecting Structures And Fabrication Method Thereof App 20110156252 - Lin; Pang-Chun ; et al.	2011-06-30
Semiconductor Package With A Support Structure And Fabrication Method Thereof App 20110143498 - Huang; Chien-Ping ; et al.	2011-06-16
Semiconductor package with a support structure and fabrication method thereof Grant 7,893,547 - Huang , et al. February 22, 2	2011-02-22
Semiconductor package without chip carrier and fabrication method thereof Grant 7,679,172 - Huang , et al. March 16, 2	2010-03-16
Carrier-free semiconductor package and fabrication method thereof Grant 7,314,820 - Lin , et al. January 1, 2	2008-01-01
Method of manufacturing quad flat non-leaded semiconductor package App 20070059863 - Li; Chun-Yuan ; et al.	2007-03-15
Semiconductor Package With A Support Structure And Fabrication Method Thereof App 20070059865 - Huang; Chien-Ping ; et al.	2007-03-15
Carrier-free semiconductor package with stand-off member and fabrication method thereof App 20070054438 - Huang; Chien Ping ; et al.	2007-03-08
Semiconductor package without chip carrier and fabrication method thereof App 20070018291 - Huang; Chien-Ping ; et al.	2007-01-25
Wire-bonding method and semiconductor package using the same App 20070007669 - Hsu; Chin-Teng ; et al.	2007-01-11
Wire-bonding method and semiconductor package using the same Grant 7,126,229 - Hsu , et al. October 24, 2	2006-10-24
Lead-frame-based semiconductor package and lead frame thereof App 20060151862 - Lin; Yu-Wei ; et al.	2006-07-13
Carrier-free semiconductor package and fabrication method thereof App 20060121647 - Lin; Yu-Wei ; et al.	2006-06-08
Wire-bonding method and semiconductor package using the same App 20050173791 - Hsu, Chin-Teng ; et al.	2005-08-11
Encapsulated semiconductor device with flash-proof structure Grant 6,696,752 - Su , et al. February 24, 2	2004-02-24
Semiconductor package with heat dissipating structure Grant 6,696,750 - Yin , et al. February 24, 2	2004-02-24
Packages having flash-proof structure and method for manufacturing the same App 20010042915 - Su, Guo-Kai ; et al.	2001-11-22

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