Tang; Chen-Yao
Patent Applications and Registrations
Patent applications and USPTO patent grants for Tang; Chen-Yao.The latest application filed is for "integrated circuit using deep trench through silicon (dts)".
- Tang; Chen-Yao - Hsin-Chu TW
- Tang; Chen-Yao - Hsin-Chu City TW
| Patent | Date |
|---|---|
| Integrated circuit using deep trench through silicon (DTS) Grant 9,343,352 - Cheng , et al. May 17, 2 | 2016-05-17 |
| Integrated Circuit Using Deep Trench Through Silicon (DTS) App 20150132918 - Cheng; Kuo-Yu ; et al. | 2015-05-14 |
| Integrated circuit using deep trench through silicon (DTS) Grant 8,941,211 - Cheng , et al. January 27, 2 | 2015-01-27 |
| Integrated Circuit Using Deep Trench Through Silicon (DTS) App 20140246751 - Cheng; Kuo-Yu ; et al. | 2014-09-04 |
| Methods for forming single dies with multi-layer interconnect structures and structures formed therefrom Grant 7,795,735 - Hsu , et al. September 14, 2 | 2010-09-14 |
| Methods For Forming Single Dies With Multi-layer Interconnect Structures And Structures Formed Therefrom App 20080233710 - Hsu; Chao-Shun ; et al. | 2008-09-25 |
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