Patent applications and USPTO patent grants for TANAZAWA HAKKOSHA CO., LTD..The latest application filed is for "printed circuit board".
Patent | Date |
---|---|
Printed Circuit Board App 20220091178 - YAMAMOTO; Keiichiro ;   et al. | 2022-03-24 |
Resin molding mold Grant 10,773,426 - Sakai , et al. Sept | 2020-09-15 |
Resin molding mold Grant 10,124,514 - Sakai , et al. November 13, 2 | 2018-11-13 |
Printed board and method for manufacturing same Grant 10,015,876 - Yamamoto , et al. July 3, 2 | 2018-07-03 |
Printed Board And Method For Manufacturing Same App 20170238409 - YAMAMOTO; Keiichiro ;   et al. | 2017-08-17 |
Resin Molding Mold App 20170225364 - SAKAI; Masayuki ;   et al. | 2017-08-10 |
Resin Molding Mold App 20170197336 - SAKAI; Masayuki ;   et al. | 2017-07-13 |
Molding die and method for manufacturing same Grant 9,434,094 - Ueda , et al. September 6, 2 | 2016-09-06 |
Molding Die And Method For Manufacturing Same, And Method For Providing Consistent Glossiness App 20130141792 - Ueda; Kenichi ;   et al. | 2013-06-06 |
Mold Part For Molding Resin And Manufacturing Method Therefor App 20130026675 - Yoneshima; Sadayuki ;   et al. | 2013-01-31 |
Product with concave-convex pattern on its surface and method of forming the concave-convex pattern Grant 7,745,103 - Yoneshima , et al. June 29, 2 | 2010-06-29 |
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