name:-0.0068731307983398
name:-0.0066220760345459
name:-0.0013611316680908
TANAZAWA HAKKOSHA CO., LTD. Patent Filings

TANAZAWA HAKKOSHA CO., LTD.

Patent Applications and Registrations

Patent applications and USPTO patent grants for TANAZAWA HAKKOSHA CO., LTD..The latest application filed is for "printed circuit board".

Company Profile
1.8.10
  • TANAZAWA HAKKOSHA CO., LTD. - Higashiosaka-shi, Osaka JP
  • TANAZAWA HAKKOSHA CO., LTD. - Higashiosaka-Shi Osaka JP
  • TANAZAWA HAKKOSHA CO., LTD. - Osaka N/A JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Trademarks
Patent Activity
PatentDate
Printed Circuit Board
App 20220091178 - YAMAMOTO; Keiichiro ;   et al.
2022-03-24
Resin molding mold
Grant 10,773,426 - Sakai , et al. Sept
2020-09-15
Resin molding mold
Grant 10,124,514 - Sakai , et al. November 13, 2
2018-11-13
Printed board and method for manufacturing same
Grant 10,015,876 - Yamamoto , et al. July 3, 2
2018-07-03
Printed Board And Method For Manufacturing Same
App 20170238409 - YAMAMOTO; Keiichiro ;   et al.
2017-08-17
Resin Molding Mold
App 20170225364 - SAKAI; Masayuki ;   et al.
2017-08-10
Resin Molding Mold
App 20170197336 - SAKAI; Masayuki ;   et al.
2017-07-13
Molding die and method for manufacturing same
Grant 9,434,094 - Ueda , et al. September 6, 2
2016-09-06
Molding Die And Method For Manufacturing Same, And Method For Providing Consistent Glossiness
App 20130141792 - Ueda; Kenichi ;   et al.
2013-06-06
Mold Part For Molding Resin And Manufacturing Method Therefor
App 20130026675 - Yoneshima; Sadayuki ;   et al.
2013-01-31
Product with concave-convex pattern on its surface and method of forming the concave-convex pattern
Grant 7,745,103 - Yoneshima , et al. June 29, 2
2010-06-29

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