loadpatents
name:-0.0123610496521
name:-0.012417078018188
name:-0.00099587440490723
Tanaka; Kiyofumi Patent Filings

Tanaka; Kiyofumi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tanaka; Kiyofumi.The latest application filed is for "double floor structure and support leg for double floor structure".

Company Profile
0.11.8
  • Tanaka; Kiyofumi - Kita-Adachi-gun N/A JP
  • Tanaka; Kiyofumi - Shizuoka N/A JP
  • Tanaka; Kiyofumi - Saitama JP
  • Tanaka; Kiyofumi - Shizuoka-shi JP
  • TANAKA; KIYOFUMI - Saitama-shi JP
  • Tanaka; Kiyofumi - Tokyo JP
  • Tanaka; Kiyofumi - Machida JP
  • Tanaka; Kiyofumi - Hadano JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method of transporting work and apparatus with work handover mechanism
Grant 8,529,314 - Segawa , et al. September 10, 2
2013-09-10
Fixing jig and method of processing work
Grant 8,465,011 - Segawa , et al. June 18, 2
2013-06-18
Double floor structure and support leg for double floor structure
Grant 8,434,275 - Hashimoto , et al. May 7, 2
2013-05-07
Holding jig, semiconductor wafer grinding method, semiconductor wafer protecting structure and semiconductor wafer grinding method and semiconductor chip fabrication method using the structure
Grant 8,212,345 - Tanaka , et al. July 3, 2
2012-07-03
Double Floor Structure And Support Leg For Double Floor Structure
App 20120131862 - Hashimoto; Yakobu ;   et al.
2012-05-31
Holding Jig, Semiconductor Wafer Grinding Method, Semiconductor Wafer Protecting Structure And Semiconductor Wafer Grinding Method And Semiconductor Chip Fabrication Method Using The Structure
App 20110281509 - TANAKA; KIYOFUMI ;   et al.
2011-11-17
Holding jig, semiconductor wafer grinding method, semiconductor wafer protecting structure and semiconductor wafer grinding method and semiconductor chip fabrication method using the structure
Grant 7,875,501 - Tanaka , et al. January 25, 2
2011-01-25
Method Of Transporting Work And Apparatus With Work Handover Mechanism
App 20100189533 - Segawa; Takeshi ;   et al.
2010-07-29
Fixing Jig And Method Of Processing Work
App 20100164155 - Segawa; Takeshi ;   et al.
2010-07-01
Holding Jig, Semiconductor Wafer Grinding Method, Semiconductor Wafer Protecting Structure And Semiconductor Wafer Grinding Method And Semiconductor Chip Fabrication Method Using The Structure
App 20090081852 - Tanaka; Kiyofumi ;   et al.
2009-03-26
Shield box and shield method
App 20060086518 - Kawaguchi; Toshiyuki ;   et al.
2006-04-27
Pedestal unit, raised floor skeleton structure, method of installing pedestal unit, and method of producing pedestal frame
App 20050284040 - Hashimoto, Yakobu ;   et al.
2005-12-29
Stairway
App 20050097835 - Nishimoto, Tsuyoshi ;   et al.
2005-05-12
Arrangement of pulley cylinder in a belt-type continuously variable transmission
Grant 6,089,999 - Imaida , et al. July 18, 2
2000-07-18
Pulley device for continuously variable transmission
Grant 5,628,700 - Yamada , et al. May 13, 1
1997-05-13
Method and apparatusa for determining supply sequence of products ot be processed to production line
Grant 5,506,783 - Tanaka , et al. April 9, 1
1996-04-09

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