Tanaka; Kenrou

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tanaka; Kenrou.The latest application filed is for "method for manufacturing structure having recessed pattern, resin composition, method for forming electroconductive film, electronic circuit, and electronic device".

Company Profile

1.4.5

Tanaka; Kenrou - Minato-ku JP
Tanaka; Kenrou - Tokyo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for manufacturing structure having recessed pattern, resin composition, method for forming electroconductive film, electronic circuit, and electronic device Grant 10,392,699 - Hamaguchi , et al. A	2019-08-27
Thin film transistor and MOS field effect transistor that include hydrophilic/hydrophobic material, and methods for manufacturing the same Grant 10,032,920 - Hamaguchi , et al. July 24, 2	2018-07-24
Process for producing substrate having wiring, radiation-sensitive composition, electronic circuit and electronic device Grant 9,980,392 - Hamaguchi , et al. May 22, 2	2018-05-22
Method For Manufacturing Structure Having Recessed Pattern, Resin Composition, Method For Forming Electroconductive Film, Electronic Circuit, And Electronic Device App 20170306481 - HAMAGUCHI; Hitoshi ; et al.	2017-10-26
Method for manufacturing substrate having concave pattern, composition, method for forming conductive film, electronic circuit and electronic device Grant 9,746,775 - Hamaguchi , et al. August 29, 2	2017-08-29
Thin Film Transistor And Mos Field Effect Transistor That Include Hydrophilic/hydrophobic Material, And Methods For Manufacturing The Same App 20170243980 - HAMAGUCHI; Hitoshi ; et al.	2017-08-24
Process For Producing Substrate Having Wiring, Radiation-sensitive Composition, Electronic Circuit And Electronic Device App 20170042038 - HAMAGUCHI; HITOSHI ; et al.	2017-02-09
Method For Manufacturing Substrate Having Concave Pattern, Composition, Method For Forming Conductive Film, Electronic Circuit And Electronic Device App 20160062242 - HAMAGUCHI; Hitoshi ; et al.	2016-03-03
Metal Film Forming Method And Conductive Ink Used In Said Method App 20160057866 - SHIMODA; Sugirou ; et al.	2016-02-25

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