| Patent | Date |
|---|
Noble metal-coated silver wire for ball bonding and method for producing the same, and semiconductor device using noble metal-coated silver wire for ball bonding and method for producing the same
Grant 11,456,271 - Chiba , et al. September 27, 2 | 2022-09-27 |
Palladium-coated Copper Bonding Wire, Manufacturing Method Of Palladium-coated Copper Bonding Wire, Semiconductor Device Using The Same, And Manufacturing Method Thereof
App 20220122937 - TAKADA; Mitsuo ; et al. | 2022-04-21 |
Gold-coated silver bonding wire and manufacturing method thereof, and semiconductor device and manufacturing method thereof
Grant 11,289,442 - Antoku , et al. March 29, 2 | 2022-03-29 |
Noble metal-coated silver wire for ball bonding, and semiconductor device using noble metal-coated silver wire for ball bonding
Grant 11,251,153 - Chiba , et al. February 15, 2 | 2022-02-15 |
Palladium-coated Copper Bonding Wire, Manufacturing Method Of Palladium-coated Copper Bonding Wire, Wire Bonding Structure Using The Same, Semiconductor Device And Manufacturing Method Thereof
App 20220005781 - AMANO; Hiroyuki ; et al. | 2022-01-06 |
Palladium-coated Copper Bonding Wire, Wire Bonding Structure, Semiconductor Device, And Manufacturing Method Of Semiconductor Device
App 20210366867 - AMANO; Hiroyuki ; et al. | 2021-11-25 |
Palladium-coated Copper Bonding Wire And Method For Manufacturing Same
App 20210280553 - AMANO; Hiroyuki ; et al. | 2021-09-09 |
Noble Metal-coated Silver Wire For Ball Bonding And Method For Producing The Same, And Semiconductor Device Using Noble Metal-coated Silver Wire For Ball Bonding And Method For Producing The Same
App 20210050321 - CHIBA; Jun ; et al. | 2021-02-18 |
Noble Metal-coated Silver Wire For Ball Bonding And Method For Producing The Same, And Semiconductor Device Using Noble Metal-coated Silver Wire For Ball Bonding And Method For Producing The Same
App 20200395330 - CHIBA; Jun ; et al. | 2020-12-17 |
Gold-coated Silver Bonding Wire And Manufacturing Method Thereof, And Semiconductor Device And Manufacturing Method Thereof
App 20200350273 - ANTOKU; Yuki ; et al. | 2020-11-05 |
Palladium (Pd)-coated copper wire for ball bonding
Grant 10,195,697 - Amano , et al. Fe | 2019-02-05 |
Bonding wire for high-speed signal line
Grant 9,972,595 - Antoku , et al. May 15, 2 | 2018-05-15 |
Noble Metal-coated Copper Wire For Ball Bonding
App 20170125135 - AMANO; Hiroyuki ; et al. | 2017-05-04 |
Palladium (pd)-coated Copper Wire For Ball Bonding
App 20170057020 - AMANO; Hiroyuki ; et al. | 2017-03-02 |
Silver--gold alloy bonding wire
Grant 9,362,249 - Yasuhara , et al. June 7, 2 | 2016-06-07 |
Silver-gold Alloy Bonding Wire
App 20160093586 - YASUHARA; Kazuhiko ; et al. | 2016-03-31 |
Bonding Wire For High-speed Signal Line
App 20140302317 - ANTOKU; Yuki ; et al. | 2014-10-09 |
Aluminum Ribbon For Ultrasonic Bonding
App 20130164559 - Mikami; Michitaka ; et al. | 2013-06-27 |
Au bonding wire for semiconductor device
Grant 8,440,137 - Teshima , et al. May 14, 2 | 2013-05-14 |
High Strength And High Elongation Ratio Of Au Alloy Bonding Wire
App 20120312428 - Mikami; Michitaka | 2012-12-13 |
Ag-Au-Pd TERNARY ALLOY BONDING WIRE
App 20120263624 - Chiba; Jun ; et al. | 2012-10-18 |
Aluminum For Ultrasonic Bonding
App 20110236697 - Mikami; Michitaka ; et al. | 2011-09-29 |
Bonding Wire
App 20110058979 - Murai; Hiroshi ; et al. | 2011-03-10 |
Gold alloy wire for bonding wire having high initial bondability, high bonding reliability, high roundness of compression ball, high straightness, and high resin flowability resistance
Grant 7,857,189 - Maki , et al. December 28, 2 | 2010-12-28 |
Au Alloy Wire For Ball Bonding
App 20100314156 - Takada; Mitsuo ; et al. | 2010-12-16 |
Gold Alloy Wire For Ball Bonding
App 20100226816 - Takada; Mitsuo ; et al. | 2010-09-09 |
HIGH RELIABILITY Au ALLOY BONDING WIRE AND SEMICONDUCTOR DEVICE OF SAME
App 20100171222 - Murai; Hiroshi ; et al. | 2010-07-08 |
Gold alloy wire for bonding wire having high bonding reliability, high roundness of compression ball, high straightness and high resin flowability resistance
Grant 7,678,999 - Maki , et al. March 16, 2 | 2010-03-16 |
Gold Alloy Wire For Bonding Wire Having High Bonding Reliability, High Roundness Of Compression Ball, High Straightness And High Resin Flowability Resistance
App 20090120665 - Maki; Kazunari ; et al. | 2009-05-14 |
Gold Alloy Wire For Bonding Wire Having High Initial Bondability, High Bonding Reliability, High Roundness Of Compression Ball, High Straightness, And High Resin Flowability Resistance
App 20090101695 - Maki; Kazunari ; et al. | 2009-04-23 |
Wire Bump Material
App 20080075626 - Mikami; Michitaka ; et al. | 2008-03-27 |
Au Bonding Wire For Semiconductor Device
App 20070298276 - Teshima; Satoshi ; et al. | 2007-12-27 |
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