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name:-0.012006044387817
name:-0.006371021270752
name:-0.0089061260223389
TANABE; Katsuhisa Patent Filings

TANABE; Katsuhisa

Patent Applications and Registrations

Patent applications and USPTO patent grants for TANABE; Katsuhisa.The latest application filed is for "electroless palladium plating bath".

Company Profile
8.4.10
  • TANABE; Katsuhisa - Osaka JP
  • Tanabe; Katsuhisa - Hirakata JP
  • TANABE; Katsuhisa - Hirakata-shi Osaka
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Electroless Palladium Plating Bath
App 20220033973 - MAEKAWA; Takuma ;   et al.
2022-02-03
Palladium Plating Solution And Plating Method
App 20210310127 - Kaneko; Yohei ;   et al.
2021-10-07
Electroless gold plating bath
Grant 10,975,475 - Kaneko , et al. April 13, 2
2021-04-13
Film formation method
Grant 10,941,493 - Tanabe , et al. March 9, 2
2021-03-09
Electroless Palladium Plating Solution And Palladium Film
App 20210054508 - SASAMURA; Tetsuya ;   et al.
2021-02-25
Electroless platinum plating bath
Grant 10,822,704 - Sasamura , et al. November 3, 2
2020-11-03
Gold Plating Method And Plating Film
App 20200340120 - Maeda; Tsuyoshi ;   et al.
2020-10-29
Electroless Palladium Plating Solution
App 20200318239 - MAEDA; Tsuyoshi ;   et al.
2020-10-08
Electroless Gold Plating Bath
App 20200283906 - KANEKO; Yohei ;   et al.
2020-09-10
Electroless Palladium Plating Solution, And Electroless Palladium Plated Coating
App 20200248312 - Kind Code
2020-08-06
Film Formation Method
App 20190345612 - TANABE; Katsuhisa ;   et al.
2019-11-14
Electroless Platinum Plating Bath
App 20190309423 - SASAMURA; Tetsuya ;   et al.
2019-10-10
Electroless gold plating bath, electroless gold plating method and electronic parts
Grant 7,985,285 - Kiso , et al. July 26, 2
2011-07-26
Electroless gold plating bath, electroless gold plating method and electronic parts
App 20080138506 - Kiso; Masayuki ;   et al.
2008-06-12

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