Tan; Xiaochun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tan; Xiaochun.The latest application filed is for "chip packaging structure and manufacturing method thereof".

Company Profile

4.35.36

Tan; Xiaochun - Hefei City CN
Tan; Xiaochun - Hefei CN
Tan; Xiaochun - Hangzhou CN
Tan; Xiaochun - ZheJiang Province CN
Tan; Xiaochun - Zhejiang CN
Tan; XiaoChun - Shanghai N/A CN
Tan; XiaoChun - Shanghai City CN
Tan; Xiaochun - Bellevue WA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Chip Packaging Structure And Manufacturing Method Thereof App 20220115299 - Tan; Xiaochun	2022-04-14
Chip packaging structure with heat dissipation layer, flange and sealing pin Grant 11,239,140 - Tan February 1, 2	2022-02-01
Stacked Package Structure And Stacked Packaging Method For Chip App 20200328191 - Tan; Xiaochun	2020-10-15
Stacked package structure and stacked packaging method for chip Grant 10,763,241 - Tan Sep	2020-09-01
Integrated package assembly for switching regulator Grant 10,741,481 - Ye , et al. A	2020-08-11
Package structure and method thereof Grant 10,734,249 - Tan	2020-08-04
Package Structure And Method Thereof App 20190198351 - Tan; Xiaochun	2019-06-27
Chip Packaging Structure And Manufacturing Method Thereof App 20190189541 - Tan; Xiaochun	2019-06-20
Package structure and method therof Grant 10,319,608 - Tan	2019-06-11
Package assembly having interconnect for stacked electronic devices and method for manufacturing the same Grant 10,128,221 - Tan , et al. November 13, 2	2018-11-13
Integrated Package Assembly For Switching Regulator App 20180277470 - Ye; Jiaming ; et al.	2018-09-27
Integrated package assembly for switching regulator Grant 10,043,738 - Ye , et al. August 7, 2	2018-08-07
Chip package method for reducing chip leakage current Grant 9,786,521 - Tan October 10, 2	2017-10-10
Chip package structure and manufacturing method therefor Grant 9,780,081 - Tan October 3, 2	2017-10-03
Flip chip package structure and fabrication process thereof Grant 9,735,122 - Tan August 15, 2	2017-08-15
Package assembly and method for manufacturing the same Grant 9,699,918 - Ye , et al. July 4, 2	2017-07-04
Flip Chip Package Structure And Fabrication Process Thereof App 20170179057 - Tan; Xiaochun	2017-06-22
Chip Package Method And Chip Package Structure App 20170154793 - Tan; Xiaochun	2017-06-01
Flip chip package structure and fabrication process thereof Grant 9,653,355 - Tan May 16, 2	2017-05-16
Stacked Package Structure And Stacked Packaging Method For Chip App 20170110441 - Tan; Xiaochun	2017-04-20
Chip package method and package assembly Grant 9,595,453 - Tan , et al. March 14, 2	2017-03-14
Package Structure And Method Thereof App 20160372432 - Tan; Xiaochun	2016-12-22
Chip Package Method And Package Assembly App 20160365257 - Tan; Xiaochun ; et al.	2016-12-15
Chip Package Structure And Manufacturing Method Therefor App 20160284638 - Tan; Xiaochun	2016-09-29
Lead frame, manufacture method and package structure thereof Grant 9,373,567 - Tan June 21, 2	2016-06-21
Multi-level package assembly having conductive vias coupled to chip carrier for each level and method for manufacturing the same Grant 9,324,633 - Tan April 26, 2	2016-04-26
Package Assembly And Method For Manufacturing The Same App 20160113144 - Ye; Jiaming ; et al.	2016-04-21
Flip-chip package structure and method for an integrated switching power supply Grant 9,245,872 - Tan January 26, 2	2016-01-26
Multi-chip stacked package and method for forming the same Grant 9,136,248 - Tan September 15, 2	2015-09-15
Chip packaging structure of a plurality of assemblies Grant 9,136,207 - Tan September 15, 2	2015-09-15
Multi-chip packaging structure and method Grant 9,129,947 - Tan , et al. September 8, 2	2015-09-08
Chip package and method for forming the same Grant 9,123,629 - Tan September 1, 2	2015-09-01
Integrated Package Assembly For Switching Regulator App 20150214141 - Ye; Jiaming ; et al.	2015-07-30
Package Assembly And Method For Manufacturing The Same App 20150214200 - Tan; Xiaochun ; et al.	2015-07-30
Flip-chip Package Structure And Method For An Integrated Switching Power Supply App 20150206857 - Tan; Xiaochun	2015-07-23
Package Assembly And Method For Manufacturing The Same App 20150187738 - TAN; Xiaochun	2015-07-02
Package Assembly And Method For Manufacturing The Same App 20150171064 - Tan; Xiaochun	2015-06-18
Multi-component chip packaging structure Grant 9,054,088 - Tan June 9, 2	2015-06-09
Flip-chip package structure and method for an integrated switching power supply Grant 9,024,440 - Tan May 5, 2	2015-05-05
Chip Package And Method For Forming The Same App 20150115439 - Tan; Xiaochun	2015-04-30
Multi-chip Stacked Package And Method For Forming The Same App 20150115425 - Tan; Xiaochun	2015-04-30
Lead Frame, Manufacture Method And Package Structure Thereof App 20150048491 - Tan; Xiaochun	2015-02-19
Chip package structure and method of making the same Grant 8,866,283 - Chen , et al. October 21, 2	2014-10-21
Lead frame and semiconductor package structure thereof Grant 8,866,273 - Tan October 21, 2	2014-10-21
Lead frame and flip packaging device thereof Grant 8,853,838 - Tan October 7, 2	2014-10-07
Lead frame and flip chip package device thereof Grant 8,836,093 - Tan September 16, 2	2014-09-16
Flip Chip Package Structure And Fabrication Process Thereof App 20140167256 - Tan; Xiaochun	2014-06-19
Chip Packaging Structure Of A Plurality Of Assemblies App 20140159218 - Tan; Xiaochun	2014-06-12
Multi-component Chip Packaging Structure App 20140159219 - Tan; Xiaochun	2014-06-12
Lead Frame And Flip Packaging Device Thereof App 20140117520 - Tan; Xiaochun	2014-05-01
Flip Chip Packaging Method App 20140120661 - Tan; Xiaochun	2014-05-01
Flip Packaging Device App 20140097542 - Tan; Xiaochun	2014-04-10
Multi-chip Packaging Structure And Method App 20140070390 - Tan; Xiaochun ; et al.	2014-03-13
Flip-chip Package Structure And Method For An Integrated Switching Power Supply App 20140070385 - Tan; Xiaochun	2014-03-13
Lead Frame And Semiconductor Package Structure Thereof App 20130134567 - Tan; Xiaochun	2013-05-30
Lead Frame And Flip Chip Package Device Thereof App 20130134568 - Tan; Xiaochun	2013-05-30
Chip Package Structure And Method Of Making The Same App 20120313219 - Chen; Wei ; et al.	2012-12-13
Chip package structure and method of making the same Grant 8,294,256 - Chen , et al. October 23, 2	2012-10-23
Thin Quad Flat Package With No Leads (qfn) Fabrication Methods App 20110281398 - Tan; Xiaochun ; et al.	2011-11-17
Chip package structure and method of making the same App 20110254143 - Chen; Wei ; et al.	2011-10-20
Thin quad flat package with no leads (QFN) fabrication methods Grant 8,008,128 - Tan , et al. August 30, 2	2011-08-30
Thin Quad Flat Package with No Leads (QFN) Fabrication Methods App 20100178733 - Tan; Xiaochun ; et al.	2010-07-15
Chip scale package fabrication methods Grant 7,745,261 - Tan , et al. June 29, 2	2010-06-29
Thin quad flat package with no leads (QFN) fabrication methods Grant 7,713,784 - Tan , et al. May 11, 2	2010-05-11
User interface for a display screen Grant D606,083 - Parker , et al. December 15, 2	2009-12-15
User interface for a display screen Grant D606,081 - Parker , et al. December 15, 2	2009-12-15
User interface for a display screen Grant D606,082 - Parker , et al. December 15, 2	2009-12-15
Thin Quad Flat Package With No Leads (qfn) Fabrication Methods App 20090233401 - Tan; Xiaochun ; et al.	2009-09-17
Chip Scale Package Fabrication Methods App 20090215227 - Tan; Xiaochun ; et al.	2009-08-27
Wire bonded chip scale package fabrication methods Grant 7,517,726 - Tan , et al. April 14, 2	2009-04-14