Patent | Date |
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Chip Packaging Structure And Manufacturing Method Thereof App 20220115299 - Tan; Xiaochun | 2022-04-14 |
Chip packaging structure with heat dissipation layer, flange and sealing pin Grant 11,239,140 - Tan February 1, 2 | 2022-02-01 |
Stacked Package Structure And Stacked Packaging Method For Chip App 20200328191 - Tan; Xiaochun | 2020-10-15 |
Stacked package structure and stacked packaging method for chip Grant 10,763,241 - Tan Sep | 2020-09-01 |
Integrated package assembly for switching regulator Grant 10,741,481 - Ye , et al. A | 2020-08-11 |
Package structure and method thereof Grant 10,734,249 - Tan | 2020-08-04 |
Package Structure And Method Thereof App 20190198351 - Tan; Xiaochun | 2019-06-27 |
Chip Packaging Structure And Manufacturing Method Thereof App 20190189541 - Tan; Xiaochun | 2019-06-20 |
Package structure and method therof Grant 10,319,608 - Tan | 2019-06-11 |
Package assembly having interconnect for stacked electronic devices and method for manufacturing the same Grant 10,128,221 - Tan , et al. November 13, 2 | 2018-11-13 |
Integrated Package Assembly For Switching Regulator App 20180277470 - Ye; Jiaming ;   et al. | 2018-09-27 |
Integrated package assembly for switching regulator Grant 10,043,738 - Ye , et al. August 7, 2 | 2018-08-07 |
Chip package method for reducing chip leakage current Grant 9,786,521 - Tan October 10, 2 | 2017-10-10 |
Chip package structure and manufacturing method therefor Grant 9,780,081 - Tan October 3, 2 | 2017-10-03 |
Flip chip package structure and fabrication process thereof Grant 9,735,122 - Tan August 15, 2 | 2017-08-15 |
Package assembly and method for manufacturing the same Grant 9,699,918 - Ye , et al. July 4, 2 | 2017-07-04 |
Flip Chip Package Structure And Fabrication Process Thereof App 20170179057 - Tan; Xiaochun | 2017-06-22 |
Chip Package Method And Chip Package Structure App 20170154793 - Tan; Xiaochun | 2017-06-01 |
Flip chip package structure and fabrication process thereof Grant 9,653,355 - Tan May 16, 2 | 2017-05-16 |
Stacked Package Structure And Stacked Packaging Method For Chip App 20170110441 - Tan; Xiaochun | 2017-04-20 |
Chip package method and package assembly Grant 9,595,453 - Tan , et al. March 14, 2 | 2017-03-14 |
Package Structure And Method Thereof App 20160372432 - Tan; Xiaochun | 2016-12-22 |
Chip Package Method And Package Assembly App 20160365257 - Tan; Xiaochun ;   et al. | 2016-12-15 |
Chip Package Structure And Manufacturing Method Therefor App 20160284638 - Tan; Xiaochun | 2016-09-29 |
Lead frame, manufacture method and package structure thereof Grant 9,373,567 - Tan June 21, 2 | 2016-06-21 |
Multi-level package assembly having conductive vias coupled to chip carrier for each level and method for manufacturing the same Grant 9,324,633 - Tan April 26, 2 | 2016-04-26 |
Package Assembly And Method For Manufacturing The Same App 20160113144 - Ye; Jiaming ;   et al. | 2016-04-21 |
Flip-chip package structure and method for an integrated switching power supply Grant 9,245,872 - Tan January 26, 2 | 2016-01-26 |
Multi-chip stacked package and method for forming the same Grant 9,136,248 - Tan September 15, 2 | 2015-09-15 |
Chip packaging structure of a plurality of assemblies Grant 9,136,207 - Tan September 15, 2 | 2015-09-15 |
Multi-chip packaging structure and method Grant 9,129,947 - Tan , et al. September 8, 2 | 2015-09-08 |
Chip package and method for forming the same Grant 9,123,629 - Tan September 1, 2 | 2015-09-01 |
Integrated Package Assembly For Switching Regulator App 20150214141 - Ye; Jiaming ;   et al. | 2015-07-30 |
Package Assembly And Method For Manufacturing The Same App 20150214200 - Tan; Xiaochun ;   et al. | 2015-07-30 |
Flip-chip Package Structure And Method For An Integrated Switching Power Supply App 20150206857 - Tan; Xiaochun | 2015-07-23 |
Package Assembly And Method For Manufacturing The Same App 20150187738 - TAN; Xiaochun | 2015-07-02 |
Package Assembly And Method For Manufacturing The Same App 20150171064 - Tan; Xiaochun | 2015-06-18 |
Multi-component chip packaging structure Grant 9,054,088 - Tan June 9, 2 | 2015-06-09 |
Flip-chip package structure and method for an integrated switching power supply Grant 9,024,440 - Tan May 5, 2 | 2015-05-05 |
Chip Package And Method For Forming The Same App 20150115439 - Tan; Xiaochun | 2015-04-30 |
Multi-chip Stacked Package And Method For Forming The Same App 20150115425 - Tan; Xiaochun | 2015-04-30 |
Lead Frame, Manufacture Method And Package Structure Thereof App 20150048491 - Tan; Xiaochun | 2015-02-19 |
Chip package structure and method of making the same Grant 8,866,283 - Chen , et al. October 21, 2 | 2014-10-21 |
Lead frame and semiconductor package structure thereof Grant 8,866,273 - Tan October 21, 2 | 2014-10-21 |
Lead frame and flip packaging device thereof Grant 8,853,838 - Tan October 7, 2 | 2014-10-07 |
Lead frame and flip chip package device thereof Grant 8,836,093 - Tan September 16, 2 | 2014-09-16 |
Flip Chip Package Structure And Fabrication Process Thereof App 20140167256 - Tan; Xiaochun | 2014-06-19 |
Chip Packaging Structure Of A Plurality Of Assemblies App 20140159218 - Tan; Xiaochun | 2014-06-12 |
Multi-component Chip Packaging Structure App 20140159219 - Tan; Xiaochun | 2014-06-12 |
Lead Frame And Flip Packaging Device Thereof App 20140117520 - Tan; Xiaochun | 2014-05-01 |
Flip Chip Packaging Method App 20140120661 - Tan; Xiaochun | 2014-05-01 |
Flip Packaging Device App 20140097542 - Tan; Xiaochun | 2014-04-10 |
Multi-chip Packaging Structure And Method App 20140070390 - Tan; Xiaochun ;   et al. | 2014-03-13 |
Flip-chip Package Structure And Method For An Integrated Switching Power Supply App 20140070385 - Tan; Xiaochun | 2014-03-13 |
Lead Frame And Semiconductor Package Structure Thereof App 20130134567 - Tan; Xiaochun | 2013-05-30 |
Lead Frame And Flip Chip Package Device Thereof App 20130134568 - Tan; Xiaochun | 2013-05-30 |
Chip Package Structure And Method Of Making The Same App 20120313219 - Chen; Wei ;   et al. | 2012-12-13 |
Chip package structure and method of making the same Grant 8,294,256 - Chen , et al. October 23, 2 | 2012-10-23 |
Thin Quad Flat Package With No Leads (qfn) Fabrication Methods App 20110281398 - Tan; Xiaochun ;   et al. | 2011-11-17 |
Chip package structure and method of making the same App 20110254143 - Chen; Wei ;   et al. | 2011-10-20 |
Thin quad flat package with no leads (QFN) fabrication methods Grant 8,008,128 - Tan , et al. August 30, 2 | 2011-08-30 |
Thin Quad Flat Package with No Leads (QFN) Fabrication Methods App 20100178733 - Tan; Xiaochun ;   et al. | 2010-07-15 |
Chip scale package fabrication methods Grant 7,745,261 - Tan , et al. June 29, 2 | 2010-06-29 |
Thin quad flat package with no leads (QFN) fabrication methods Grant 7,713,784 - Tan , et al. May 11, 2 | 2010-05-11 |
User interface for a display screen Grant D606,083 - Parker , et al. December 15, 2 | 2009-12-15 |
User interface for a display screen Grant D606,081 - Parker , et al. December 15, 2 | 2009-12-15 |
User interface for a display screen Grant D606,082 - Parker , et al. December 15, 2 | 2009-12-15 |
Thin Quad Flat Package With No Leads (qfn) Fabrication Methods App 20090233401 - Tan; Xiaochun ;   et al. | 2009-09-17 |
Chip Scale Package Fabrication Methods App 20090215227 - Tan; Xiaochun ;   et al. | 2009-08-27 |
Wire bonded chip scale package fabrication methods Grant 7,517,726 - Tan , et al. April 14, 2 | 2009-04-14 |