Tan; Victor Cher Khng

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tan; Victor Cher Khng.The latest application filed is for "stacked die in die bga package".

Company Profile

0.15.15

Tan; Victor Cher Khng - Singapore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Stacked Die In Die Bga Package App 20130154117 - Tan; Hock Chuan ; et al.	2013-06-20
Stacked die in die BGA package Grant 8,373,277 - Tan , et al. February 12, 2	2013-02-12
Method of fabricating a stacked die having a recess in a die BGA package Grant 7,799,610 - Tan , et al. September 21, 2	2010-09-21
Stacked die with a recess in a die BGA package Grant 7,575,953 - Tan , et al. August 18, 2	2009-08-18
Stacked die in die BGA package App 20080136045 - Tan; Hock Chuan ; et al.	2008-06-12
Method of fabricating a stacked die having a recess in a die BGA package Grant 7,371,608 - Tan , et al. May 13, 2	2008-05-13
Stacked Die in Die BGA Package App 20080096316 - Tan; Hock Chuan ; et al.	2008-04-24
Stacked die in die BGA package Grant 7,358,117 - Tan , et al. April 15, 2	2008-04-15
Stacked die in die BGA package Grant 7,344,969 - Tan , et al. March 18, 2	2008-03-18
Stacked die in die BGA package Grant 7,332,820 - Tan , et al. February 19, 2	2008-02-19
Stacked die in die BGA package Grant 7,332,819 - Tan , et al. February 19, 2	2008-02-19
Stacked Die in Die BGA Package App 20080032449 - Tan; Hock Chuan ; et al.	2008-02-07
Method of fabricating a stacked die in die BGA package Grant 7,309,623 - Tan , et al. December 18, 2	2007-12-18
Method of fabricating a stacked die in die BGA package Grant 7,282,392 - Tan , et al. October 16, 2	2007-10-16
Stacked die-in-die BGA package with die having a recess Grant 7,282,390 - Tan , et al. October 16, 2	2007-10-16
Stacked die in die BGA package App 20060292745 - Tan; Hock Chuan ; et al.	2006-12-28
Stacked die in die BGA package App 20060292743 - Tan; Hock Chuan ; et al.	2006-12-28
Stacked die in die BGA package App 20060292746 - Tan; Hock Chuan ; et al.	2006-12-28
Stacked die in die BGA package App 20060216864 - Tan; Hock Chuan ; et al.	2006-09-28
BOC BGA package for die with I-shaped bond pad layout Grant 7,112,048 - Lim , et al. September 26, 2	2006-09-26
BOC BGA package for die with I-shaped bond pad layout Grant 6,720,666 - Lim , et al. April 13, 2	2004-04-13
BOC BGA package for die with I-shaped bond pad layout Grant 6,692,987 - Lim , et al. February 17, 2	2004-02-17
BOC BGA package for die with I-shaped bond pad layout App 20030211659 - Lim, Thiam Chye ; et al.	2003-11-13
BOC BGA package for die with I-shaped bond pad layout App 20030211660 - Lim, Thiam Chye ; et al.	2003-11-13
Stacked die in die BGA package App 20030207515 - Tan, Hock Chuan ; et al.	2003-11-06
Stacked die in die BGA package App 20030207516 - Tan, Hock Chuan ; et al.	2003-11-06
Stacked die in die BGA package App 20030162325 - Tan, Hock Chuan ; et al.	2003-08-28
Stacked die in die BGA package App 20030148597 - Tan, Hock Chuan ; et al.	2003-08-07
BOC BGA package for die with I-shaped bond pad layout App 20030148557 - Lim, Thiam Chye ; et al.	2003-08-07

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