Tan; Teck Tiong

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tan; Teck Tiong.The latest application filed is for "semiconductor device and method of forming ultra high density embedded semiconductor die package".

Company Profile

0.3.8

Tan; Teck Tiong - Singapore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Device and Method of Forming Ultra High Density Embedded Semiconductor Die Package App 20220093479 - Lim; See Chian ; et al.	2022-03-24
Semiconductor device and method of forming ultra high density embedded semiconductor die package Grant 11,227,809 - Lim , et al. January 18, 2	2022-01-18
Semiconductor Device and Method of Forming Ultra High Density Embedded Semiconductor Die Package App 20170186660 - Lim; See Chian ; et al.	2017-06-29
Semiconductor device and method of forming ultra high density embedded semiconductor die package Grant 9,627,338 - Lim , et al. April 18, 2	2017-04-18
Semiconductor Device and Method of Forming Ultra High Density Embedded Semiconductor Die Package App 20140252641 - Lim; See Chian ; et al.	2014-09-11
Flip Chip In Package Using Flexible And Removable Leadframe App 20080150107 - TAN; Teck Tiong ; et al.	2008-06-26
Integrated Circuit Chip Formed On Substrate App 20070284420 - Tan; Teck Tiong ; et al.	2007-12-13
Electronic module with light-blocking features Grant 7,294,827 - Tan , et al. November 13, 2	2007-11-13
Flip chip in package using flexible and removable leadframe App 20070196979 - Tan; Teck Tiong ; et al.	2007-08-23
Optical sensor package and method of manufacture App 20060180888 - Tan; Teck Tiong ; et al.	2006-08-17
Heat sinking structure App 20060103016 - Tan; Teck Tiong ; et al.	2006-05-18

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