Patent | Date |
---|
Stacked through-silicon vias for multi-device packages Grant 11,398,415 - Cheah , et al. July 26, 2 | 2022-07-26 |
Micro through-silicon via for transistor density scaling Grant 11,393,741 - Cheah , et al. July 19, 2 | 2022-07-19 |
Generic Physical Layer Providing A Unified Architecture For Interfacing With An External Memory Device And Methods Of Interfacing With An External Memory Device App 20220208240 - LIM; Soon Chieh ;   et al. | 2022-06-30 |
Generic physical layer providing a unified architecture for interfacing with an external memory device and methods of interfacing with an external memory device Grant 11,373,694 - Lim , et al. June 28, 2 | 2022-06-28 |
Clocking System And A Method Of Clock Synchronization App 20220200610 - TEH; CHEE HAK ;   et al. | 2022-06-23 |
Micro Through-silicon Via For Transistor Density Scaling App 20220157694 - CHEAH; Bok Eng ;   et al. | 2022-05-19 |
Micro Through-silicon Via For Transistor Density Scaling App 20210320051 - Cheah; Bok Eng ;   et al. | 2021-10-14 |
Micro through-silicon via for transistor density scaling Grant 10,903,142 - Cheah , et al. January 26, 2 | 2021-01-26 |
Methods for mitigating transistor aging to improve timing margins for memory interface signals Grant 10,714,163 - Tan , et al. | 2020-07-14 |
Stacked Through-silicon Vias For Multi-device Packages App 20200091040 - Cheah; Bok Eng ;   et al. | 2020-03-19 |
Micro Through-silicon Via For Transistor Density Scaling App 20200043831 - Cheah; Bok Eng ;   et al. | 2020-02-06 |
Methods For Mitigating Transistor Aging To Improve Timing Margins For Memory Interface Signals App 20190267062 - Tan; Tat Hin ;   et al. | 2019-08-29 |
High speed sense amplifier latch with low power rail-to-rail input common mode range Grant 10,333,689 - Dudulwar , et al. | 2019-06-25 |
Methods for determining resistive-capacitive component design targets for radio-frequency circuitry Grant 10,223,483 - Tan , et al. | 2019-03-05 |
Dual signal protocol input/output (I/O) buffer circuit Grant 10,224,911 - Tan , et al. | 2019-03-05 |
Systems and methods for extraction of electrical specifications from prelayout simulations Grant 10,198,545 - Tan , et al. Fe | 2019-02-05 |
High resolution and low power interpolator for delay chain Grant 10,200,046 - Leong , et al. Fe | 2019-02-05 |
Integrated circuit with an increased signal bandwidth input/output (I/O) circuit Grant 10,110,225 - Lau , et al. October 23, 2 | 2018-10-23 |
Techniques for enabling and disabling transistor legs in an output driver circuit Grant 9,793,888 - Tan , et al. October 17, 2 | 2017-10-17 |
Techniques For Enabling And Disabling Transistor Legs In An Output Driver Circuit App 20170264283 - Tan; Tat Hin ;   et al. | 2017-09-14 |
High Speed Sense Amplifier Latch With Low Power Rail-to-rail Input Common Mode Range App 20160380753 - Dudulwar; Pankaj Vinayak ;   et al. | 2016-12-29 |
High speed sense amplifier latch with low power rail-to-rail input common mode range Grant 9,443,567 - Dudulwar , et al. September 13, 2 | 2016-09-13 |
Error correction coding in flash memory devices Grant 8,239,732 - Tan , et al. August 7, 2 | 2012-08-07 |
Error Correction Coding In Flash Memory Devices App 20090113272 - Tan; Tat Hin ;   et al. | 2009-04-30 |
Offset-compensated self-biased differential amplifier Grant 6,967,532 - Tan November 22, 2 | 2005-11-22 |
Offset-compensated self-biased differential amplifier App 20050140442 - Tan, Tat Hin | 2005-06-30 |