Tan; Siow Chek
Patent Applications and Registrations
Patent applications and USPTO patent grants for Tan; Siow Chek.The latest application filed is for "chip scale package (csp) including shim die".
- Tan; Siow Chek - Los Gatos CA
- Tan; Siow Chek - Gurun MY
| Patent | Date |
|---|---|
| Method and apparatus of package enabled ESD protection Grant 11,043,484 - Shi , et al. June 22, 2 | 2021-06-22 |
| Chip scale package (CSP) including shim die Grant 10,770,364 - Shi , et al. Sep | 2020-09-08 |
| Chip Scale Package (csp) Including Shim Die App 20190318975 - Shi; Hong ; et al. | 2019-10-17 |
| Low crosstalk vertical connection interface Grant 10,314,163 - Shi , et al. | 2019-06-04 |
| Low Crosstalk Vertical Connection Interface App 20180338375 - Shi; Hong ; et al. | 2018-11-22 |
| Power-ground co-reference transceiver structure to deliver ultra-low crosstalk Grant 10,057,976 - Shi , et al. August 21, 2 | 2018-08-21 |
| Integrated circuit package substrates having a common die dependent region and methods for designing the same Grant 9,780,040 - Tan , et al. October 3, 2 | 2017-10-03 |
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