TAN; See-Huat
Patent Applications and Registrations
Patent applications and USPTO patent grants for TAN; See-Huat.The latest application filed is for "inkjet printhead having robust encapsulation of wirebonds".
- TAN; See-Huat - North Ryde AU
| Patent | Date |
|---|---|
| Inkjet Printhead Having Robust Encapsulation Of Wirebonds App 20220048289 - PEREZ; Elmer Dimaculangan ; et al. | 2022-02-17 |
| Mems Chip Assembly Having Multiple Trenches App 20210061467 - Perez; Elmer Dimaculangan ; et al. | 2021-03-04 |
| Inkjet printhead with sealed shield plate Grant 10,870,278 - Perez , et al. December 22, 2 | 2020-12-22 |
| Inkjet printhead with encapsulant-retaining features Grant 10,864,733 - Perez , et al. December 15, 2 | 2020-12-15 |
| Inkjet printhead with grout retaining features Grant 10,850,517 - Perez , et al. December 1, 2 | 2020-12-01 |
| Inkjet Printhead With Encapsulant-retaining Features App 20190337291 - Perez; Elmer Dimaculangan ; et al. | 2019-11-07 |
| Inkjet Printhead With Grout Retaining Features App 20190337292 - Perez; Elmer Dimaculangan ; et al. | 2019-11-07 |
| Inkjet Printhead With Sealed Shield Plate App 20190322103 - Perez; Elmer Dimaculangan ; et al. | 2019-10-24 |
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