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Patent applications and USPTO patent grants for Tan; Michael Kian Shing.The latest application filed is for "stacked die in die bga package".
Patent | Date |
---|---|
Stacked Die In Die Bga Package App 20130154117 - Tan; Hock Chuan ;   et al. | 2013-06-20 |
Stacked die in die BGA package Grant 8,373,277 - Tan , et al. February 12, 2 | 2013-02-12 |
Method of fabricating a stacked die having a recess in a die BGA package Grant 7,799,610 - Tan , et al. September 21, 2 | 2010-09-21 |
Stacked die with a recess in a die BGA package Grant 7,575,953 - Tan , et al. August 18, 2 | 2009-08-18 |
Stacked die in die BGA package App 20080136045 - Tan; Hock Chuan ;   et al. | 2008-06-12 |
Method of fabricating a stacked die having a recess in a die BGA package Grant 7,371,608 - Tan , et al. May 13, 2 | 2008-05-13 |
Stacked Die in Die BGA Package App 20080096316 - Tan; Hock Chuan ;   et al. | 2008-04-24 |
Stacked die in die BGA package Grant 7,358,117 - Tan , et al. April 15, 2 | 2008-04-15 |
Stacked die in die BGA package Grant 7,344,969 - Tan , et al. March 18, 2 | 2008-03-18 |
Stacked die in die BGA package Grant 7,332,820 - Tan , et al. February 19, 2 | 2008-02-19 |
Stacked die in die BGA package Grant 7,332,819 - Tan , et al. February 19, 2 | 2008-02-19 |
Stacked Die in Die BGA Package App 20080032449 - Tan; Hock Chuan ;   et al. | 2008-02-07 |
Method of fabricating a stacked die in die BGA package Grant 7,309,623 - Tan , et al. December 18, 2 | 2007-12-18 |
Stacked die-in-die BGA package with die having a recess Grant 7,282,390 - Tan , et al. October 16, 2 | 2007-10-16 |
Method of fabricating a stacked die in die BGA package Grant 7,282,392 - Tan , et al. October 16, 2 | 2007-10-16 |
Stacked die in die BGA package App 20060292743 - Tan; Hock Chuan ;   et al. | 2006-12-28 |
Stacked die in die BGA package App 20060292746 - Tan; Hock Chuan ;   et al. | 2006-12-28 |
Stacked die in die BGA package App 20060292745 - Tan; Hock Chuan ;   et al. | 2006-12-28 |
Stacked die in die BGA package App 20060216864 - Tan; Hock Chuan ;   et al. | 2006-09-28 |
Stacked die in die BGA package App 20030207515 - Tan, Hock Chuan ;   et al. | 2003-11-06 |
Stacked die in die BGA package App 20030207516 - Tan, Hock Chuan ;   et al. | 2003-11-06 |
Stacked die in die BGA package App 20030162325 - Tan, Hock Chuan ;   et al. | 2003-08-28 |
Stacked die in die BGA package App 20030148597 - Tan, Hock Chuan ;   et al. | 2003-08-07 |
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