TAN; Loon-Kwang
Patent Applications and Registrations
Patent applications and USPTO patent grants for TAN; Loon-Kwang.The latest application filed is for "ceramic carrier and build up carrier for light-emitting diode (led) array".
- TAN; Loon-Kwang - Kepala Batas MY
- Tan; Loon Kwang - Lima Kepala Batas N/A MY
- Tan; Loon Kwang - Penang MY
| Patent | Date |
|---|---|
| Ceramic Carrier And Build Up Carrier For Light-emitting Diode (led) Array App 20210210463 - TAN; Loon-Kwang ; et al. | 2021-07-08 |
| Methods for packaging integrated circuits Grant 9,748,197 - Tan , et al. August 29, 2 | 2017-08-29 |
| Methods For Packaging Integrated Circuits App 20160307868 - Tan; Loon Kwang ; et al. | 2016-10-20 |
| Integrated circuit package with solderless interconnection structure Grant 9,425,174 - Hin , et al. August 23, 2 | 2016-08-23 |
| Methods for packaging integrated circuits Grant 9,401,287 - Tan , et al. July 26, 2 | 2016-07-26 |
| Integrated circuit package with a universal lead frame Grant 9,337,240 - Lee , et al. May 10, 2 | 2016-05-10 |
| Methods For Packaging Integrated Circuits App 20150228506 - Tan; Loon Kwang ; et al. | 2015-08-13 |
| Thermoset molding for on-package decoupling in flip chips Grant 8,541,263 - Toong , et al. September 24, 2 | 2013-09-24 |
| IC package with capacitors disposed on an interposal layer Grant 8,525,326 - Toong , et al. September 3, 2 | 2013-09-03 |
| Ic Package With Capacitors Disposed On An Interposal Layer App 20110272785 - Toong; Teik Tiong ; et al. | 2011-11-10 |
| IC package with capacitors disposed on an interposal layer Grant 7,989,942 - Toong , et al. August 2, 2 | 2011-08-02 |
| Ic Package With Capacitors Disposed On An Interposal Layer App 20100181644 - Toong; Teik Tiong ; et al. | 2010-07-22 |
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