Tan; Kim Heng
Patent Applications and Registrations
Patent applications and USPTO patent grants for Tan; Kim Heng.The latest application filed is for "substrate based fan-out wafer level packaging".
- Tan; Kim Heng - Kuala Lumpur MY
- Tan; Kim Heng - Satu MY
- Tan; Kim Heng - Singapore SG
- Tan, Kim Heng - Jalan Mengkudu MY
- Tan, Kim Heng - Kaula Lumpur MY
| Patent | Date |
|---|---|
| Substrate Based Fan-out Wafer Level Packaging App 20190259731 - Tan; Kim Heng ; et al. | 2019-08-22 |
| Substrate Based Fan-Out Wafer Level Packaging App 20180130769 - Tan; Kim Heng ; et al. | 2018-05-10 |
| Substrate Based Fan-Out Wafer Level Packaging App 20180130720 - Tan; Kim Heng ; et al. | 2018-05-10 |
| Substrate Based Fan-Out Wafer Level Packaging App 20180130768 - Tan; Kim Heng ; et al. | 2018-05-10 |
| Packaged integrated circuit having a heat spreader and method therefor App 20070031996 - Chopin; Sheila F. ; et al. | 2007-02-08 |
| Image sensor device Grant 6,900,531 - Foong , et al. May 31, 2 | 2005-05-31 |
| Image sensor device App 20040080037 - Foong, Chee Seng ; et al. | 2004-04-29 |
| Stacked die semiconductor device App 20030160311 - Ismail, Aminuddin ; et al. | 2003-08-28 |
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