| Patent | Date |
|---|
Bonding structures of semiconductor devices
Grant 11,444,045 - Chockalingam , et al. September 13, 2 | 2022-09-13 |
Contact Pad Structures And Methods For Fabricating Contact Pad Structures
App 20220270991 - LI; Xiaodong ; et al. | 2022-08-25 |
Method Of Forming A Sensor Device
App 20220252534 - KHOR; EE JAN ; et al. | 2022-08-11 |
Memory Devices And Methods For Fabricating Memory Devices
App 20220209108 - SUN; Jianxun ; et al. | 2022-06-30 |
Memory Devices And Method Of Forming The Same
App 20220158090 - SUN; JIANXUN ; et al. | 2022-05-19 |
Memory Devices And Method Of Forming The Same
App 20220158093 - THONG; JIA RUI ; et al. | 2022-05-19 |
Non-volatile Memory Device With Filament Confinementnon-volatile Memory Device With Filament Confinement
App 20220149277 - SUN; JIANXUN ; et al. | 2022-05-12 |
Non-volatile memory elements with a narrowed electrode
Grant 11,289,649 - Leong , et al. March 29, 2 | 2022-03-29 |
Dye-sensitized optoelectronic memory
Grant 11,276,460 - Sun , et al. March 15, 2 | 2022-03-15 |
Semiconductor Devices And Methods Of Forming Semiconductor Devices
App 20220077234 - LIN; Benfu ; et al. | 2022-03-10 |
Semiconductor devices and methods of forming semiconductor devices
Grant 11,270,938 - Kang , et al. March 8, 2 | 2022-03-08 |
Single Well One Transistor And One Capacitor Nonvolatile Memory Device And Integration Schemes
App 20220059554 - CAI; XINSHU ; et al. | 2022-02-24 |
Bonding Structures Of Semiconductor Devices
App 20220052000 - CHOCKALINGAM; RAMASAMY ; et al. | 2022-02-17 |
Memory Device, Memory Array And Method Of Forming The Same
App 20220052112 - CHANG; Wei ; et al. | 2022-02-17 |
Bond pads of semiconductor devices
Grant 11,244,915 - Chockalingam , et al. February 8, 2 | 2022-02-08 |
Resistive Memory Device And Methods Of Making Such A Resistive Memory Device
App 20220037590 - Hsieh; Curtis Chun-I ; et al. | 2022-02-03 |
Memory devices and methods of forming memory devices
Grant 11,233,195 - Hsieh , et al. January 25, 2 | 2022-01-25 |
Test pad with crack stop protection
Grant 11,217,496 - Chockalingam , et al. January 4, 2 | 2022-01-04 |
Semiconductor Devices And Methods Of Forming Semiconductor Devices
App 20210407906 - KANG; Kai ; et al. | 2021-12-30 |
Memory device and a method for forming the memory device
Grant 11,205,478 - Wang , et al. December 21, 2 | 2021-12-21 |
Memory Devices And Methods Of Forming Memory Devices
App 20210384420 - HSIEH; Curtis Chun-I ; et al. | 2021-12-09 |
Resistive Random Access Memory Devices
App 20210359203 - HSIEH; CURTIS CHUN-I ; et al. | 2021-11-18 |
Memory Devices And Methods Of Forming The Same
App 20210358544 - HSIEH; CURTIS CHUN-I ; et al. | 2021-11-18 |
Dual Layer Dielectric Liner For Resistive Memory Devices
App 20210328140 - SUN; JIAN XUN ; et al. | 2021-10-21 |
Non-volatile Memory Elements With A Narrowed Electrode
App 20210320249 - Leong; Lup San ; et al. | 2021-10-14 |
Integrated circuits with embedded memory structures and methods for fabricating the same
Grant 11,127,784 - Hsieh , et al. September 21, 2 | 2021-09-21 |
Memory devices and methods of forming the same
Grant 11,127,459 - Hsieh , et al. September 21, 2 | 2021-09-21 |
Memory Devices And Methods Of Forming The Same
App 20210287741 - HSIEH; CURTIS CHUN-I ; et al. | 2021-09-16 |
Methods of forming a conductive contact structure to a top electrode of an embedded memory device on an IC product and a corresponding IC product
Grant 11,094,585 - Tran , et al. August 17, 2 | 2021-08-17 |
Memory devices and methods of forming memory devices
Grant 11,081,523 - Hsieh , et al. August 3, 2 | 2021-08-03 |
Self-aligned planarization of low-k dielectrics and method for producing the same
Grant 11,031,251 - Hsieh , et al. June 8, 2 | 2021-06-08 |
Magnetic shielding of STT-MRAM in multichip packaging and method of manufacturing the same
Grant 11,018,093 - Bhushan , et al. May 25, 2 | 2021-05-25 |
Bond Pads Of Semiconductor Devices
App 20210134742 - CHOCKALINGAM; RAMASAMY ; et al. | 2021-05-06 |
Memory Device And A Method For Forming The Memory Device
App 20210074916 - SUN; Jianxun ; et al. | 2021-03-11 |
Dye-sensitized Optoelectronic Memory
App 20210065788 - Sun; Jianxun ; et al. | 2021-03-04 |
Conductive Structures For Contacting A Top Electrode Of An Embedded Memory Device And Methods Of Making Such Contact Structures On An Ic Product
App 20210066126 - Ramanathan; Eswar ; et al. | 2021-03-04 |
Bond Pad Reliability Of Semiconductor Devices
App 20210013166 - CHOCKALINGAM; RAMASAMY ; et al. | 2021-01-14 |
Methods Of Forming A Conductive Contact Structure To A Top Electrode Of An Embedded Memory Device On An Ic Product And A Corresponding Ic Product
App 20210013095 - Tran; Xuan Anh ; et al. | 2021-01-14 |
Bond pad reliability of semiconductor devices
Grant 10,892,239 - Chockalingam , et al. January 12, 2 | 2021-01-12 |
Memory Device And A Method For Forming The Memory Device
App 20210005251 - Wang; Lanxiang ; et al. | 2021-01-07 |
Test Pad With Crack Stop Protection
App 20200357707 - CHOCKALINGAM; Ramasamy ; et al. | 2020-11-12 |
Reliable passivation for integrated circuits
Grant 10,777,519 - Lee , et al. Sept | 2020-09-15 |
Integrated circuits with integrated memory structures and capacitors and methods for fabricating the same
Grant 10,734,444 - Jiang , et al. | 2020-08-04 |
Device with capping layer for improved residue defect and method of production thereof
Grant 10,734,572 - Jiang , et al. | 2020-08-04 |
Integrated Circuits With Integrated Memory Structures And Capacitors And Methods For Fabricating The Same
App 20200243602 - Jiang; Yi ; et al. | 2020-07-30 |
RRAM device and method of fabrication thereof
Grant 10,720,580 - Hsieh , et al. | 2020-07-21 |
Selective shielding of ambient light at chip level
Grant 10,707,358 - Yi , et al. | 2020-07-07 |
MTJ bottom metal via in a memory cell and method for producing the same
Grant 10,693,054 - Shum , et al. | 2020-06-23 |
Integrated Circuits With Embedded Memory Structures And Methods For Fabricating The Same
App 20200194496 - Hsieh; Curtis Chun-I ; et al. | 2020-06-18 |
Bond pad reliability of semiconductor devices
Grant 10,658,316 - Li , et al. | 2020-05-19 |
Memory devices and methods of forming the same
Grant 10,651,380 - Hsieh , et al. | 2020-05-12 |
Metal-insulator-poly capacitor in a high-K metal gate process and method of manufacturing
Grant 10,636,867 - Cai , et al. | 2020-04-28 |
Rram Device And Method Of Fabrication Thereof
App 20200127197 - HSIEH; Curtis Chun-I ; et al. | 2020-04-23 |
Bond Pad Reliability Of Semiconductor Devices
App 20200105690 - LI; XIAODONG ; et al. | 2020-04-02 |
Integrated two-terminal device with logic device for embedded application
Grant 10,608,046 - Yi , et al. | 2020-03-31 |
Pad Structures In Semiconductor Devices
App 20200091020 - YI; WANBING ; et al. | 2020-03-19 |
Integrated circuits and methods for fabricating integrated circuits with magnetic tunnel junction (MTJ) structures
Grant 10,593,728 - Hsieh , et al. | 2020-03-17 |
Integrated circuit with memory cells having reliable interconnection
Grant 10,580,968 - Yi , et al. | 2020-03-03 |
Two pass MRAM dummy solution
Grant 10,566,384 - Yi , et al. Feb | 2020-02-18 |
Device without zero mark layer
Grant 10,553,488 - Gong , et al. Fe | 2020-02-04 |
Mtj Bottom Metal Via In A Memory Cell And Method For Producing The Same
App 20200035906 - SHUM; Danny Pak-Chum ; et al. | 2020-01-30 |
Device With Capping Layer For Improved Residue Defect And Method Of Production Thereof
App 20200028067 - JIANG; Yi ; et al. | 2020-01-23 |
Metal-insulator-poly Capacitor In A High-k Metal Gate Process And Method Of Manufacturing
App 20200020761 - CAI; Xinshu ; et al. | 2020-01-16 |
Stitched devices
Grant 10,535,645 - Shao , et al. Ja | 2020-01-14 |
Selective Shielding Of Ambient Light At Chip Level
App 20200013908 - YI; WANBING ; et al. | 2020-01-09 |
MRAM chip magnetic shielding
Grant 10,510,946 - Bhushan , et al. Dec | 2019-12-17 |
Vertical and planar RRAM with tip electrodes and methods for producing the same
Grant 10,490,745 - Sun , et al. Nov | 2019-11-26 |
Embedded MRAM in interconnects and method for producing the same
Grant 10,483,461 - Yi , et al. Nov | 2019-11-19 |
Pillar contact extension and method for producing the same
Grant 10,475,990 - Hsieh , et al. Nov | 2019-11-12 |
MRAM magnetic shielding with fan-out wafer level packaging
Grant 10,475,985 - Bhushan , et al. Nov | 2019-11-12 |
Integrated magnetic random access memory with logic device having low-K interconnects
Grant 10,461,247 - Shum , et al. Oc | 2019-10-29 |
Integrated Two-terminal Device With Logic Device For Embedded Application
App 20190326352 - YI; Wanbing ; et al. | 2019-10-24 |
Embedded Mram In Interconnects And Method For Producing The Same
App 20190326509 - YI; Wanbing ; et al. | 2019-10-24 |
Integrated two-terminal device with logic device for embedded application
Grant 10,446,607 - Yi , et al. Oc | 2019-10-15 |
Reliable Passivation For Integrated Circuits
App 20190312000 - LEE; Fook Hong ; et al. | 2019-10-10 |
Capacitor structure
Grant 10,439,021 - Gong , et al. O | 2019-10-08 |
Reliable passivation for integrated circuits
Grant 10,438,909 - Lee , et al. O | 2019-10-08 |
Shielded magnetoresistive random access memory devices and methods for fabricating the same
Grant 10,431,732 - Bharat , et al. O | 2019-10-01 |
Vertical And Planar Rram With Tip Electrodes And Methods For Producing The Same
App 20190288201 - SUN; Jianxun ; et al. | 2019-09-19 |
Magnetic Shielding Of Stt-mram In Multichip Packaging And Method Of Manufacturing The Same
App 20190287921 - BHUSHAN; Bharat ; et al. | 2019-09-19 |
Integrated circuits with memory cells and methods for producing the same
Grant 10,381,404 - Bharat , et al. A | 2019-08-13 |
MRAM device with improved seal ring and method for producing the same
Grant 10,381,403 - Jiang , et al. A | 2019-08-13 |
Magnetic Shielding Of Stt-mram In Multichip Packaging And Method Of Manufacturing The Same
App 20190229068 - BHUSHAN; Bharat ; et al. | 2019-07-25 |
Pillar Contact Extension And Method For Producing The Same
App 20190229261 - HSIEH; Curtis Chun-I ; et al. | 2019-07-25 |
Magnetic shielding of STT-MRAM in multichip packaging and method of manufacturing the same
Grant 10,361,162 - Bhushan , et al. | 2019-07-23 |
Stt-mram Flip-chip Magnetic Shielding And Method For Producing The Same
App 20190214550 - BHUSHAN; Bharat ; et al. | 2019-07-11 |
STT-MRAM flip-chip magnetic shielding and method for producing the same
Grant 10,347,826 - Bhushan , et al. July 9, 2 | 2019-07-09 |
Self-aligned Planarization Of Low-k Dielectrics And Method For Producing The Same
App 20190198343 - HSIEH; Curtis Chun-I ; et al. | 2019-06-27 |
High-Density STT-MRAM with 3D arrays of MTJs in multiple levels of interconnects and method for producing the same
Grant 10,290,679 - Bhushan , et al. | 2019-05-14 |
Self-aligned Planarization Of Low-k Dielectrics And Method For Producing The Same
App 20190115223 - HSIEH; Curtis Chun-I ; et al. | 2019-04-18 |
Self-aligned planarization of low-K dielectrics and method for producing the same
Grant 10,262,868 - Hsieh , et al. | 2019-04-16 |
High density cross point resistive memory structures and methods for fabricating the same
Grant 10,256,273 - Hsieh , et al. | 2019-04-09 |
Two Pass Mram Dummy Solution
App 20190074434 - YI; Wanbing ; et al. | 2019-03-07 |
Integrated circuits with vertical capacitors and methods for producing the same
Grant 10,217,794 - Tan , et al. Feb | 2019-02-26 |
Integrated Circuits With Memory Cells And Methods For Producing The Same
App 20190043922 - Bharat; Bhushan ; et al. | 2019-02-07 |
Integrated magnetic random access memory with logic device
Grant 10,199,572 - Yi , et al. Fe | 2019-02-05 |
Chamfering for stress reduction on passivation layer
Grant 10,170,439 - Khor , et al. J | 2019-01-01 |
Via disguise to protect the security product from delayering and graphic design system (GDS) hacking and method for producing the same
Grant 10,170,437 - Chockalingam , et al. J | 2019-01-01 |
Two pass MRAM dummy solution
Grant 10,158,066 - Yi , et al. Dec | 2018-12-18 |
Two Pass Mram Dummy Solution
App 20180358546 - YI; Wanbing ; et al. | 2018-12-13 |
Shielded Semiconductor Devices And Methods For Fabricating Shielded Semiconductor Devices
App 20180351078 - Bharat; Bhushan ; et al. | 2018-12-06 |
Integrated Circuits With Vertical Capacitors And Methods For Producing The Same
App 20180342556 - Tan; Juan Boon ; et al. | 2018-11-29 |
Seal ring for wafer level package
Grant 10,128,201 - Gong , et al. November 13, 2 | 2018-11-13 |
Robust chamfer design for seal ring
Grant 10,121,755 - Bhatkar , et al. November 6, 2 | 2018-11-06 |
Integrated magnetic random access memory with logic device
Grant 10,121,964 - Tan , et al. November 6, 2 | 2018-11-06 |
Magnetic shielding for MTJ device or bit
Grant 10,096,768 - Jiang , et al. October 9, 2 | 2018-10-09 |
Integrated circuits including a dummy metal feature and methods of forming the same
Grant 10,062,641 - Sheng , et al. August 28, 2 | 2018-08-28 |
Seal Ring For Wafer Level Package
App 20180233462 - GONG; Shunqiang ; et al. | 2018-08-16 |
Integrated Magnetic Random Access Memory With Logic Device Having Low-k Interconnects
App 20180233663 - SHUM; Danny Pak-Chum ; et al. | 2018-08-16 |
Integrated Two-terminal Device With Logic Device For Embedded Application
App 20180182810 - YI; Wanbing ; et al. | 2018-06-28 |
Integrated Circuits And Methods For Fabricating Integrated Circuits With Magnetic Tunnel Junction (mtj) Structures
App 20180175284 - Hsieh; Curtis Chun-I ; et al. | 2018-06-21 |
Capacitor Structure
App 20180158897 - GONG; Shunqiang ; et al. | 2018-06-07 |
Integrated magnetic random access memory with logic device having low-k interconnects
Grant 9,972,775 - Shum , et al. May 15, 2 | 2018-05-15 |
Method for producing integrated circuit memory cells with less dedicated lithographic steps
App 20180090505 - Luo; Laiqiang ; et al. | 2018-03-29 |
High Density Cross Point Resistive Memory Structures And Methods For Fabricating The Same
App 20180090543 - Hsieh; Curtis Chun-I ; et al. | 2018-03-29 |
Method for producing integrated circuit memory cells with less dedicated lithographic steps
Grant 9,929,165 - Luo , et al. March 27, 2 | 2018-03-27 |
Integrated Circuits Including A Dummy Metal Feature And Methods Of Forming The Same
App 20180076128 - Sheng; Haifeng ; et al. | 2018-03-15 |
Integrated circuits with aluminum via structures and methods for fabricating the same
Grant 9,917,027 - Yi , et al. March 13, 2 | 2018-03-13 |
Top electrode dome formation
Grant 9,905,282 - Yi , et al. February 27, 2 | 2018-02-27 |
Integrated circuits with copper hillock-detecting structures and methods for detecting copper hillocks using the same
Grant 9,881,844 - Yi , et al. January 30, 2 | 2018-01-30 |
Magnetic shielding of MRAM package
Grant 9,875,971 - Bhushan , et al. January 23, 2 | 2018-01-23 |
Device Without Zero Mark Layer
App 20180012800 - GONG; Shunqiang ; et al. | 2018-01-11 |
Integrated two-terminal device and logic device with compact interconnects having shallow via for embedded application
Grant 9,865,649 - Tan , et al. January 9, 2 | 2018-01-09 |
Three-dimensional integrated circuit structures providing thermoelectric cooling and methods for cooling such integrated circuit structures
Grant 9,847,272 - Tan , et al. December 19, 2 | 2017-12-19 |
Programmable active cooling device
Grant 9,837,334 - Tee , et al. December 5, 2 | 2017-12-05 |
Interposers for integrated circuits with multiple-time programming and methods for manufacturing the same
Grant 9,806,128 - Tan , et al. October 31, 2 | 2017-10-31 |
Methods for producing integrated circuits with interposers and integrated circuits produced from such methods
Grant 9,799,571 - Gong , et al. October 24, 2 | 2017-10-24 |
Test structure for monitoring liner oxidation
Grant 9,793,185 - Yi , et al. October 17, 2 | 2017-10-17 |
Plasma discharge path
Grant 9,793,208 - Sheng , et al. October 17, 2 | 2017-10-17 |
3D MRAM with through silicon vias or through silicon trenches magnetic shielding
Grant 9,786,839 - Bhushan , et al. October 10, 2 | 2017-10-10 |
Device without zero mark layer
Grant 9,773,702 - Gong , et al. September 26, 2 | 2017-09-26 |
Reliable Passivation For Integrated Circuits
App 20170236792 - LEE; Fook Hong ; et al. | 2017-08-17 |
Semiconductor chips with seal rings and electronic test structures, semiconductor wafers including the semiconductor chips, and methods for fabricating the same
Grant 9,728,474 - Yi , et al. August 8, 2 | 2017-08-08 |
Integrated circuits with optical modulators and photodetectors and methods for producing the same
Grant 9,711,662 - Gong , et al. July 18, 2 | 2017-07-18 |
Integrated Circuits With Aluminum Via Structures And Methods For Fabricating The Same
App 20170194229 - Yi; Wanbing ; et al. | 2017-07-06 |
Integrated circuits with non-volatile memory and methods of producing the same
Grant 9,679,905 - Luo , et al. June 13, 2 | 2017-06-13 |
Crack Stop Layer In Inter Metal Layers
App 20170162501 - YI; Wanbing ; et al. | 2017-06-08 |
Stitched Devices
App 20170125396 - SHAO; Wei ; et al. | 2017-05-04 |
Integrated circuits including magnetic core inductors and methods for fabricating the same
Grant 9,613,897 - Bhatkar , et al. April 4, 2 | 2017-04-04 |
Plasma Discharge Path
App 20170092584 - SHENG; Haifeng ; et al. | 2017-03-30 |
Integrated Two-terminal Device And Logic Device With Compact Interconnects Having Shallow Via For Embedded Application
App 20170092693 - TAN; Juan Boon ; et al. | 2017-03-30 |
Integrated Magnetic Random Access Memory With Logic Device
App 20170084820 - TAN; Juan Boon ; et al. | 2017-03-23 |
Photonic Devices With Through Dielectric Via Interposer
App 20170054039 - GONG; Shunqiang ; et al. | 2017-02-23 |
Dual encapsulation integration scheme for fabricating integrated circuits with magnetic random access memory structures
Grant 9,564,575 - Shum , et al. February 7, 2 | 2017-02-07 |
3d Mram With Through Silicon Vias Or Through Silicon Trenches Magnetic Shielding
App 20170025601 - BHUSHAN; Bharat ; et al. | 2017-01-26 |
Mram Chip Magnetic Shielding
App 20170025471 - BHUSHAN; Bharat ; et al. | 2017-01-26 |
Magnetic tunnel junction stack alignment scheme
Grant 9,553,129 - Jiang , et al. January 24, 2 | 2017-01-24 |
Methods For Producing Integrated Circuits With Interposers And Integrated Circuits Produced From Such Methods
App 20170018468 - Gong; Shunqiang ; et al. | 2017-01-19 |
Stitched devices
Grant 9,543,192 - Shao , et al. January 10, 2 | 2017-01-10 |
3D high voltage charge pump
Grant 9,520,506 - Luo , et al. December 13, 2 | 2016-12-13 |
Etch bias control
Grant 9,520,299 - Yi , et al. December 13, 2 | 2016-12-13 |
Planar passivation for pads
Grant 9,520,371 - Lin , et al. December 13, 2 | 2016-12-13 |
Mram Magnetic Shielding With Fan-out Wafer Level Packaging
App 20160359100 - BHUSHAN; Bharat ; et al. | 2016-12-08 |
Magnetic Shielding For Mtj Device Or Bit
App 20160351792 - JIANG; Yi ; et al. | 2016-12-01 |
Integrated Magnetic Random Access Memory With Logic Device
App 20160351797 - YI; Wanbing ; et al. | 2016-12-01 |
Interposers For Integrated Circuits With Multiple-time Programming And Methods For Manufacturing The Same
App 20160343773 - Tan; Juan Boon ; et al. | 2016-11-24 |
Interposers For Integrated Circuits With One-time Programming And Methods For Manufacturing The Same
App 20160343719 - Liu; Wei ; et al. | 2016-11-24 |
Stitched Devices
App 20160343610 - SHAO; Wei ; et al. | 2016-11-24 |
Reliable interconnect integration scheme
Grant 9,490,165 - Du , et al. November 8, 2 | 2016-11-08 |
Integrated circuit structures with spin torque transfer magnetic random access memory ultilizing aluminum metallization layers and methods for fabricating the same
Grant 9,490,423 - Tan , et al. November 8, 2 | 2016-11-08 |
Programmable Active Cooling Device
App 20160293515 - TEE; Kheng Chok ; et al. | 2016-10-06 |
Magnetic Shielding Of Mram Package
App 20160284981 - BHUSHAN; Bharat ; et al. | 2016-09-29 |
Integrated Magnetic Random Access Memory With Logic Device Having Low-k Interconnects
App 20160268336 - SHUM; Danny Pak-Chum ; et al. | 2016-09-15 |
Methods for fabricating integrated circuits having device contacts
Grant 9,443,761 - Shao , et al. September 13, 2 | 2016-09-13 |
TSV without zero alignment marks
Grant 9,437,550 - Gong , et al. September 6, 2 | 2016-09-06 |
Integrated inductor and magnetic random access memory device
Grant 9,397,139 - Tan , et al. July 19, 2 | 2016-07-19 |
Etch Bias Control
App 20160189971 - Yi; Wanbing ; et al. | 2016-06-30 |
Device Without Zero Mark Layer
App 20160190041 - Gong; Shunqiang ; et al. | 2016-06-30 |
Dual Encapsulation Integration Scheme For Fabricating Integrated Circuits With Magnetic Random Access Memory Structures
App 20160190432 - Shum; Danny Pak-Chum ; et al. | 2016-06-30 |
Through via contacts with insulated substrate
Grant 9,362,171 - Gong , et al. June 7, 2 | 2016-06-07 |
Methods for fabricatingintegrated circuits with spin torque transfer magnetic randomaccess memory (STT-MRAM) including a passivation layer formed along lateral sidewalls of a magnetic tunnel junction of the STT-MRAM
Grant 9,349,772 - Yi , et al. May 24, 2 | 2016-05-24 |
Magnetic memory device and method of forming thereof
Grant 9,343,662 - Tan , et al. May 17, 2 | 2016-05-17 |
Integrated Circuits Including Magnetic Core Inductors And Methods For Fabricating The Same
App 20160133565 - Bhatkar; Mahesh ; et al. | 2016-05-12 |
Test Structure For Monitoring Liner Oxidation
App 20160133531 - YI; Wanbing ; et al. | 2016-05-12 |
Integrated Circuit Structures With Spin Torque Transfer Magnetic Random Access Memory Ultilizing Aluminum Metallization Layers And Methods For Fabricating The Same
App 20160133830 - Tan; Juan Boon ; et al. | 2016-05-12 |
Planar Passivation For Pads
App 20160118355 - LIN; Benfu ; et al. | 2016-04-28 |
Integrated circuits having crack-stop structures and methods for fabricating the same
Grant 9,305,886 - Shao , et al. April 5, 2 | 2016-04-05 |
Magnetic Tunnel Junction Stack Alignment Scheme
App 20160093670 - JIANG; Yi ; et al. | 2016-03-31 |
Reliable contacts
Grant 9,263,322 - Chang , et al. February 16, 2 | 2016-02-16 |
Integrated Circuits Having Device Contacts And Methods For Fabricating The Same
App 20160035623 - Shao; Wei ; et al. | 2016-02-04 |
Semiconductor device and method of forming thereof
Grant 9,240,374 - Shao , et al. January 19, 2 | 2016-01-19 |
Fabrication Of Multilayer Circuit Elements
App 20160013262 - ENGLAND; Luke ; et al. | 2016-01-14 |
Integrated Circuits With Spin Torque Transfer Magnetic Random Access Memory And Methods For Fabricating The Same
App 20150311251 - YI; WANBING ; et al. | 2015-10-29 |
Integrated circuit system employing alternating conductive layers
Grant 9,147,654 - Sheng , et al. September 29, 2 | 2015-09-29 |
Non-volatile memory device with TSI/TSV application
Grant 9,111,941 - Gong , et al. August 18, 2 | 2015-08-18 |
Through Via Contacts With Insulated Substrate
App 20150187647 - GONG; Shunqiang ; et al. | 2015-07-02 |
Reliable Interconnects
App 20150187700 - SHAO; Wei ; et al. | 2015-07-02 |
Integrated Circuits With Copper Hillock-detecting Structures And Methods For Detecting Copper Hillocks Using The Same
App 20150177319 - YI; Wanbing ; et al. | 2015-06-25 |
Three-dimensional Integrated Circuit Structures Providing Thermoelectric Cooling And Methods For Cooling Such Integrated Circuit Structures
App 20150179543 - Tan; Juan Boon ; et al. | 2015-06-25 |
Tsv Without Zero Alignment Marks
App 20150170994 - GONG; Shunqiang ; et al. | 2015-06-18 |
Integrated Circuits Having Crack-stop Structures And Methods For Fabricating The Same
App 20150171025 - Shao; Wei ; et al. | 2015-06-18 |
Integrated Circuits With Dummy Contacts And Methods For Producing Such Integrated Circuits
App 20150171008 - Luo; Laiqiang ; et al. | 2015-06-18 |
Reliable Contacts
App 20150076669 - CHANG; Tian-Lin ; et al. | 2015-03-19 |
Logic Compatible Memory
App 20150069561 - TAN; Juan Boon ; et al. | 2015-03-12 |
Pad Solutions For Reliable Bonds
App 20150061156 - JIANG; Yi ; et al. | 2015-03-05 |
Dielectric posts in metal layers
Grant 8,957,523 - Zhang , et al. February 17, 2 | 2015-02-17 |
3d High Voltage Charge Pump
App 20150028407 - LUO; Laiqiang ; et al. | 2015-01-29 |
Crack-arresting structure for through-silicon vias
Grant 8,860,185 - Yuan , et al. October 14, 2 | 2014-10-14 |
Non-volatile Memory Device With Tsi/tsv Application
App 20140264235 - GONG; Shunqiang ; et al. | 2014-09-18 |
Device With Integrated Passive Component
App 20140264733 - YUAN; Shaoning ; et al. | 2014-09-18 |
Dielectric Posts In Metal Layers
App 20140191407 - ZHANG; Fan ; et al. | 2014-07-10 |
Back-side MOM/MIM devices
Grant 8,759,947 - Tan , et al. June 24, 2 | 2014-06-24 |
Device with integrated power supply
Grant 8,716,856 - Tan , et al. May 6, 2 | 2014-05-06 |
Device With Integrated Power Supply
App 20140035155 - TAN; Juan Boon ; et al. | 2014-02-06 |
Method For Forming Heat Sink With Through Silicon Vias
App 20130277810 - Tan; Juan Boon ; et al. | 2013-10-24 |
Back-side Mom/mim Devices
App 20130256834 - TAN; Juan Boon ; et al. | 2013-10-03 |
Poly profile engineering to modulate spacer induced stress for device enhancement
Grant 8,519,445 - Ho , et al. August 27, 2 | 2013-08-27 |
Crack-Arresting Structure for Through-Silicon Vias
App 20130187280 - Yuan; Shaoning ; et al. | 2013-07-25 |
TSV backside processing using copper damascene interconnect technology
Grant 8,466,062 - Lu , et al. June 18, 2 | 2013-06-18 |
TSV Backside Processing Using Copper Damascene Interconnect Technology
App 20130105968 - Lu; Yue Kang ; et al. | 2013-05-02 |
Integrated circuit system employing low-k dielectrics and method of manufacture thereof
Grant 8,358,007 - Sohn , et al. January 22, 2 | 2013-01-22 |
Reliable Interconnect Integration Scheme
App 20120168915 - DU; Luying ; et al. | 2012-07-05 |
Reliable interconnects
Grant 8,102,054 - Zhang , et al. January 24, 2 | 2012-01-24 |
Poly Profile Engineering To Modulate Spacer Induced Stress For Device Enhancement
App 20110266628 - HO; Vincent ; et al. | 2011-11-03 |
Poly profile engineering to modulate spacer induced stress for device enhancement
Grant 7,993,997 - Ho , et al. August 9, 2 | 2011-08-09 |
Integrated Circuit System Employing Low-k Dielectrics And Method Of Manufacture Thereof
App 20100314763 - Sohn; Dong Kyun ; et al. | 2010-12-16 |
Reliable Interconnects
App 20100314774 - ZHANG; Bei Chao ; et al. | 2010-12-16 |
Reliable interconnects
Grant 7,803,704 - Zhang , et al. September 28, 2 | 2010-09-28 |
Integrated circuit processing system
Grant 7,749,894 - Wang , et al. July 6, 2 | 2010-07-06 |
Reliable Interconnects
App 20100044869 - ZHANG; Bei Chao ; et al. | 2010-02-25 |
Integrated Circuit System Employing Alternating Conductive Layers
App 20100001370 - Sheng; Haifeng ; et al. | 2010-01-07 |
Implantation for shallow trench isolation (STI) formation and for stress for transistor performance enhancement
App 20090315115 - Zhang; Beichao ; et al. | 2009-12-24 |
Poly Profile Engineering To Modulate Spacer Induced Stress For Device Enhancement
App 20090085122 - Ho; Vincent ; et al. | 2009-04-02 |
Integrated Circuit Processing System
App 20080111238 - Wang; Xianbin ; et al. | 2008-05-15 |
Method to fabricate aligned dual damascene openings
Grant 7,372,156 - Lim , et al. May 13, 2 | 2008-05-13 |
Method of fabrication of a die oxide ring
Grant 7,276,440 - Zhang , et al. October 2, 2 | 2007-10-02 |
Integrated circuit with simultaneous fabrication of dual damascene via and trench
Grant 6,995,087 - Liu , et al. February 7, 2 | 2006-02-07 |
Method to fabricate aligned dual damascene openings
Grant 6,967,156 - Lim , et al. November 22, 2 | 2005-11-22 |
Method of fabrication of a die oxide ring
App 20050127495 - Zhang, Fan ; et al. | 2005-06-16 |
Method to fabricate aligned dual damascene openings
App 20050090095 - Lim, Yeow Kheng ; et al. | 2005-04-28 |
Integrated circuit with simultaneous fabrication of dual damascene via and trench
App 20040121585 - Liu, Wuping ; et al. | 2004-06-24 |
Intermetal dielectric layer for integrated circuits
App 20020130418 - Liu, Huang ; et al. | 2002-09-19 |
Alignment mark strategy for oxide CMP
App 20010001077 - Tan, Juan Boon ; et al. | 2001-05-10 |
Alignment mark strategy for oxide CMP
Grant 6,184,104 - Tan , et al. February 6, 2 | 2001-02-06 |
Printing optimized global alignment mark at contact/via layers
Grant 6,146,969 - Tan , et al. November 14, 2 | 2000-11-14 |
Preserving the zero mark for wafer alignment
Grant 6,054,361 - Tan , et al. April 25, 2 | 2000-04-25 |
Wafer stepper method utilizing a multi-segment global alignment mark
Grant 6,022,649 - Neoh , et al. February 8, 2 | 2000-02-08 |
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