Tan; Chee Voon

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tan; Chee Voon.The latest application filed is for "semiconductor package with lead tip inspection feature".

Company Profile

4.9.11

Tan; Chee Voon - Seremban MY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Double-sided cooled molded semiconductor package Grant 11,302,613 - Chiang , et al. April 12, 2	2022-04-12
Power semiconductor package and method for fabricating a power semiconductor package Grant 11,211,356 - Lim , et al. December 28, 2	2021-12-28
Semiconductor Package with Lead Tip Inspection Feature App 20210366732 - Chiang; Chau Fatt ; et al.	2021-11-25
Semiconductor Package And Method For Fabricating The Same App 20210313294 - Chiang; Chau Fatt ; et al.	2021-10-07
Power Semiconductor Package and Method for Fabricating a Power Semiconductor Package App 20210057375 - Lim; Wee Aun Jason ; et al.	2021-02-25
Molded Semiconductor Package with Double-Sided Cooling App 20210020547 - Chiang; Chau Fatt ; et al.	2021-01-21
Double-Sided Cooled Molded Semiconductor Package App 20210020550 - Chiang; Chau Fatt ; et al.	2021-01-21
Molded semiconductor package with double-sided cooling Grant 10,886,199 - Chiang , et al. January 5, 2	2021-01-05
Clip Frame Assembly, Semiconductor Package Having a Lead Frame and a Clip Frame, and Method of Manufacture App 20200273790 - Tay; Bun Kian ; et al.	2020-08-27
Semiconductor chip package having contact pins at short side edges Grant 10,037,934 - Otremba , et al. July 31, 2	2018-07-31
Semiconductor packages and methods of formation thereof Grant 9,478,484 - Otremba , et al. October 25, 2	2016-10-25
Semiconductor Chip Package Having Contact Pins at Short Side Edges App 20160233149 - Otremba; Ralf ; et al.	2016-08-11
Semiconductor device having multiple chips mounted to a carrier Grant 9,263,421 - Lee , et al. February 16, 2	2016-02-16
Semiconductor Device Having Multiple Chips Mounted to a Carrier App 20150249067 - Lee; Boon Seong ; et al.	2015-09-03
Electronic array and chip package Grant 9,111,772 - Strutz , et al. August 18, 2	2015-08-18
Electronic Array And Chip Package App 20150214297 - Strutz; Volker ; et al.	2015-07-30
Semiconductor Packages and Methods of Formation Thereof App 20140110828 - Otremba; Ralf ; et al.	2014-04-24
Semiconductor device with protruding component portion and method of packaging Grant 8,664,753 - Lee , et al. March 4, 2	2014-03-04
Semiconductor Device With Protruding Component Portion And Method Of Packaging App 20110121439 - Lee; Teck Sim ; et al.	2011-05-26

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