Tan; Boon Seng
Patent Applications and Registrations
Patent applications and USPTO patent grants for Tan; Boon Seng.The latest application filed is for "windowed package for electronic circuitry".
- Tan; Boon Seng - Penang MY
| Patent | Date |
|---|---|
| IC package pressure release apparatus and method Grant 7,242,088 - Neogi , et al. July 10, 2 | 2007-07-10 |
| Windowed package for electronic circuitry Grant 7,220,624 - Neogi , et al. May 22, 2 | 2007-05-22 |
| Windowed package for electronic circuitry App 20050253254 - Neogi, Sudipto ; et al. | 2005-11-17 |
| IC package pressure release apparatus and method App 20020084532 - Neogi, Sudipto ; et al. | 2002-07-04 |
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