Tan; Ai Min
Patent Applications and Registrations
Patent applications and USPTO patent grants for Tan; Ai Min.The latest application filed is for "system and method for an electronic package with a fail-open mechanism".
- Tan; Ai Min - Singapore N/A SG
- Tan; Ai Min - Dunbar Walk SG
| Patent | Date |
|---|---|
| System and method for an electronic package with a fail-open mechanism Grant 8,816,390 - Marbella , et al. August 26, 2 | 2014-08-26 |
| System And Method For An Electronic Package With A Fail-open Mechanism App 20130194752 - Marbella; Carlo Baterna ; et al. | 2013-08-01 |
| Magnetically alignable integrated circuit device Grant 7,994,608 - Tan , et al. August 9, 2 | 2011-08-09 |
| Semiconductor chip with flip chip contacts and a passivation layer with varying thickness portions surrounding contact surfaces of the semiconductor chip Grant 7,768,137 - Ofner , et al. August 3, 2 | 2010-08-03 |
| Magnetically Alignable Integrated Circuit Device App 20080265367 - Tan; Ai Min ; et al. | 2008-10-30 |
| Semiconductor chip with flip chip contacts, and method for producing semiconductor chip with flip chip contacts App 20060270163 - Ofner; Gerald ; et al. | 2006-11-30 |
| Attachment of flip chips to substrates App 20060115927 - Yeo; Swain Hong Alfred ; et al. | 2006-06-01 |
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