TAMURA; Tomoko

Patent Applications and Registrations

Patent applications and USPTO patent grants for TAMURA; Tomoko.The latest application filed is for "method of producing additively manufactured object and additively manufactured object".

Company Profile

1.19.22

TAMURA; Tomoko - Tokyo JP
TAMURA; Tomoko - Kasugai-shi Aichi
Tamura; Tomoko - Atsugi JP
Tamura; Tomoko - Kanagawa JP
Tamura, Tomoko - Atsugi-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method Of Producing Additively Manufactured Object And Additively Manufactured Object App 20210331247 - TACHIBANA; Takahiro ; et al.	2021-10-28
Method Of Manufacturing Metal Member App 20210040594 - TAMURA; Tomoko ; et al.	2021-02-11
Oxide Film Removing Method App 20180135186 - SASAKI; Wataru ; et al.	2018-05-17
Method for manufacturing semiconductor device Grant 9,941,115 - Tamura , et al. April 10, 2	2018-04-10
Information Provision System App 20150049900 - Kamitani; Motoki ; et al.	2015-02-19
Wireless chip and manufacturing method thereof Grant 8,790,994 - Dairiki , et al. July 29, 2	2014-07-29
Method For Manufacturing Semiconductor Device App 20130323912 - TAMURA; Tomoko ; et al.	2013-12-05
Method for manufacturing semiconductor device Grant 8,530,335 - Tamura , et al. September 10, 2	2013-09-10
Wireless Chip And Manufacturing Method Thereof App 20120322212 - DAIRIKI; Koji ; et al.	2012-12-20
Wireless chip and manufacturing method thereof Grant 8,288,773 - Dairiki , et al. October 16, 2	2012-10-16
Method for manufacturing thin film integrated circuit, and element substrate Grant 8,236,629 - Dozen , et al. August 7, 2	2012-08-07
Manufacturing method of semiconductor device including peeling step Grant 8,030,132 - Ogita , et al. October 4, 2	2011-10-04
Method For Manufacturing Thin Film Integrated Circuit, And Element Substrate App 20110207292 - DOZEN; Yoshitaka ; et al.	2011-08-25
Aqueous Dispersion Of Fine Carbon Fibers, Method For Preparing The Aqueous Dispersion, And Articles Using Thereof App 20110198543 - Tarumoto; Naohiro ; et al.	2011-08-18
Method For Manufacturing Semiconductor Device App 20110171778 - TAMURA; Tomoko ; et al.	2011-07-14
Method for manufacturing thin film integrated circuit, and element substrate Grant 7,939,385 - Dozen , et al. May 10, 2	2011-05-10
Method for manufacturing semiconductor device Grant 7,927,971 - Tamura , et al. April 19, 2	2011-04-19
Method for manufacturing semiconductor device Grant 7,875,530 - Tamura , et al. January 25, 2	2011-01-25
Method for manufacturing semiconductor device Grant 7,704,765 - Maruyama , et al. April 27, 2	2010-04-27
Method for manufacturing semiconductor device, and semiconductor device Grant 7,588,969 - Ogita , et al. September 15, 2	2009-09-15
Method for manufacturing a semiconductor device Grant 7,534,702 - Arao , et al. May 19, 2	2009-05-19
Manufacturing method of semiconductor device Grant 7,504,317 - Aoki , et al. March 17, 2	2009-03-17
Method For Manufacturing Thin Film Integrated Circuit, And Element Substrate App 20090050964 - DOZEN; Yoshitaka ; et al.	2009-02-26
Manufacturing method of semiconductor device Grant 7,482,248 - Tamura January 27, 2	2009-01-27
Manufacturing method of semiconductor device Grant 7,465,674 - Tamura , et al. December 16, 2	2008-12-16
Method for manufacturing thin film integrated circuit, and element substrate Grant 7,452,786 - Dozen , et al. November 18, 2	2008-11-18
Wireless Chip And Manufacturing Method Thereof App 20080093464 - Dairiki; Koji ; et al.	2008-04-24
Method for manufacturing semiconductor device App 20070292997 - Maruyama; Junya ; et al.	2007-12-20
Method for manufacturing semiconductor device Grant 7,282,380 - Maruyama , et al. October 16, 2	2007-10-16
Method For Manufacturing Semiconductor Device App 20070196999 - Tamura; Tomoko ; et al.	2007-08-23
Method for manufacturing semiconductor device App 20070128747 - Tamura; Tomoko ; et al.	2007-06-07
Manufacturing method of semiconductor device App 20070128833 - Aoki; Tomoyuki ; et al.	2007-06-07
Method for manufacturing semiconductor device, and semiconductor device App 20060266410 - Ogita; Kaori ; et al.	2006-11-30
Manufacturing method of semiconductor device App 20060270191 - Tamura; Tomoko ; et al.	2006-11-30
Manufacturing method of semiconductor device including peeling step and semiconductor device using the same App 20060270189 - Ogita; Kaori ; et al.	2006-11-30
Manufacturing method of semiconductor device App 20060121694 - Tamura; Tomoko	2006-06-08
Method for manufacturing thin film integrated circuit, and element substrate App 20050287846 - Dozen, Yoshitaka ; et al.	2005-12-29
Semiconductor device and method for manufacturing the same App 20050285231 - Arao, Tatsuya ; et al.	2005-12-29
Method for manufacturing semiconductor device App 20050214984 - Maruyama, Junya ; et al.	2005-09-29

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