Tamura; Muneo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tamura; Muneo.The latest application filed is for "chip and method for dicing wafer into chips".

Company Profile

0.10.11

Tamura; Muneo - Nagoya JP
Tamura; Muneo - Nagoya-city JP
Tamura; Muneo - Kariya JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Laser processing apparatus and laser processing method Grant 7,968,432 - Tamura , et al. June 28, 2	2011-06-28
Dicing method for semiconductor substrate Grant 7,901,967 - Komura , et al. March 8, 2	2011-03-08
Method for dicing semiconductor substrate Grant 7,838,331 - Komura , et al. November 23, 2	2010-11-23
Wafer and wafer cutting and dividing method Grant 7,763,526 - Tamura , et al. July 27, 2	2010-07-27
Method for separating a semiconductor substrate into a plurality of chips along with a cutting line on the semiconductor substrate Grant 7,662,668 - Sugiura , et al. February 16, 2	2010-02-16
Method of manufacturing semiconductor sensor Grant 7,598,118 - Sugiura , et al. October 6, 2	2009-10-06
Method for separating semiconductor substrate Grant 7,550,367 - Tamura , et al. June 23, 2	2009-06-23
Chip and method for dicing wafer into chips Grant 7,498,238 - Tamura March 3, 2	2009-03-03
Chip and method for dicing wafer into chips App 20070207594 - Tamura; Muneo	2007-09-06
Laser processing apparatus and laser processing method App 20070202619 - Tamura; Muneo ; et al.	2007-08-30
Method of manufacturing semiconductor sensor App 20070117260 - Sugiura; Kazuhiko ; et al.	2007-05-24
Semiconductor device and dicing method for semiconductor substrate App 20070111478 - Komura; Atsushi ; et al.	2007-05-17
Wafer and wafer cutting and dividing method App 20070111481 - Tamura; Muneo ; et al.	2007-05-17
Separating device for separating semiconductor substrate and method for separating the same App 20070111476 - Sugiura; Kazuhiko ; et al.	2007-05-17
Semiconductor device and method for processing wafer App 20070111390 - Komura; Atsushi ; et al.	2007-05-17
Dicing sheet frame App 20070111484 - Komura; Atsushi ; et al.	2007-05-17
Wafer product and processing method therefor App 20070111480 - Maruyama; Yumi ; et al.	2007-05-17
Semiconductor wafer having multiple semiconductor elements and method for dicing the same App 20060220183 - Asai; Makoto ; et al.	2006-10-05
Method for separating semiconductor substrate App 20060040472 - Tamura; Muneo ; et al.	2006-02-23
Method of fabricating a semiconductor device having a silicon nitride film made of silane, ammonia and nitrogen Grant 5,877,095 - Tamura , et al. March 2, 1	1999-03-02
Silicon nitride film having a short absorption wavelength and surrounding crystal-like grain boundaries Grant 5,592,004 - Tamura , et al. January 7, 1	1997-01-07

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