Tamura; Koetsu
Patent Applications and Registrations
Patent applications and USPTO patent grants for Tamura; Koetsu.The latest application filed is for "electronic circuit package assembly and method of producing the same".
- Tamura; Koetsu - Tokyo JP
| Patent | Date |
|---|---|
| Electronic device structure capable of preventing malfunction caused by electromagnetic wave coming from outside Grant 6,472,724 - Matsuzawa , et al. October 29, 2 | 2002-10-29 |
| Electronic Circuit Package Assembly And Method Of Producing The Same App 20010014016 - TAMURA, KOETSU | 2001-08-16 |
| Electronic-circuit assembly Grant 6,208,022 - Tamura March 27, 2 | 2001-03-27 |
| Electronic assembly package including connecting member between first and second substrates Grant 5,896,276 - Tamura , et al. April 20, 1 | 1999-04-20 |
| Seal structure for tape carrier package Grant 5,814,882 - Shimada , et al. September 29, 1 | 1998-09-29 |
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