TAMURA KAKEN CORPORATION

Patent Applications and Registrations

Patent applications and USPTO patent grants for TAMURA KAKEN CORPORATION.The latest application filed is for "method of removing lead, reclaimed metals and reclaimed products".

Company Profile

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TAMURA KAKEN CORPORATION - Iruma-Shi JP
Tamura Kaken Corporation - Saitama JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of removing lead, reclaimed metals and reclaimed products App 20100112361 - Kurita; Satoru ; et al.	2010-05-06
Thermosetting resin compositions, resin films and film articles App 20050197425 - Suzuki, Tetsuaki ; et al.	2005-09-08
Thermosetting resin compositions and film articles App 20050181215 - Suzuki, Tetsuaki ; et al.	2005-08-18
Surface treatment agents for metal films of printed circuit boards App 20050173678 - Miura, Ichiro ; et al.	2005-08-11
Method of manufacturing fine metal particles, substance containing fine metal particles, and paste solder composition App 20040211291 - Ono, Takao ; et al.	2004-10-28
Lead-free solder, and paste solder composition Grant 6,726,780 - Ono , et al. April 27, 2	2004-04-27
Photosensitive resin composition and printed wiring board App 20030068567 - Ono, Takao ; et al.	2003-04-10
Method of manufacturing fine metal particles, substance containing fine metal particles, and paste solder composition App 20030047034 - Ono, Takao ; et al.	2003-03-13
Active energy beam curable composition and printed wiring board Grant 6,475,701 - Ohno , et al. November 5, 2	2002-11-05

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