Tamogami; Tsuyoshi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Tamogami; Tsuyoshi.The latest application filed is for "aqueous bonding composition".
- Tamogami; Tsuyoshi - Osaka JP
| Patent | Date |
|---|---|
| Moisture-curable hot melt adhesive Grant 11,236,257 - Matsuda , et al. February 1, 2 | 2022-02-01 |
| Aqueous Bonding Composition App 20200199416 - TAMOGAMI; Tsuyoshi ; et al. | 2020-06-25 |
| Aqueous bonding composition Grant 10,611,049 - Tamogami , et al. | 2020-04-07 |
| Aqueous Bonding Composition App 20190009427 - TAMOGAMI; Tsuyoshi ; et al. | 2019-01-10 |
| Aqueous Bonding Composition App 20180305588 - TAMOGAMI; Tsuyoshi ; et al. | 2018-10-25 |
| Moisture-Curable Hot Melt Adhesive App 20180298254 - Matsuda; Kenji ; et al. | 2018-10-18 |
| Moisture-curable Hot-melt Adhesive Agent App 20150376480 - Tamogami; Tsuyoshi ; et al. | 2015-12-31 |
| Moisture-curable Hot Melt Adhesive App 20140272425 - Tamogami; Tsuyoshi | 2014-09-18 |
| Moisture-curable Hot Melt Adhesive App 20140024781 - Tamogami; Tsuyoshi ; et al. | 2014-01-23 |
| Moisture-curable Hot Melt Adhesive App 20130345354 - Tamogami; Tsuyoshi ; et al. | 2013-12-26 |
| Moisture-curable hot melt adhesive Grant 8,324,299 - Yamakoshi , et al. December 4, 2 | 2012-12-04 |
| Moisture-curable Hot Melt Adhesive App 20120283370 - Tamogami; Tsuyoshi ; et al. | 2012-11-08 |
| Moisture-curable Hot Melt Adhesive App 20110275767 - Yamakoshi; Hideyuki ; et al. | 2011-11-10 |
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